TW200701314A - Method of processing semiconductor wafer - Google Patents

Method of processing semiconductor wafer

Info

Publication number
TW200701314A
TW200701314A TW094120734A TW94120734A TW200701314A TW 200701314 A TW200701314 A TW 200701314A TW 094120734 A TW094120734 A TW 094120734A TW 94120734 A TW94120734 A TW 94120734A TW 200701314 A TW200701314 A TW 200701314A
Authority
TW
Taiwan
Prior art keywords
semiconductor wafer
processing semiconductor
deviation
processed
measured value
Prior art date
Application number
TW094120734A
Other languages
Chinese (zh)
Other versions
TWI316266B (en
Inventor
Hong Ma
Mei-Sheng Zhou
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW94120734A priority Critical patent/TWI316266B/en
Publication of TW200701314A publication Critical patent/TW200701314A/en
Application granted granted Critical
Publication of TWI316266B publication Critical patent/TWI316266B/en

Links

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  • Drying Of Semiconductors (AREA)

Abstract

A method of processing semiconductor wafer is provided. First, a semiconductor wafer is processed with a first process. Then, collecting the measured value display the deviation everywhere on the semiconductor wafer. Then, according to the measured value, the semiconductor wafer is processed with a second process to compensate the deviation from the first process. Therefore, the method could correct the process deviation in the same semiconductor wafer.
TW94120734A 2005-06-22 2005-06-22 Method of processing semiconductor wafer TWI316266B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94120734A TWI316266B (en) 2005-06-22 2005-06-22 Method of processing semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94120734A TWI316266B (en) 2005-06-22 2005-06-22 Method of processing semiconductor wafer

Publications (2)

Publication Number Publication Date
TW200701314A true TW200701314A (en) 2007-01-01
TWI316266B TWI316266B (en) 2009-10-21

Family

ID=45073221

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94120734A TWI316266B (en) 2005-06-22 2005-06-22 Method of processing semiconductor wafer

Country Status (1)

Country Link
TW (1) TWI316266B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI410822B (en) * 2009-03-03 2013-10-01 Taiwan Semiconductor Mfg Advanced process control method and system
CN113223955A (en) * 2021-05-08 2021-08-06 长鑫存储技术有限公司 Automatic complementary etching method and device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI410822B (en) * 2009-03-03 2013-10-01 Taiwan Semiconductor Mfg Advanced process control method and system
CN113223955A (en) * 2021-05-08 2021-08-06 长鑫存储技术有限公司 Automatic complementary etching method and device
CN113223955B (en) * 2021-05-08 2022-05-27 长鑫存储技术有限公司 Automatic complementary etching method and device

Also Published As

Publication number Publication date
TWI316266B (en) 2009-10-21

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