TW200703497A - A method for local wafer thinning and reinforcement - Google Patents
A method for local wafer thinning and reinforcementInfo
- Publication number
- TW200703497A TW200703497A TW095118724A TW95118724A TW200703497A TW 200703497 A TW200703497 A TW 200703497A TW 095118724 A TW095118724 A TW 095118724A TW 95118724 A TW95118724 A TW 95118724A TW 200703497 A TW200703497 A TW 200703497A
- Authority
- TW
- Taiwan
- Prior art keywords
- die
- area
- insert
- reinforcement
- wafer thinning
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/32—Polishing; Etching
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2898—Sample preparation, e.g. removing encapsulation, etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/977—Thinning or removal of substrate
Landscapes
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Immunology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Pathology (AREA)
- Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/139,706 US7314767B2 (en) | 2005-05-27 | 2005-05-27 | Method for local wafer thinning and reinforcement |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200703497A true TW200703497A (en) | 2007-01-16 |
Family
ID=36916069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095118724A TW200703497A (en) | 2005-05-27 | 2006-05-26 | A method for local wafer thinning and reinforcement |
Country Status (4)
Country | Link |
---|---|
US (1) | US7314767B2 (zh) |
EP (1) | EP1726968A3 (zh) |
JP (1) | JP2007013124A (zh) |
TW (1) | TW200703497A (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008075970A1 (en) * | 2006-12-19 | 2008-06-26 | Rec Scanwafer As | Method and device for se aration of silicon wafers |
US8048775B2 (en) * | 2007-07-20 | 2011-11-01 | Alpha And Omega Semiconductor Incorporated | Process of forming ultra thin wafers having an edge support ring |
US20100013041A1 (en) * | 2008-07-15 | 2010-01-21 | Micron Technology, Inc. | Microelectronic imager packages with covers having non-planar surface features |
US8248097B2 (en) * | 2009-04-02 | 2012-08-21 | International Business Machines Corporation | Method and apparatus for probing a wafer |
US20140061864A1 (en) * | 2012-09-04 | 2014-03-06 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor substrate having crack preventing structure and method of manufacturing the same |
JP2014093420A (ja) * | 2012-11-02 | 2014-05-19 | Toyota Motor Corp | ウェハを支持ディスクに接着する治具、および、それを用いた半導体装置の製造方法 |
CN103029047B (zh) * | 2012-12-06 | 2016-03-02 | 苏州远东砂轮有限公司 | 一种涂附磨具横截面的制造方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1472167A1 (de) | 1965-11-26 | 1969-01-09 | Leitz Ernst Gmbh | Mikroskop-Immersionsobjektiv |
GB1281611A (en) | 1970-02-10 | 1972-07-12 | Vickers Ltd | Apochromatic microscope objectives |
JPS5141355B2 (zh) | 1973-02-08 | 1976-11-09 | ||
DD215640A1 (de) | 1983-05-02 | 1984-11-14 | Zeiss Jena Veb Carl | Frontlinsengruppe fuer immersionsmikroskopobjektiv in hd-ausfuehrung mit hoher apertur |
US5004307A (en) | 1990-04-12 | 1991-04-02 | The Board Of Trustees Of The Leland Stanford Junior University | Near field and solid immersion optical microscope |
US5208648A (en) | 1991-03-11 | 1993-05-04 | International Business Machines Corporation | Apparatus and a method for high numerical aperture microscopic examination of materials |
US5220403A (en) | 1991-03-11 | 1993-06-15 | International Business Machines Corporation | Apparatus and a method for high numerical aperture microscopic examination of materials |
US5282088A (en) | 1992-10-19 | 1994-01-25 | Mark Davidson | Aplanatic microlens and method for making same |
US5475316A (en) | 1993-12-27 | 1995-12-12 | Hypervision, Inc. | Transportable image emission microscope |
US5940545A (en) | 1996-07-18 | 1999-08-17 | International Business Machines Corporation | Noninvasive optical method for measuring internal switching and other dynamic parameters of CMOS circuits |
US6591121B1 (en) | 1996-09-10 | 2003-07-08 | Xoetronics Llc | Measurement, data acquisition, and signal processing |
US6252412B1 (en) | 1999-01-08 | 2001-06-26 | Schlumberger Technologies, Inc. | Method of detecting defects in patterned substrates |
US6462814B1 (en) | 2000-03-15 | 2002-10-08 | Schlumberger Technologies, Inc. | Beam delivery and imaging for optical probing of a device operating under electrical test |
US6720588B2 (en) | 2001-11-28 | 2004-04-13 | Optonics, Inc. | Avalanche photodiode for photon counting applications and method thereof |
US6621275B2 (en) | 2001-11-28 | 2003-09-16 | Optonics Inc. | Time resolved non-invasive diagnostics system |
US6594086B1 (en) | 2002-01-16 | 2003-07-15 | Optonics, Inc. (A Credence Company) | Bi-convex solid immersion lens |
US6921719B2 (en) * | 2002-10-31 | 2005-07-26 | Strasbaugh, A California Corporation | Method of preparing whole semiconductor wafer for analysis |
-
2005
- 2005-05-27 US US11/139,706 patent/US7314767B2/en not_active Expired - Fee Related
-
2006
- 2006-05-26 TW TW095118724A patent/TW200703497A/zh unknown
- 2006-05-29 JP JP2006148807A patent/JP2007013124A/ja active Pending
- 2006-05-29 EP EP06010975A patent/EP1726968A3/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
JP2007013124A (ja) | 2007-01-18 |
US20060267009A1 (en) | 2006-11-30 |
EP1726968A2 (en) | 2006-11-29 |
US7314767B2 (en) | 2008-01-01 |
EP1726968A3 (en) | 2009-04-15 |
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