TW200641967A - Substrate and method of fabricating the same - Google Patents
Substrate and method of fabricating the sameInfo
- Publication number
- TW200641967A TW200641967A TW094116840A TW94116840A TW200641967A TW 200641967 A TW200641967 A TW 200641967A TW 094116840 A TW094116840 A TW 094116840A TW 94116840 A TW94116840 A TW 94116840A TW 200641967 A TW200641967 A TW 200641967A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- dielectric layer
- conductive piece
- fabricating
- same
- Prior art date
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
A substrate comprising a dielectric layer and at least one conductive piece is provided. The dielectric layer comprises a first surface and a second surface. The first surface is opposite to the second surface. The conductive piece comprising a first bump, a second bump and a metal layer sandwiched in between them is arranged inside the dielectric layer. A patterned first and second circuit layer may be further arranged on the first and second surface of the dielectric layer respectively. The first circuit layer is electrically connected to the second circuit layer through the solid conductive piece, to improve the reliability of the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94116840A TWI250555B (en) | 2005-05-24 | 2005-05-24 | Substrate and method of fabricating the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94116840A TWI250555B (en) | 2005-05-24 | 2005-05-24 | Substrate and method of fabricating the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI250555B TWI250555B (en) | 2006-03-01 |
TW200641967A true TW200641967A (en) | 2006-12-01 |
Family
ID=37433066
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94116840A TWI250555B (en) | 2005-05-24 | 2005-05-24 | Substrate and method of fabricating the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI250555B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9497853B2 (en) | 2010-12-24 | 2016-11-15 | Lg Innotek Co., Ltd. | Printed circuit board and method for manufacturing the same |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI634816B (en) * | 2016-03-01 | 2018-09-01 | 景碩科技股份有限公司 | Easy to test multilayer board |
US9967975B2 (en) | 2016-04-29 | 2018-05-08 | Kinsus Interconnect Technology Corp. | Multi-layer circuit board |
-
2005
- 2005-05-24 TW TW94116840A patent/TWI250555B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9497853B2 (en) | 2010-12-24 | 2016-11-15 | Lg Innotek Co., Ltd. | Printed circuit board and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
TWI250555B (en) | 2006-03-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |