TW200644747A - PCB drill method - Google Patents

PCB drill method

Info

Publication number
TW200644747A
TW200644747A TW094118786A TW94118786A TW200644747A TW 200644747 A TW200644747 A TW 200644747A TW 094118786 A TW094118786 A TW 094118786A TW 94118786 A TW94118786 A TW 94118786A TW 200644747 A TW200644747 A TW 200644747A
Authority
TW
Taiwan
Prior art keywords
dielectric film
copper foil
core layer
foil circuit
pcb drill
Prior art date
Application number
TW094118786A
Other languages
Chinese (zh)
Other versions
TWI281368B (en
Inventor
Hung-En Hsu
Original Assignee
Nan Ya Printed Circuit Board Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nan Ya Printed Circuit Board Corp filed Critical Nan Ya Printed Circuit Board Corp
Priority to TW94118786A priority Critical patent/TWI281368B/en
Publication of TW200644747A publication Critical patent/TW200644747A/en
Application granted granted Critical
Publication of TWI281368B publication Critical patent/TWI281368B/en

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The present invention is a PCB drill method. The method comprises providing a core layer comprises the copper foil circuit and the aimed point formed on the core layer, a dielectric film formed on the core layer, the copper layer formed on the dielectric film. The method further comprises removing the copper layer, providing a light illuminates to find out the aimed point and the copper foil circuit, to form an open on the dielectric film above the copper foil circuit.
TW94118786A 2005-06-07 2005-06-07 PCB drill method TWI281368B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94118786A TWI281368B (en) 2005-06-07 2005-06-07 PCB drill method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94118786A TWI281368B (en) 2005-06-07 2005-06-07 PCB drill method

Publications (2)

Publication Number Publication Date
TW200644747A true TW200644747A (en) 2006-12-16
TWI281368B TWI281368B (en) 2007-05-11

Family

ID=38741717

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94118786A TWI281368B (en) 2005-06-07 2005-06-07 PCB drill method

Country Status (1)

Country Link
TW (1) TWI281368B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8502264B2 (en) 2006-04-25 2013-08-06 Osram Opto Semiconductors Gmbh Composite substrate, and method for the production of a composite substrate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8274798B2 (en) 2010-07-28 2012-09-25 Unimicron Technology Corp. Carrier substrate and method for making the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8502264B2 (en) 2006-04-25 2013-08-06 Osram Opto Semiconductors Gmbh Composite substrate, and method for the production of a composite substrate

Also Published As

Publication number Publication date
TWI281368B (en) 2007-05-11

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