TW200700168A - Method and system for processing substrates with sonic energy that reduces or eliminates damage to semiconductor devices - Google Patents

Method and system for processing substrates with sonic energy that reduces or eliminates damage to semiconductor devices

Info

Publication number
TW200700168A
TW200700168A TW095107855A TW95107855A TW200700168A TW 200700168 A TW200700168 A TW 200700168A TW 095107855 A TW095107855 A TW 095107855A TW 95107855 A TW95107855 A TW 95107855A TW 200700168 A TW200700168 A TW 200700168A
Authority
TW
Taiwan
Prior art keywords
sonic energy
reduces
semiconductor devices
processing substrates
eliminates damage
Prior art date
Application number
TW095107855A
Other languages
English (en)
Inventor
Ismail Kashkoush
Pejman Fani
John Korbler
Vivek Vohra
Alan Walter
Original Assignee
Akrion Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akrion Inc filed Critical Akrion Inc
Publication of TW200700168A publication Critical patent/TW200700168A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW095107855A 2005-03-08 2006-03-08 Method and system for processing substrates with sonic energy that reduces or eliminates damage to semiconductor devices TW200700168A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US65956605P 2005-03-08 2005-03-08
US66050705P 2005-03-10 2005-03-10

Publications (1)

Publication Number Publication Date
TW200700168A true TW200700168A (en) 2007-01-01

Family

ID=36954027

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095107855A TW200700168A (en) 2005-03-08 2006-03-08 Method and system for processing substrates with sonic energy that reduces or eliminates damage to semiconductor devices

Country Status (3)

Country Link
US (2) US20060260638A1 (zh)
TW (1) TW200700168A (zh)
WO (1) WO2006096814A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400606B (zh) * 2007-06-27 2013-07-01 Semes Co Ltd 用於探針檢測器操作比率之計算系統及其計算方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7571059B2 (en) * 2006-06-28 2009-08-04 Sun Microsystems, Inc. Mechanism for determining an accelerated test specification for device elements
US8045605B2 (en) * 2006-12-25 2011-10-25 Advantest Corporation Jitter amplifier circuit, signal generation circuit, semiconductor chip, and test apparatus
US9228785B2 (en) 2010-05-04 2016-01-05 Alexander Poltorak Fractal heat transfer device
US10852069B2 (en) 2010-05-04 2020-12-01 Fractal Heatsink Technologies, LLC System and method for maintaining efficiency of a fractal heat sink
CN102468126B (zh) * 2010-11-05 2013-10-23 无锡华润上华半导体有限公司 圆片清洗方法
US9155140B2 (en) * 2012-06-07 2015-10-06 Gabriel Yavor Optical waveform generator
EP3021649B1 (en) * 2013-07-10 2020-02-19 FUJI Corporation Method for managing and device for managing nozzle cleaning period
US11257667B2 (en) 2016-04-06 2022-02-22 Acm Research (Shanghai) Inc. Methods and apparatus for cleaning semiconductor wafers
US10830545B2 (en) 2016-07-12 2020-11-10 Fractal Heatsink Technologies, LLC System and method for maintaining efficiency of a heat sink
WO2019018446A1 (en) 2017-07-17 2019-01-24 Fractal Heatsink Technologies, LLC SYSTEM AND METHOD FOR MULTI-FRACTAL THERMAL DISSIPATOR
CN111386157B (zh) * 2017-11-15 2022-12-27 盛美半导体设备(上海)股份有限公司 用于清洗半导体晶圆的方法
CN117672817B (zh) * 2024-01-31 2024-05-07 粤芯半导体技术股份有限公司 含氟气体刻蚀残留物的清洗方法、晶圆及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2003A (en) * 1841-03-12 Improvement in horizontal windivhlls
AU2552492A (en) * 1991-08-23 1993-03-16 United States of America as represented by The Secretary Department of Health and Human Services, The Raf protein kinase therapeutics
US6039059A (en) * 1996-09-30 2000-03-21 Verteq, Inc. Wafer cleaning system
KR100566911B1 (ko) * 2001-06-25 2006-04-03 주식회사 삼양사 약물 전달체용 음이온기-함유 양친성 블록 공중합체 및 그의 양이온성 약물과의 복합체
US6845778B2 (en) * 2002-03-29 2005-01-25 Lam Research Corporation In-situ local heating using megasonic transducer resonator
US7185661B2 (en) * 2002-05-06 2007-03-06 Akrion Technologies, Inc. Reciprocating megasonic probe
US6880560B2 (en) * 2002-11-18 2005-04-19 Techsonic Substrate processing apparatus for processing substrates using dense phase gas and sonic waves

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400606B (zh) * 2007-06-27 2013-07-01 Semes Co Ltd 用於探針檢測器操作比率之計算系統及其計算方法

Also Published As

Publication number Publication date
WO2006096814A2 (en) 2006-09-14
WO2006096814A3 (en) 2007-01-25
US20060260639A1 (en) 2006-11-23
US20060260638A1 (en) 2006-11-23

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