TW200701314A - Method of processing semiconductor wafer - Google Patents
Method of processing semiconductor waferInfo
- Publication number
- TW200701314A TW200701314A TW094120734A TW94120734A TW200701314A TW 200701314 A TW200701314 A TW 200701314A TW 094120734 A TW094120734 A TW 094120734A TW 94120734 A TW94120734 A TW 94120734A TW 200701314 A TW200701314 A TW 200701314A
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor wafer
- processing semiconductor
- deviation
- processed
- measured value
- Prior art date
Links
Landscapes
- Drying Of Semiconductors (AREA)
Abstract
A method of processing semiconductor wafer is provided. First, a semiconductor wafer is processed with a first process. Then, collecting the measured value display the deviation everywhere on the semiconductor wafer. Then, according to the measured value, the semiconductor wafer is processed with a second process to compensate the deviation from the first process. Therefore, the method could correct the process deviation in the same semiconductor wafer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94120734A TWI316266B (en) | 2005-06-22 | 2005-06-22 | Method of processing semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94120734A TWI316266B (en) | 2005-06-22 | 2005-06-22 | Method of processing semiconductor wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200701314A true TW200701314A (en) | 2007-01-01 |
TWI316266B TWI316266B (en) | 2009-10-21 |
Family
ID=45073221
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94120734A TWI316266B (en) | 2005-06-22 | 2005-06-22 | Method of processing semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI316266B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI410822B (en) * | 2009-03-03 | 2013-10-01 | Taiwan Semiconductor Mfg | Advanced process control method and system |
CN113223955A (en) * | 2021-05-08 | 2021-08-06 | 长鑫存储技术有限公司 | Automatic complementary etching method and device |
-
2005
- 2005-06-22 TW TW94120734A patent/TWI316266B/en active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI410822B (en) * | 2009-03-03 | 2013-10-01 | Taiwan Semiconductor Mfg | Advanced process control method and system |
CN113223955A (en) * | 2021-05-08 | 2021-08-06 | 长鑫存储技术有限公司 | Automatic complementary etching method and device |
CN113223955B (en) * | 2021-05-08 | 2022-05-27 | 长鑫存储技术有限公司 | Automatic complementary etching method and device |
Also Published As
Publication number | Publication date |
---|---|
TWI316266B (en) | 2009-10-21 |
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