TW200629518A - Illumination improved structure of light emitter - Google Patents

Illumination improved structure of light emitter

Info

Publication number
TW200629518A
TW200629518A TW093141714A TW93141714A TW200629518A TW 200629518 A TW200629518 A TW 200629518A TW 093141714 A TW093141714 A TW 093141714A TW 93141714 A TW93141714 A TW 93141714A TW 200629518 A TW200629518 A TW 200629518A
Authority
TW
Taiwan
Prior art keywords
light
ultraviolet
ray
emitting body
improved structure
Prior art date
Application number
TW093141714A
Other languages
Chinese (zh)
Other versions
TWI261349B (en
Inventor
Zhen-Wei Mie
Original Assignee
Zhen-Wei Mie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhen-Wei Mie filed Critical Zhen-Wei Mie
Priority to TW093141714A priority Critical patent/TWI261349B/en
Publication of TW200629518A publication Critical patent/TW200629518A/en
Application granted granted Critical
Publication of TWI261349B publication Critical patent/TWI261349B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Vessels And Coating Films For Discharge Lamps (AREA)

Abstract

This invention relates to an improved structure of brightness for light emitter. It especially relates to enhance the brightness of illumination improved structure for the ultraviolet-ray or the blue-light generating light-emitting element such as either the fluorescent lamp or LED. It comprises a light-emitting body, and a shell body. One side of the light-emitting body is coated with the fluorescent agent, which can emit the ultraviolet-ray or the blue light. The shell body surrounds around the light-emitting body, and is also coated with the fluorescence agent on the opposite side of light-emitting body on which the fluorescent is coated. By means of the ultraviolet-ray or blue-light, which emits from the light-emitting body, the fluorescent agent of the shell body can be directly excited to emit the visible light or the white light (the mixing visible light). Moreover, the one side of the light-emitting body different from the side of shell body utilizes the same fluorescent agent to prevent the human body from injury due to the ultraviolet-ray, and simultaneously is excited to emit the visible light to enhance the brightness.
TW093141714A 2004-12-31 2004-12-31 Illumination improved structure of light emitter TWI261349B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW093141714A TWI261349B (en) 2004-12-31 2004-12-31 Illumination improved structure of light emitter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093141714A TWI261349B (en) 2004-12-31 2004-12-31 Illumination improved structure of light emitter

Publications (2)

Publication Number Publication Date
TW200629518A true TW200629518A (en) 2006-08-16
TWI261349B TWI261349B (en) 2006-09-01

Family

ID=37876158

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093141714A TWI261349B (en) 2004-12-31 2004-12-31 Illumination improved structure of light emitter

Country Status (1)

Country Link
TW (1) TWI261349B (en)

Also Published As

Publication number Publication date
TWI261349B (en) 2006-09-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees