TW200631151A - Apparatus and method for bonding anisotropic conductive film using laser beam - Google Patents

Apparatus and method for bonding anisotropic conductive film using laser beam

Info

Publication number
TW200631151A
TW200631151A TW094105675A TW94105675A TW200631151A TW 200631151 A TW200631151 A TW 200631151A TW 094105675 A TW094105675 A TW 094105675A TW 94105675 A TW94105675 A TW 94105675A TW 200631151 A TW200631151 A TW 200631151A
Authority
TW
Taiwan
Prior art keywords
laser beam
conductive film
anisotropic conductive
light source
accumulated
Prior art date
Application number
TW094105675A
Other languages
Chinese (zh)
Inventor
Gi-Jung Nam
No-Heung Kwak
Original Assignee
Jet Tech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jet Tech Ltd filed Critical Jet Tech Ltd
Priority to TW094105675A priority Critical patent/TW200631151A/en
Publication of TW200631151A publication Critical patent/TW200631151A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

An anisotropic conductive film bonding apparatus and a method using a laser beam instead of thermal welding using a hot bar are disclosed. The apparatus includes a light source for generating a laser beam, a laser beam transmitter for guilding the laser beam from the light source to project the laser beam onto a connecting portion, a jig, on which the substrate, the ACF, and the material are accumulated, for projecting the laser beam on the accumulated material, a manipulation manner of the laser beam and pressure and for controllong overall operation of the apparatus. The process uisng the hot bar as a heat source for the connection of the anisotropic conductive film is replaced with the process using diode laser, so that reliability and precision of the process can be achieved, the processing time can be also reduced, and full-automated process can enhace productivity.
TW094105675A 2005-02-24 2005-02-24 Apparatus and method for bonding anisotropic conductive film using laser beam TW200631151A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094105675A TW200631151A (en) 2005-02-24 2005-02-24 Apparatus and method for bonding anisotropic conductive film using laser beam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094105675A TW200631151A (en) 2005-02-24 2005-02-24 Apparatus and method for bonding anisotropic conductive film using laser beam

Publications (1)

Publication Number Publication Date
TW200631151A true TW200631151A (en) 2006-09-01

Family

ID=57809123

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094105675A TW200631151A (en) 2005-02-24 2005-02-24 Apparatus and method for bonding anisotropic conductive film using laser beam

Country Status (1)

Country Link
TW (1) TW200631151A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8291729B2 (en) 2007-07-16 2012-10-23 Corning Incorporated Microalignment using laser-softened glass bumps
US9761630B2 (en) 2012-03-26 2017-09-12 Sharp Kabushiki Kaisha Method for manufacturing image pickup module
CN108702845A (en) * 2016-03-25 2018-10-23 迪睿合株式会社 The manufacturing method of connection structural bodies

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8291729B2 (en) 2007-07-16 2012-10-23 Corning Incorporated Microalignment using laser-softened glass bumps
TWI400499B (en) * 2007-07-16 2013-07-01 Corning Inc Microalignment using laser-softened glass bumps
US9761630B2 (en) 2012-03-26 2017-09-12 Sharp Kabushiki Kaisha Method for manufacturing image pickup module
CN108702845A (en) * 2016-03-25 2018-10-23 迪睿合株式会社 The manufacturing method of connection structural bodies
CN108702845B (en) * 2016-03-25 2021-04-06 迪睿合株式会社 Method for manufacturing connection structure

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