TW200631717A - High-speed, precise, laser-based material processing method and system - Google Patents
High-speed, precise, laser-based material processing method and systemInfo
- Publication number
- TW200631717A TW200631717A TW095102254A TW95102254A TW200631717A TW 200631717 A TW200631717 A TW 200631717A TW 095102254 A TW095102254 A TW 095102254A TW 95102254 A TW95102254 A TW 95102254A TW 200631717 A TW200631717 A TW 200631717A
- Authority
- TW
- Taiwan
- Prior art keywords
- laser
- target material
- pulsed laser
- output
- laser output
- Prior art date
Links
Landscapes
- Laser Beam Processing (AREA)
- Lasers (AREA)
Abstract
A high-speed, precise, laser-based material processing method and system are provided wherein relative movement of target material and a pulsed laser output used to process the material are synchronized. The laser-based system includes a pulsed laser source for generating a set of laser pulses, and a laser output control that controllably selects a subset of pulses from the set of laser pulses at a Position beyond the laser source to obtain the pulsed laser output. The laser-based system further includes a mechanism for synchronizing the pulsed laser output with relative movement of the target material. A beam delivery and focusing subsystem delivers at least a portion of the synchronized pulsed laser output to the target material as a laser material processing output to process the target material. A positioning subsystem moves the target material relative to the pulsed laser output.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US64562105P | 2005-01-21 | 2005-01-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200631717A true TW200631717A (en) | 2006-09-16 |
Family
ID=39000522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095102254A TW200631717A (en) | 2005-01-21 | 2006-01-20 | High-speed, precise, laser-based material processing method and system |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN101107093A (en) |
TW (1) | TW200631717A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012183549A (en) * | 2011-03-04 | 2012-09-27 | Mitsubishi Electric Corp | METHOD OF MARKING SiC SEMICONDUCTOR WAFER AND SiC SEMICONDUCTOR WAFER |
CN104308368B (en) * | 2014-09-03 | 2015-12-30 | 大连理工大学 | The quantitative minimizing technology of multi-shot laser ablation metal coating |
US10029330B2 (en) * | 2015-06-17 | 2018-07-24 | The Boeing Company | Hybrid laser machining of multi-material stack-ups |
CN106735924B (en) * | 2017-03-17 | 2018-05-15 | 天津欧泰激光科技有限公司 | A kind of ultrafast marking machine based on ultrafast optical fiber laser |
-
2006
- 2006-01-20 CN CN 200680002819 patent/CN101107093A/en active Pending
- 2006-01-20 TW TW095102254A patent/TW200631717A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN101107093A (en) | 2008-01-16 |
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