TW200631717A - High-speed, precise, laser-based material processing method and system - Google Patents

High-speed, precise, laser-based material processing method and system

Info

Publication number
TW200631717A
TW200631717A TW095102254A TW95102254A TW200631717A TW 200631717 A TW200631717 A TW 200631717A TW 095102254 A TW095102254 A TW 095102254A TW 95102254 A TW95102254 A TW 95102254A TW 200631717 A TW200631717 A TW 200631717A
Authority
TW
Taiwan
Prior art keywords
laser
target material
pulsed laser
output
laser output
Prior art date
Application number
TW095102254A
Other languages
Chinese (zh)
Inventor
Shepard D Johnson
Bo Gu
James J Cordingley
Original Assignee
Gsi Lumonics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gsi Lumonics Corp filed Critical Gsi Lumonics Corp
Publication of TW200631717A publication Critical patent/TW200631717A/en

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  • Laser Beam Processing (AREA)
  • Lasers (AREA)

Abstract

A high-speed, precise, laser-based material processing method and system are provided wherein relative movement of target material and a pulsed laser output used to process the material are synchronized. The laser-based system includes a pulsed laser source for generating a set of laser pulses, and a laser output control that controllably selects a subset of pulses from the set of laser pulses at a Position beyond the laser source to obtain the pulsed laser output. The laser-based system further includes a mechanism for synchronizing the pulsed laser output with relative movement of the target material. A beam delivery and focusing subsystem delivers at least a portion of the synchronized pulsed laser output to the target material as a laser material processing output to process the target material. A positioning subsystem moves the target material relative to the pulsed laser output.
TW095102254A 2005-01-21 2006-01-20 High-speed, precise, laser-based material processing method and system TW200631717A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US64562105P 2005-01-21 2005-01-21

Publications (1)

Publication Number Publication Date
TW200631717A true TW200631717A (en) 2006-09-16

Family

ID=39000522

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102254A TW200631717A (en) 2005-01-21 2006-01-20 High-speed, precise, laser-based material processing method and system

Country Status (2)

Country Link
CN (1) CN101107093A (en)
TW (1) TW200631717A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012183549A (en) * 2011-03-04 2012-09-27 Mitsubishi Electric Corp METHOD OF MARKING SiC SEMICONDUCTOR WAFER AND SiC SEMICONDUCTOR WAFER
CN104308368B (en) * 2014-09-03 2015-12-30 大连理工大学 The quantitative minimizing technology of multi-shot laser ablation metal coating
US10029330B2 (en) * 2015-06-17 2018-07-24 The Boeing Company Hybrid laser machining of multi-material stack-ups
CN106735924B (en) * 2017-03-17 2018-05-15 天津欧泰激光科技有限公司 A kind of ultrafast marking machine based on ultrafast optical fiber laser

Also Published As

Publication number Publication date
CN101107093A (en) 2008-01-16

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