TW200700965A - Cooling module and control method of cooling wind thereof - Google Patents

Cooling module and control method of cooling wind thereof

Info

Publication number
TW200700965A
TW200700965A TW094121504A TW94121504A TW200700965A TW 200700965 A TW200700965 A TW 200700965A TW 094121504 A TW094121504 A TW 094121504A TW 94121504 A TW94121504 A TW 94121504A TW 200700965 A TW200700965 A TW 200700965A
Authority
TW
Taiwan
Prior art keywords
wind
cooling
cooling module
heat source
control method
Prior art date
Application number
TW094121504A
Other languages
English (en)
Other versions
TWI269147B (en
Inventor
Hsiang-Chao Liu
Original Assignee
Quanta Comp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quanta Comp Inc filed Critical Quanta Comp Inc
Priority to TW094121504A priority Critical patent/TWI269147B/zh
Priority to US11/270,513 priority patent/US8267758B2/en
Application granted granted Critical
Publication of TWI269147B publication Critical patent/TWI269147B/zh
Publication of TW200700965A publication Critical patent/TW200700965A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20209—Thermal management, e.g. fan control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW094121504A 2005-06-27 2005-06-27 Cooling module and control method of cooling wind thereof TWI269147B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094121504A TWI269147B (en) 2005-06-27 2005-06-27 Cooling module and control method of cooling wind thereof
US11/270,513 US8267758B2 (en) 2005-06-27 2005-11-10 Thermal module and method for controlling heat-dissipation wind amount thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094121504A TWI269147B (en) 2005-06-27 2005-06-27 Cooling module and control method of cooling wind thereof

Publications (2)

Publication Number Publication Date
TWI269147B TWI269147B (en) 2006-12-21
TW200700965A true TW200700965A (en) 2007-01-01

Family

ID=37677994

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094121504A TWI269147B (en) 2005-06-27 2005-06-27 Cooling module and control method of cooling wind thereof

Country Status (2)

Country Link
US (1) US8267758B2 (zh)
TW (1) TWI269147B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7965152B2 (en) * 2008-12-02 2011-06-21 Microchip Technology Incorporated Attenuator with a control circuit
US20140188283A1 (en) * 2012-12-28 2014-07-03 Prosenjit Ghosh Adjusting performance range of computing device
AU2015278221A1 (en) 2014-06-20 2017-02-02 Nortek Air Solutions Canada, Inc. Systems and methods for managing conditions in enclosed space
CN107850335B (zh) 2015-05-15 2021-02-19 北狄空气应对加拿大公司 利用液-气式膜能量交换器进行液体冷却
EP3400407A4 (en) 2016-01-08 2019-08-07 Nortek Air Solutions Canada, Inc. INTEGRATED AIR SYSTEM IN A 100% AIR RECIRCULATION SYSTEM
CN108990391B (zh) * 2018-09-05 2023-08-18 郑州云海信息技术有限公司 一种集装箱数据中心模块化间接蒸发冷却系统及方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6133313A (ja) * 1984-07-25 1986-02-17 Diesel Kiki Co Ltd 自動車用空気調和装置
CN2035064U (zh) 1988-01-22 1989-03-29 李道宏 空气分布装置
US6181557B1 (en) * 1999-10-29 2001-01-30 Motorola, Inc. Electronic component, method of cooling, and damper therefor
JP2002006991A (ja) 2000-06-16 2002-01-11 Toshiba Corp コンピュータシステム及び冷却ファンの回転数制御方法
CN1220924C (zh) 2001-10-22 2005-09-28 联想(北京)有限公司 台式电脑主机的风流管制系统
US6628520B2 (en) * 2002-02-06 2003-09-30 Hewlett-Packard Development Company, L.P. Method, apparatus, and system for cooling electronic components
JP3985642B2 (ja) * 2002-09-17 2007-10-03 株式会社デンソー 温水生成装置

Also Published As

Publication number Publication date
US20070017665A1 (en) 2007-01-25
US8267758B2 (en) 2012-09-18
TWI269147B (en) 2006-12-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees