TW200631771A - Isotropic adhesive film and flexible metal-clad laminate - Google Patents

Isotropic adhesive film and flexible metal-clad laminate

Info

Publication number
TW200631771A
TW200631771A TW095103578A TW95103578A TW200631771A TW 200631771 A TW200631771 A TW 200631771A TW 095103578 A TW095103578 A TW 095103578A TW 95103578 A TW95103578 A TW 95103578A TW 200631771 A TW200631771 A TW 200631771A
Authority
TW
Taiwan
Prior art keywords
flexible metal
adhesive film
clad laminate
dimensional changes
isotropic adhesive
Prior art date
Application number
TW095103578A
Other languages
Chinese (zh)
Inventor
Kazuhiro Ono
Kan Fujihara
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corp filed Critical Kaneka Corp
Publication of TW200631771A publication Critical patent/TW200631771A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

With respect to the dimensional changes in flexible metal-clad laminates, only dimensional changes in the machine direction (MD direction) and in the transverse direction (TD direction) have been given importance. However, as demands for finer wiring increase, small dimensional changes in flexible metal-clad laminates are desired not only in the MD and TD directions but also at 45 DEG to the right and at 45 DEG to the left with respect to the MD direction. The problem can be solved by an adhesive film including a polyimide film and a thermoplastic polyimide-containing adhesive layer disposed on at least one surface of the polyimide film, wherein the orientation degree of the adhesive film is 1.3 or less.
TW095103578A 2005-02-04 2006-01-27 Isotropic adhesive film and flexible metal-clad laminate TW200631771A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005029870 2005-02-04
JP2005233615 2005-08-11

Publications (1)

Publication Number Publication Date
TW200631771A true TW200631771A (en) 2006-09-16

Family

ID=36777212

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095103578A TW200631771A (en) 2005-02-04 2006-01-27 Isotropic adhesive film and flexible metal-clad laminate

Country Status (3)

Country Link
JP (1) JPWO2006082828A1 (en)
TW (1) TW200631771A (en)
WO (1) WO2006082828A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5868753B2 (en) * 2012-03-26 2016-02-24 東レ・デュポン株式会社 Polyimide film

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100757612B1 (en) * 2001-07-06 2007-09-10 가부시키가이샤 가네카 Laminate and its producing method
JP2004338160A (en) * 2003-05-14 2004-12-02 Kanegafuchi Chem Ind Co Ltd Adhesive film enhanced in dimensional stability, flexible metal clad laminated sheet obtained therefrom and its manufacturing method
JP2005335102A (en) * 2004-05-24 2005-12-08 Kaneka Corp Adhesive joining member enhanced in dimensional stability and flexible metal clad laminated sheet

Also Published As

Publication number Publication date
WO2006082828A1 (en) 2006-08-10
JPWO2006082828A1 (en) 2008-06-26

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