TW200640356A - Electronic circuit module comprising a heat producing component - Google Patents

Electronic circuit module comprising a heat producing component

Info

Publication number
TW200640356A
TW200640356A TW095112565A TW95112565A TW200640356A TW 200640356 A TW200640356 A TW 200640356A TW 095112565 A TW095112565 A TW 095112565A TW 95112565 A TW95112565 A TW 95112565A TW 200640356 A TW200640356 A TW 200640356A
Authority
TW
Taiwan
Prior art keywords
heat
producing component
heat producing
electronic circuit
circuit module
Prior art date
Application number
TW095112565A
Other languages
English (en)
Chinese (zh)
Inventor
Klaus Barth
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200640356A publication Critical patent/TW200640356A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW095112565A 2005-04-12 2006-04-07 Electronic circuit module comprising a heat producing component TW200640356A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05102857 2005-04-12

Publications (1)

Publication Number Publication Date
TW200640356A true TW200640356A (en) 2006-11-16

Family

ID=36954975

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095112565A TW200640356A (en) 2005-04-12 2006-04-07 Electronic circuit module comprising a heat producing component

Country Status (2)

Country Link
TW (1) TW200640356A (fr)
WO (1) WO2006109206A2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007037297A1 (de) * 2007-08-07 2009-02-19 Continental Automotive Gmbh Schaltungsträgeraufbau mit verbesserter Wärmeableitung
DE102008040501A1 (de) * 2008-07-17 2010-01-21 Robert Bosch Gmbh Verbesserte Wärmeabfuhr aus einem Steuergerät
DE102009005067A1 (de) * 2009-01-19 2010-07-22 Trw Automotive Gmbh Hybrid-Platte
JP2014236139A (ja) * 2013-06-04 2014-12-15 三菱電機株式会社 電子制御機器
US11683911B2 (en) * 2018-10-26 2023-06-20 Magna Electronics Inc. Vehicular sensing device with cooling feature

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10123198A1 (de) * 2001-05-12 2002-12-19 Hella Kg Hueck & Co Anordnung aus einem Gehäuse und einem Schaltungsträger
KR100411255B1 (ko) * 2001-06-11 2003-12-18 삼성전기주식회사 케이블 모뎀 튜너 모듈의 히트싱크
EP1528847B1 (fr) * 2003-10-29 2007-08-08 POWER ONE ITALY S.p.A. Insert dissipant la chaleur, circuit comprenant ledit insert et méthode de production

Also Published As

Publication number Publication date
WO2006109206A3 (fr) 2007-04-26
WO2006109206A2 (fr) 2006-10-19

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