TW200701313A - Polysilicon thin-film transistors and fabricating method thereof - Google Patents
Polysilicon thin-film transistors and fabricating method thereofInfo
- Publication number
- TW200701313A TW200701313A TW094120555A TW94120555A TW200701313A TW 200701313 A TW200701313 A TW 200701313A TW 094120555 A TW094120555 A TW 094120555A TW 94120555 A TW94120555 A TW 94120555A TW 200701313 A TW200701313 A TW 200701313A
- Authority
- TW
- Taiwan
- Prior art keywords
- gate
- substrate
- active area
- layer
- fabricating method
- Prior art date
Links
Landscapes
- Thin Film Transistor (AREA)
- Recrystallisation Techniques (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
A fabricating method of polysilicon thin-film transistor is provided. First, a substrate is provided. An patterned amorphous-silicon layer used as an active area is formed on the substrate. A gate and an insulating layer are formed on the substrate in sequence, and a crystallization window and multiple contact windows are formed in the insulating layer. A metal-induced-lateral crystallization is performed to transform the amorphous-silicon layer into a polysilicon layer. Thereafter, an ion implantation is performed to implant ions into the gate and active area beside. A metal layer is formed on the substrate and defined as many metal contacts by photolithography and etching process. The metal contacts are electrically connected to the gate and the active area beside the gate through the contact windows, respectively. Because the formations of the crystallization window and the contact window are performed in the same process step, the process cost is reduced substantially.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94120555A TWI279840B (en) | 2005-06-21 | 2005-06-21 | Polysilicon thin-film transistors and fabricating method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94120555A TWI279840B (en) | 2005-06-21 | 2005-06-21 | Polysilicon thin-film transistors and fabricating method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200701313A true TW200701313A (en) | 2007-01-01 |
TWI279840B TWI279840B (en) | 2007-04-21 |
Family
ID=38645522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94120555A TWI279840B (en) | 2005-06-21 | 2005-06-21 | Polysilicon thin-film transistors and fabricating method thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI279840B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI381501B (en) * | 2009-01-17 | 2013-01-01 | Univ Ishou | An isolation layer substrate with metal ion migration and its encapsulation structure |
TWI596817B (en) * | 2009-12-23 | 2017-08-21 | 三星顯示器有限公司 | Vapor deposition apparatus having improved carrier gas supplying structure and method of manufacturing an organic light emitting display apparatus by using the vapor deposition apparatus |
-
2005
- 2005-06-21 TW TW94120555A patent/TWI279840B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI381501B (en) * | 2009-01-17 | 2013-01-01 | Univ Ishou | An isolation layer substrate with metal ion migration and its encapsulation structure |
TWI596817B (en) * | 2009-12-23 | 2017-08-21 | 三星顯示器有限公司 | Vapor deposition apparatus having improved carrier gas supplying structure and method of manufacturing an organic light emitting display apparatus by using the vapor deposition apparatus |
Also Published As
Publication number | Publication date |
---|---|
TWI279840B (en) | 2007-04-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |