TW200635491A - Heat dissipater module and electronic device having the same - Google Patents

Heat dissipater module and electronic device having the same

Info

Publication number
TW200635491A
TW200635491A TW094109527A TW94109527A TW200635491A TW 200635491 A TW200635491 A TW 200635491A TW 094109527 A TW094109527 A TW 094109527A TW 94109527 A TW94109527 A TW 94109527A TW 200635491 A TW200635491 A TW 200635491A
Authority
TW
Taiwan
Prior art keywords
heat
same
electronic device
heat dissipater
dissipater module
Prior art date
Application number
TW094109527A
Other languages
English (en)
Other versions
TWI261494B (en
Inventor
Kuo-Ying Tsai
Original Assignee
Via Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Via Tech Inc filed Critical Via Tech Inc
Priority to TW094109527A priority Critical patent/TWI261494B/zh
Priority to US11/148,863 priority patent/US20060215368A1/en
Application granted granted Critical
Publication of TWI261494B publication Critical patent/TWI261494B/zh
Publication of TW200635491A publication Critical patent/TW200635491A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW094109527A 2005-03-28 2005-03-28 Heat dissipater module and electronic device having the same TWI261494B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094109527A TWI261494B (en) 2005-03-28 2005-03-28 Heat dissipater module and electronic device having the same
US11/148,863 US20060215368A1 (en) 2005-03-28 2005-06-08 Heat-dissipating module and electronic apparatus having the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094109527A TWI261494B (en) 2005-03-28 2005-03-28 Heat dissipater module and electronic device having the same

Publications (2)

Publication Number Publication Date
TWI261494B TWI261494B (en) 2006-09-01
TW200635491A true TW200635491A (en) 2006-10-01

Family

ID=37034926

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094109527A TWI261494B (en) 2005-03-28 2005-03-28 Heat dissipater module and electronic device having the same

Country Status (2)

Country Link
US (1) US20060215368A1 (zh)
TW (1) TWI261494B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI503656B (zh) * 2012-09-07 2015-10-11 Inventec Corp 散熱結構

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1988785A (zh) * 2005-12-23 2007-06-27 鸿富锦精密工业（深圳）有限公司 散热装置
JP5082970B2 (ja) * 2008-03-25 2012-11-28 富士通株式会社 回路基板装置
DE102010008074A1 (de) * 2010-02-15 2011-08-18 Continental Automotive GmbH, 30165 Gehäuse mit Kühlvorrichtung
CN101916135B (zh) * 2010-08-06 2013-04-10 威盛电子股份有限公司 电子设备
US10721840B2 (en) 2017-10-11 2020-07-21 DISH Technologies L.L.C. Heat spreader assembly
US10980151B2 (en) * 2018-07-31 2021-04-13 Hewlett Packard Enterprise Development Lp Flexible heat transfer mechanism configurations
US10551886B1 (en) * 2018-10-08 2020-02-04 Google Llc Display with integrated graphite heat spreader and printed circuit board insulator
US10806054B1 (en) * 2019-08-06 2020-10-13 Honeywell International Inc. Flexible elastic thermal bridge for electronic subassemblies with variable gaps between components and enclosures
CN114610127A (zh) * 2020-12-09 2022-06-10 安立材料科技股份有限公司 具有高效热管理功能的机壳结构
US20220238412A1 (en) * 2021-01-22 2022-07-28 DTEN, Inc. Elastic thermal connection structure
US11800687B2 (en) * 2021-08-26 2023-10-24 Dish Network L.L.C. Heat transfer assembly

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5781409A (en) * 1996-12-19 1998-07-14 Compaq Computer Corporation Heat dissipating lid hinge structure with laterally offset heat pipe end portions
US6097596A (en) * 1998-02-12 2000-08-01 International Business Machines Corporation Portable computer rotational heat pipe heat transfer
US6288896B1 (en) * 1998-07-02 2001-09-11 Acer Incorporated Heat dissipation system for a laptop computer using a heat pipe
US6377452B1 (en) * 1998-12-18 2002-04-23 Furukawa Electric Co., Ltd. Heat pipe hinge structure for electronic device
US6914780B1 (en) * 2003-01-16 2005-07-05 Cisco Technology, Inc. Methods and apparatus for cooling a circuit board component using a heat pipe assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI503656B (zh) * 2012-09-07 2015-10-11 Inventec Corp 散熱結構

Also Published As

Publication number Publication date
TWI261494B (en) 2006-09-01
US20060215368A1 (en) 2006-09-28

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees