TW200701483A - Tape and device for cof package - Google Patents
Tape and device for cof packageInfo
- Publication number
- TW200701483A TW200701483A TW094120222A TW94120222A TW200701483A TW 200701483 A TW200701483 A TW 200701483A TW 094120222 A TW094120222 A TW 094120222A TW 94120222 A TW94120222 A TW 94120222A TW 200701483 A TW200701483 A TW 200701483A
- Authority
- TW
- Taiwan
- Prior art keywords
- tape
- wiring layer
- solder resist
- chip
- leads
- Prior art date
Links
Abstract
A tape for COF (Chip-On-Film) package is disclosed, which mainly includes a flexible dielectric substrate, a wiring layer and a solder resist. The wiring layer includes a plurality of bumped pads with upset configuration such that the bonding surfaces of the bumped pads are higher than upper surfaces of leads of the wiring layer and the solder resist. Accordingly, the solder resist will not flow to cover the bonding surfaces when formed on the flexible dielectric substrate and covering upper surfaces of leads. The bondability of the bumped pads to bumps on chip can be improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94120222A TWI263346B (en) | 2005-06-17 | 2005-06-17 | Tape and device for COF package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94120222A TWI263346B (en) | 2005-06-17 | 2005-06-17 | Tape and device for COF package |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI263346B TWI263346B (en) | 2006-10-01 |
TW200701483A true TW200701483A (en) | 2007-01-01 |
Family
ID=37966343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94120222A TWI263346B (en) | 2005-06-17 | 2005-06-17 | Tape and device for COF package |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI263346B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI474451B (en) * | 2011-09-15 | 2015-02-21 | Chipmos Technologies Inc | Flip chip package sturcture and forming method thereof |
-
2005
- 2005-06-17 TW TW94120222A patent/TWI263346B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI474451B (en) * | 2011-09-15 | 2015-02-21 | Chipmos Technologies Inc | Flip chip package sturcture and forming method thereof |
Also Published As
Publication number | Publication date |
---|---|
TWI263346B (en) | 2006-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |