TW200702925A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
TW200702925A
TW200702925A TW095109885A TW95109885A TW200702925A TW 200702925 A TW200702925 A TW 200702925A TW 095109885 A TW095109885 A TW 095109885A TW 95109885 A TW95109885 A TW 95109885A TW 200702925 A TW200702925 A TW 200702925A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
formula
group
poly
Prior art date
Application number
TW095109885A
Other languages
Chinese (zh)
Other versions
TWI374335B (en
Inventor
Tetsuo Nakanishi
Michihiro Sugo
Akira Yamamoto
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200702925A publication Critical patent/TW200702925A/en
Application granted granted Critical
Publication of TWI374335B publication Critical patent/TWI374335B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Polyethers (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

To provide a photosensitive resin composition containing a leveling agent for a photosensitive resin composition, the agent having excellent compatibility with a solvent for a photosensitive resin composition, high ability of reducing surface tension and of smoothening a surface, and high safeness. This composition contains a (poly)glycerin-modified silicone having a structural unit (A) expressed by formula (1) which is an organopolysiloxane residue and a structural unit (B) expressed by formula (2) which is a (poly)glycerin derivative residue, bonded to produce a structure of A-B-A, by 0.01 to 20 wt.%. In formula (1), R1 independently represents a 1-10C alkyl group, cycloalkyl group, aryl group or aralkyl group which may be substituted with a halogen atom, x is an integer of 0 to 100, α is 1 or 2; and in formula (2), R2 independently represents a 2-11C alkylene group and s is an integer of 1 to 11.
TW095109885A 2005-03-23 2006-03-22 Photosensitive resin composition TW200702925A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005083940A JP4466855B2 (en) 2005-03-23 2005-03-23 Positive resist composition

Publications (2)

Publication Number Publication Date
TW200702925A true TW200702925A (en) 2007-01-16
TWI374335B TWI374335B (en) 2012-10-11

Family

ID=37203478

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095109885A TW200702925A (en) 2005-03-23 2006-03-22 Photosensitive resin composition

Country Status (3)

Country Link
JP (1) JP4466855B2 (en)
KR (1) KR101258704B1 (en)
TW (1) TW200702925A (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4967687B2 (en) * 2007-01-29 2012-07-04 東レ株式会社 Photosensitive siloxane composition, cured film formed therefrom, and device having cured film
JP5795212B2 (en) * 2011-07-29 2015-10-14 信越化学工業株式会社 Novel block-type organopolysiloxane and cosmetic containing the same
JP6371666B2 (en) * 2014-10-10 2018-08-08 株式会社カネカ Positive photosensitive composition
CN118813028A (en) * 2016-04-26 2024-10-22 信越化学工业株式会社 Polyoxyalkylene compound containing terminal silanol group and method for producing the same, room temperature curable composition, sealing material and article
JP6870657B2 (en) * 2018-05-17 2021-05-12 信越化学工業株式会社 Photosensitive resin composition, photosensitive dry film, and pattern forming method
JP7335217B2 (en) * 2020-09-24 2023-08-29 信越化学工業株式会社 Photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, surface protective film, and electronic component
JP7738881B2 (en) * 2021-05-20 2025-09-16 阪本薬品工業株式会社 Coating composition containing (poly)glycerin-based monomer
WO2022244859A1 (en) * 2021-05-20 2022-11-24 阪本薬品工業株式会社 Glass component
WO2024203259A1 (en) * 2023-03-27 2024-10-03 信越化学工業株式会社 Organopolysiloxane, dispersion, and cosmetic product

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1935924B1 (en) * 2002-09-12 2012-06-06 Shin-Etsu Chemical Company, Ltd. Pasty composition, and cosmetic preparation containing the same
JP4429812B2 (en) * 2004-06-07 2010-03-10 信越化学工業株式会社 ABA type glycerin modified silicone
JP4567584B2 (en) * 2005-01-17 2010-10-20 株式会社資生堂 Powder dispersion stabilizer and powder dispersion composition containing the same

Also Published As

Publication number Publication date
JP4466855B2 (en) 2010-05-26
KR101258704B1 (en) 2013-04-26
JP2006267401A (en) 2006-10-05
KR20060103132A (en) 2006-09-28
TWI374335B (en) 2012-10-11

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