TW200641967A - Substrate and method of fabricating the same - Google Patents

Substrate and method of fabricating the same

Info

Publication number
TW200641967A
TW200641967A TW094116840A TW94116840A TW200641967A TW 200641967 A TW200641967 A TW 200641967A TW 094116840 A TW094116840 A TW 094116840A TW 94116840 A TW94116840 A TW 94116840A TW 200641967 A TW200641967 A TW 200641967A
Authority
TW
Taiwan
Prior art keywords
substrate
dielectric layer
conductive piece
fabricating
same
Prior art date
Application number
TW094116840A
Other languages
Chinese (zh)
Other versions
TWI250555B (en
Inventor
Chao-Chen Tu
Ching-Fu Horng
Su-Yu Lin
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW94116840A priority Critical patent/TWI250555B/en
Application granted granted Critical
Publication of TWI250555B publication Critical patent/TWI250555B/en
Publication of TW200641967A publication Critical patent/TW200641967A/en

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

A substrate comprising a dielectric layer and at least one conductive piece is provided. The dielectric layer comprises a first surface and a second surface. The first surface is opposite to the second surface. The conductive piece comprising a first bump, a second bump and a metal layer sandwiched in between them is arranged inside the dielectric layer. A patterned first and second circuit layer may be further arranged on the first and second surface of the dielectric layer respectively. The first circuit layer is electrically connected to the second circuit layer through the solid conductive piece, to improve the reliability of the substrate.
TW94116840A 2005-05-24 2005-05-24 Substrate and method of fabricating the same TWI250555B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94116840A TWI250555B (en) 2005-05-24 2005-05-24 Substrate and method of fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94116840A TWI250555B (en) 2005-05-24 2005-05-24 Substrate and method of fabricating the same

Publications (2)

Publication Number Publication Date
TWI250555B TWI250555B (en) 2006-03-01
TW200641967A true TW200641967A (en) 2006-12-01

Family

ID=37433066

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94116840A TWI250555B (en) 2005-05-24 2005-05-24 Substrate and method of fabricating the same

Country Status (1)

Country Link
TW (1) TWI250555B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9497853B2 (en) 2010-12-24 2016-11-15 Lg Innotek Co., Ltd. Printed circuit board and method for manufacturing the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI634816B (en) * 2016-03-01 2018-09-01 景碩科技股份有限公司 Easy to test multilayer board
US9967975B2 (en) 2016-04-29 2018-05-08 Kinsus Interconnect Technology Corp. Multi-layer circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9497853B2 (en) 2010-12-24 2016-11-15 Lg Innotek Co., Ltd. Printed circuit board and method for manufacturing the same

Also Published As

Publication number Publication date
TWI250555B (en) 2006-03-01

Similar Documents

Publication Publication Date Title
TW200726335A (en) Substrate structure with capacitance component embedded therein and method for fabricating the same
TW200725880A (en) Semiconductor piezoresistive sensor and operation method thereof
TW200629490A (en) Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same
TW200742249A (en) Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
TW200501182A (en) A capacitor structure
TW200703590A (en) Method of fabricating wiring board and method of fabricating semiconductor device
TW200603387A (en) Interconnect structure with wings
TW200944072A (en) Method for manufacturing a substrate having embedded component therein
WO2006007143A3 (en) Schottky device and method of forming
WO2006055179A3 (en) Methods and structures for electrical communication with an overlying electrode for a semiconductor element
SG127856A1 (en) Interconnects with harmonized stress and methods for fabricating the same
TW200640315A (en) Electrically connecting structure of circuit board and method for fabricating same
TW200802756A (en) Embedded metal heat sink for semiconductor device and method for manufacturing the same
TW200746330A (en) Microelectronic assembly with back side metallization and method for forming the same
TW200739635A (en) Embedded capacitors and methods for their fabrication and connection
WO2005086855A3 (en) Electronic junction devices featuring redox electrodes
WO2008155967A1 (en) Board with built-in component and its manufacturing method
TW200715930A (en) Method for manufacturing a substrate embedded with an electronic component and device from the same
TW200737455A (en) Method for fabricating a metal protecting layer on electrically connecting pad of circuit board
WO2005104814A3 (en) Composite ground shield for passive components in a semiconductor die
TW200715424A (en) Semiconductor device and method of manufacturing the same
WO2007070356A3 (en) Package using array capacitor core
TW200641967A (en) Substrate and method of fabricating the same
WO2003073814A3 (en) Laminated socket contacts
WO2008136316A1 (en) Laminated substrate structure and method for manufacturing the same

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees