TW200700523A - Adhesive and luminescent element - Google Patents
Adhesive and luminescent elementInfo
- Publication number
- TW200700523A TW200700523A TW095103775A TW95103775A TW200700523A TW 200700523 A TW200700523 A TW 200700523A TW 095103775 A TW095103775 A TW 095103775A TW 95103775 A TW95103775 A TW 95103775A TW 200700523 A TW200700523 A TW 200700523A
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive
- diene polymer
- conjugated
- luminescent
- base
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title abstract 7
- 230000001070 adhesive effect Effects 0.000 title abstract 7
- 229920000642 polymer Polymers 0.000 abstract 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 2
- 238000005538 encapsulation Methods 0.000 abstract 2
- 229910052760 oxygen Inorganic materials 0.000 abstract 2
- 239000001301 oxygen Substances 0.000 abstract 2
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 239000012776 electronic material Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 229910010272 inorganic material Inorganic materials 0.000 abstract 1
- 239000011147 inorganic material Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000011368 organic material Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L15/00—Compositions of rubber derivatives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J115/00—Adhesives based on rubber derivatives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08C—TREATMENT OR CHEMICAL MODIFICATION OF RUBBERS
- C08C19/00—Chemical modification of rubber
- C08C19/02—Hydrogenation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08C—TREATMENT OR CHEMICAL MODIFICATION OF RUBBERS
- C08C19/00—Chemical modification of rubber
- C08C19/08—Depolymerisation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electroluminescent Light Sources (AREA)
- Die Bonding (AREA)
Abstract
An adhesive with which an inorganic material, e.g., a glass or metal, and an organic material, e.g., a plastic, are bonded and which has the function of absorbing oxygen through the surfaces to be in contact therewith, and an electronic material such as a luminescent material, obtained using the adhesive. The adhesive has such an oxygen-absorbing function that the oxygen absorption is 0.5 mL/g or more and comprises a cyclized conjugated-diene polymer having a percentage decrease in unsaturated-bond amount of 10% or higher, the percentage decrease indicating the proportion of the number of unsaturated bonds present in the cyclized conjugated-diene polymer to the number of unsaturated bonds in a conjugated-diene polymer in the case where the cyclized conjugated-diene polymer is obtained by cyclizing the conjugated-diene polymer. The luminescent element is characterized by comprising a base, a luminescent-element main body disposed on the base, an encapsulation vessel disposed so as to cover the luminescent element, and an adhesive with which the base is bonded to the encapsulation vessel, the adhesive being that adhesive.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005022973 | 2005-01-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200700523A true TW200700523A (en) | 2007-01-01 |
Family
ID=36740517
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095103775A TW200700523A (en) | 2005-01-31 | 2006-02-03 | Adhesive and luminescent element |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5029959B2 (en) |
TW (1) | TW200700523A (en) |
WO (1) | WO2006080500A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5365891B2 (en) * | 2006-10-13 | 2013-12-11 | 日本ゼオン株式会社 | RESIN COMPOSITION FOR LIGHT EMITTING ELEMENT, LAMINATE FOR LIGHT EMITTING ELEMENT, LIGHT EMITTING ELEMENT |
CN102414246B (en) | 2009-03-06 | 2013-09-18 | 东洋制罐株式会社 | Oxygen-absorbable solvent-soluble resin and oxygen-absorbable adhesive resin composition |
US20130143734A1 (en) | 2010-08-19 | 2013-06-06 | Toyo Seikan Kaisha Ltd. | Resin for Oxygen-absorbing Adhesive and Oxygen-absorbing Adhesive |
US9102853B2 (en) | 2010-12-28 | 2015-08-11 | Toyo Seikan Group Holdings, Ltd. | Two-part curable oxygen-absorbable resin composition, and oxygen-absorbable adhesive agent |
JP2013168381A (en) * | 2013-04-26 | 2013-08-29 | Pioneer Electronic Corp | Organic el panel and method for manufacturing the same |
WO2024204744A1 (en) * | 2023-03-30 | 2024-10-03 | リンテック株式会社 | Adhesive, adhesive sheet, optical component, and display |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003035786A1 (en) * | 2001-10-22 | 2003-05-01 | Zeon Corporation | Vulcanization adhesive and composite formed article |
JP3966162B2 (en) * | 2001-12-07 | 2007-08-29 | 日本ゼオン株式会社 | Composite molded body |
JP3865056B2 (en) * | 2002-01-22 | 2007-01-10 | セイコーエプソン株式会社 | Manufacturing method of sealing substrate |
JP2004002766A (en) * | 2002-03-27 | 2004-01-08 | Nippon Zeon Co Ltd | Adhesive composition composed of modified conjugated diene polymer and composite molded article |
JP2004001457A (en) * | 2002-04-09 | 2004-01-08 | Nippon Zeon Co Ltd | Composite molded body of hydrocarbon polymer |
JP4389150B2 (en) * | 2003-06-20 | 2009-12-24 | 東洋製罐株式会社 | Oxygen-absorbing resin composition and multilayer structure using the same |
-
2006
- 2006-01-30 JP JP2007500630A patent/JP5029959B2/en not_active Expired - Fee Related
- 2006-01-30 WO PCT/JP2006/301464 patent/WO2006080500A1/en not_active Application Discontinuation
- 2006-02-03 TW TW095103775A patent/TW200700523A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP5029959B2 (en) | 2012-09-19 |
JPWO2006080500A1 (en) | 2008-06-19 |
WO2006080500A1 (en) | 2006-08-03 |
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