TW200701483A - Tape and device for cof package - Google Patents

Tape and device for cof package

Info

Publication number
TW200701483A
TW200701483A TW094120222A TW94120222A TW200701483A TW 200701483 A TW200701483 A TW 200701483A TW 094120222 A TW094120222 A TW 094120222A TW 94120222 A TW94120222 A TW 94120222A TW 200701483 A TW200701483 A TW 200701483A
Authority
TW
Taiwan
Prior art keywords
tape
wiring layer
solder resist
chip
leads
Prior art date
Application number
TW094120222A
Other languages
Chinese (zh)
Other versions
TWI263346B (en
Inventor
Men-Shew Liu
Hao-Shin Wang
Original Assignee
Chipmos Technologies Inc
Chipmos Technologies Bermuda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc, Chipmos Technologies Bermuda filed Critical Chipmos Technologies Inc
Priority to TW94120222A priority Critical patent/TWI263346B/en
Application granted granted Critical
Publication of TWI263346B publication Critical patent/TWI263346B/en
Publication of TW200701483A publication Critical patent/TW200701483A/en

Links

Abstract

A tape for COF (Chip-On-Film) package is disclosed, which mainly includes a flexible dielectric substrate, a wiring layer and a solder resist. The wiring layer includes a plurality of bumped pads with upset configuration such that the bonding surfaces of the bumped pads are higher than upper surfaces of leads of the wiring layer and the solder resist. Accordingly, the solder resist will not flow to cover the bonding surfaces when formed on the flexible dielectric substrate and covering upper surfaces of leads. The bondability of the bumped pads to bumps on chip can be improved.
TW94120222A 2005-06-17 2005-06-17 Tape and device for COF package TWI263346B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94120222A TWI263346B (en) 2005-06-17 2005-06-17 Tape and device for COF package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94120222A TWI263346B (en) 2005-06-17 2005-06-17 Tape and device for COF package

Publications (2)

Publication Number Publication Date
TWI263346B TWI263346B (en) 2006-10-01
TW200701483A true TW200701483A (en) 2007-01-01

Family

ID=37966343

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94120222A TWI263346B (en) 2005-06-17 2005-06-17 Tape and device for COF package

Country Status (1)

Country Link
TW (1) TWI263346B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI474451B (en) * 2011-09-15 2015-02-21 Chipmos Technologies Inc Flip chip package sturcture and forming method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI474451B (en) * 2011-09-15 2015-02-21 Chipmos Technologies Inc Flip chip package sturcture and forming method thereof

Also Published As

Publication number Publication date
TWI263346B (en) 2006-10-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees