TW200635456A - Method of fabricating a device-containing substrate - Google Patents
Method of fabricating a device-containing substrateInfo
- Publication number
- TW200635456A TW200635456A TW094110143A TW94110143A TW200635456A TW 200635456 A TW200635456 A TW 200635456A TW 094110143 A TW094110143 A TW 094110143A TW 94110143 A TW94110143 A TW 94110143A TW 200635456 A TW200635456 A TW 200635456A
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive film
- core
- conductive
- insulating layer
- fabricating
- Prior art date
Links
Abstract
A method of fabricating a device-containing substrate is disclosed. First, a first conductive film having several conductive bumps is provided A device is fixed to the first conductive film by connecting the conductive bumps and the electrodes of the device. A core having a receiving space and interlayer circuit on two sides of the core is provided. Then, the device is embedded into the receiving space. Next, an insulating layer is formed to encapsulate the device, core and interlayer circuit on the core. Accordingly, the first conductive film is positioned below the device. A second conductive film is further formed on the insulating layer and above the device. Then, several through holes are formed to open through the second conductive film, insulating layer, core and first conductive film. Next, a conductive layer is formed at the sidewalis of the through holes, and an outside circuit is formed by patterning the first and second conductive films. Finally, a solder mask is formed to cover the outside circuit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94110143A TWI311452B (en) | 2005-03-30 | 2005-03-30 | Method of fabricating a device-containing substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94110143A TWI311452B (en) | 2005-03-30 | 2005-03-30 | Method of fabricating a device-containing substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200635456A true TW200635456A (en) | 2006-10-01 |
TWI311452B TWI311452B (en) | 2009-06-21 |
Family
ID=45072428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94110143A TWI311452B (en) | 2005-03-30 | 2005-03-30 | Method of fabricating a device-containing substrate |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI311452B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI416685B (en) * | 2010-03-04 | 2013-11-21 | Unimicron Technology Corp | Package substrate and fabrication method thereof |
CN104969312A (en) * | 2013-02-08 | 2015-10-07 | 高通股份有限公司 | Substrate-less discrete coupled inductor structure |
-
2005
- 2005-03-30 TW TW94110143A patent/TWI311452B/en active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI416685B (en) * | 2010-03-04 | 2013-11-21 | Unimicron Technology Corp | Package substrate and fabrication method thereof |
CN104969312A (en) * | 2013-02-08 | 2015-10-07 | 高通股份有限公司 | Substrate-less discrete coupled inductor structure |
TWI611437B (en) * | 2013-02-08 | 2018-01-11 | 高通公司 | Substrate-less discrete coupled inductor structure, inductor structure apparatus, and method for providing the inductor structure |
CN104969312B (en) * | 2013-02-08 | 2018-05-15 | 高通股份有限公司 | Without the discrete coupled-inductor structure of substrate |
US10115661B2 (en) | 2013-02-08 | 2018-10-30 | Qualcomm Incorporated | Substrate-less discrete coupled inductor structure |
Also Published As
Publication number | Publication date |
---|---|
TWI311452B (en) | 2009-06-21 |
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