TW200633101A - Wafer yield detect method - Google Patents

Wafer yield detect method

Info

Publication number
TW200633101A
TW200633101A TW094106857A TW94106857A TW200633101A TW 200633101 A TW200633101 A TW 200633101A TW 094106857 A TW094106857 A TW 094106857A TW 94106857 A TW94106857 A TW 94106857A TW 200633101 A TW200633101 A TW 200633101A
Authority
TW
Taiwan
Prior art keywords
detect method
wafer yield
yield detect
die
wafer
Prior art date
Application number
TW094106857A
Other languages
Chinese (zh)
Other versions
TWI262571B (en
Inventor
Hui-An Chang
Original Assignee
Promos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Promos Technologies Inc filed Critical Promos Technologies Inc
Priority to TW94106857A priority Critical patent/TWI262571B/en
Publication of TW200633101A publication Critical patent/TW200633101A/en
Application granted granted Critical
Publication of TWI262571B publication Critical patent/TWI262571B/en

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The present invention provides a detect method. A special defect type in a selected layer is detected. The corresponding defect number in a die is counted to predict the die yield.
TW94106857A 2005-03-07 2005-03-07 Wafer yield detect method TWI262571B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94106857A TWI262571B (en) 2005-03-07 2005-03-07 Wafer yield detect method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94106857A TWI262571B (en) 2005-03-07 2005-03-07 Wafer yield detect method

Publications (2)

Publication Number Publication Date
TW200633101A true TW200633101A (en) 2006-09-16
TWI262571B TWI262571B (en) 2006-09-21

Family

ID=37987771

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94106857A TWI262571B (en) 2005-03-07 2005-03-07 Wafer yield detect method

Country Status (1)

Country Link
TW (1) TWI262571B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI579949B (en) * 2014-03-20 2017-04-21 東芝股份有限公司 Manufacturing device management system and manufacturing device management method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI579949B (en) * 2014-03-20 2017-04-21 東芝股份有限公司 Manufacturing device management system and manufacturing device management method

Also Published As

Publication number Publication date
TWI262571B (en) 2006-09-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees