TW200629990A - SD/MMC cards - Google Patents
SD/MMC cardsInfo
- Publication number
- TW200629990A TW200629990A TW094130016A TW94130016A TW200629990A TW 200629990 A TW200629990 A TW 200629990A TW 094130016 A TW094130016 A TW 094130016A TW 94130016 A TW94130016 A TW 94130016A TW 200629990 A TW200629990 A TW 200629990A
- Authority
- TW
- Taiwan
- Prior art keywords
- pda
- tier
- devices
- components
- card
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09018—Rigid curved substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/933,009 US20060042827A1 (en) | 2004-09-02 | 2004-09-02 | SD/MMC cards |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200629990A true TW200629990A (en) | 2006-08-16 |
Family
ID=35432694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094130016A TW200629990A (en) | 2004-09-02 | 2005-09-02 | SD/MMC cards |
Country Status (6)
Country | Link |
---|---|
US (1) | US20060042827A1 (zh) |
EP (1) | EP1632887A2 (zh) |
JP (1) | JP2006323803A (zh) |
KR (1) | KR20060050979A (zh) |
CN (1) | CN1831852A (zh) |
TW (1) | TW200629990A (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100585163B1 (ko) * | 2004-11-27 | 2006-06-01 | 삼성전자주식회사 | 메모리 카드 및 그 제조방법 |
US7492604B2 (en) * | 2006-04-21 | 2009-02-17 | Motorola, Inc. | Electronic module interconnection apparatus |
US7995334B2 (en) * | 2010-01-06 | 2011-08-09 | Apple Inc. | Printed circuit board |
WO2012049898A1 (ja) * | 2010-10-15 | 2012-04-19 | 日本電気株式会社 | 部品内蔵モジュール及びこれを備える電子機器並びに部品内蔵モジュールの製造方法 |
US9439334B2 (en) | 2012-04-03 | 2016-09-06 | X-Card Holdings, Llc | Information carrying card comprising crosslinked polymer composition, and method of making the same |
US9122968B2 (en) | 2012-04-03 | 2015-09-01 | X-Card Holdings, Llc | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
US10906287B2 (en) | 2013-03-15 | 2021-02-02 | X-Card Holdings, Llc | Methods of making a core layer for an information carrying card, and resulting products |
KR101672530B1 (ko) * | 2015-12-17 | 2016-11-10 | 김남주 | 다중 기능을 갖는 카드 및 그 제조 방법 |
US11361204B2 (en) | 2018-03-07 | 2022-06-14 | X-Card Holdings, Llc | Metal card |
US10827617B2 (en) * | 2019-01-29 | 2020-11-03 | Avago Technologies International Sales Pte. Limited | Printed circuit board with cavity |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6069793A (en) * | 1997-01-24 | 2000-05-30 | Hitachi, Ltd. | Circuit module and information processing apparatus |
JP2000174399A (ja) * | 1998-12-01 | 2000-06-23 | Nhk Spring Co Ltd | 立体配線基板とその製造方法および基板用絶縁材料 |
US6965071B2 (en) * | 2001-05-10 | 2005-11-15 | Parker-Hannifin Corporation | Thermal-sprayed metallic conformal coatings used as heat spreaders |
US6843421B2 (en) * | 2001-08-13 | 2005-01-18 | Matrix Semiconductor, Inc. | Molded memory module and method of making the module absent a substrate support |
-
2004
- 2004-09-02 US US10/933,009 patent/US20060042827A1/en not_active Abandoned
-
2005
- 2005-09-02 JP JP2005254239A patent/JP2006323803A/ja active Pending
- 2005-09-02 EP EP05255373A patent/EP1632887A2/en not_active Withdrawn
- 2005-09-02 CN CNA2005100998220A patent/CN1831852A/zh active Pending
- 2005-09-02 TW TW094130016A patent/TW200629990A/zh unknown
- 2005-09-02 KR KR1020050081781A patent/KR20060050979A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP1632887A2 (en) | 2006-03-08 |
KR20060050979A (ko) | 2006-05-19 |
CN1831852A (zh) | 2006-09-13 |
US20060042827A1 (en) | 2006-03-02 |
JP2006323803A (ja) | 2006-11-30 |
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