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Application filed by Nan Ya Printed Circuit Board CorpfiledCriticalNan Ya Printed Circuit Board Corp
Priority to TW94118786ApriorityCriticalpatent/TWI281368B/en
Publication of TW200644747ApublicationCriticalpatent/TW200644747A/en
Application grantedgrantedCritical
Publication of TWI281368BpublicationCriticalpatent/TWI281368B/en
Insulated Metal Substrates For Printed Circuits
(AREA)
Production Of Multi-Layered Print Wiring Board
(AREA)
Abstract
The present invention is a PCB drill method. The method comprises providing a core layer comprises the copper foil circuit and the aimed point formed on the core layer, a dielectric film formed on the core layer, the copper layer formed on the dielectric film. The method further comprises removing the copper layer, providing a light illuminates to find out the aimed point and the copper foil circuit, to form an open on the dielectric film above the copper foil circuit.
Metal pattern forming method, metal pattern obtained by the same, printed wiring board, conductive film forming method, and conductive film obtained by the same
Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate
Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards