TW200641291A - Vacuum liquid filling device and vacuum liquid filling method - Google Patents

Vacuum liquid filling device and vacuum liquid filling method

Info

Publication number
TW200641291A
TW200641291A TW094116673A TW94116673A TW200641291A TW 200641291 A TW200641291 A TW 200641291A TW 094116673 A TW094116673 A TW 094116673A TW 94116673 A TW94116673 A TW 94116673A TW 200641291 A TW200641291 A TW 200641291A
Authority
TW
Taiwan
Prior art keywords
liquid
vacuum
liquid filling
filling device
vacuum liquid
Prior art date
Application number
TW094116673A
Other languages
Chinese (zh)
Other versions
TWI317407B (en
Inventor
Mong-Tung Lin
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW94116673A priority Critical patent/TWI317407B/en
Publication of TW200641291A publication Critical patent/TW200641291A/en
Application granted granted Critical
Publication of TWI317407B publication Critical patent/TWI317407B/en

Links

Landscapes

  • Filling Of Jars Or Cans And Processes For Cleaning And Sealing Jars (AREA)
  • Basic Packing Technique (AREA)

Abstract

The present intention relates to a vacuum liquid filling device and a method of filling liquid in vacuum employing the vacuum liquid filling device. The liquid filling device includes a liquid transport system for transporting a liquid to a container to be filled liquid, a vacuum system for vacuumizing the containter and a frozen system for freezing the liquid in the container. The liquid filling device can be used to fill liquid for all kinds of heat pipes and other vacuum containers. The frozen system freeze the liquid filled in the heat pipe, and make the liquid not to volatile in a vacuumizing process. Thus, the filled liquid can be precisely controlled.
TW94116673A 2005-05-23 2005-05-23 Vaccum liquid filling device and vacuum liquid filling method TWI317407B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94116673A TWI317407B (en) 2005-05-23 2005-05-23 Vaccum liquid filling device and vacuum liquid filling method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94116673A TWI317407B (en) 2005-05-23 2005-05-23 Vaccum liquid filling device and vacuum liquid filling method

Publications (2)

Publication Number Publication Date
TW200641291A true TW200641291A (en) 2006-12-01
TWI317407B TWI317407B (en) 2009-11-21

Family

ID=45073360

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94116673A TWI317407B (en) 2005-05-23 2005-05-23 Vaccum liquid filling device and vacuum liquid filling method

Country Status (1)

Country Link
TW (1) TWI317407B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108106471A (en) * 2017-12-15 2018-06-01 陕西仙童科技有限公司 A kind of accurate filling system of heat-pipe working medium and filling method
CN112033199A (en) * 2020-09-04 2020-12-04 佛山市优霸机械设备有限公司 Vacuum liquid injection method and device for copper pipe radiating fin

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103241696A (en) * 2013-04-23 2013-08-14 华南理工大学 Multi-cavity heat pipe working medium gaseous-state perfusion method and equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108106471A (en) * 2017-12-15 2018-06-01 陕西仙童科技有限公司 A kind of accurate filling system of heat-pipe working medium and filling method
CN112033199A (en) * 2020-09-04 2020-12-04 佛山市优霸机械设备有限公司 Vacuum liquid injection method and device for copper pipe radiating fin

Also Published As

Publication number Publication date
TWI317407B (en) 2009-11-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees