TW200629518A - Illumination improved structure of light emitter - Google Patents
Illumination improved structure of light emitterInfo
- Publication number
- TW200629518A TW200629518A TW093141714A TW93141714A TW200629518A TW 200629518 A TW200629518 A TW 200629518A TW 093141714 A TW093141714 A TW 093141714A TW 93141714 A TW93141714 A TW 93141714A TW 200629518 A TW200629518 A TW 200629518A
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- ultraviolet
- ray
- emitting body
- improved structure
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Vessels And Coating Films For Discharge Lamps (AREA)
Abstract
This invention relates to an improved structure of brightness for light emitter. It especially relates to enhance the brightness of illumination improved structure for the ultraviolet-ray or the blue-light generating light-emitting element such as either the fluorescent lamp or LED. It comprises a light-emitting body, and a shell body. One side of the light-emitting body is coated with the fluorescent agent, which can emit the ultraviolet-ray or the blue light. The shell body surrounds around the light-emitting body, and is also coated with the fluorescence agent on the opposite side of light-emitting body on which the fluorescent is coated. By means of the ultraviolet-ray or blue-light, which emits from the light-emitting body, the fluorescent agent of the shell body can be directly excited to emit the visible light or the white light (the mixing visible light). Moreover, the one side of the light-emitting body different from the side of shell body utilizes the same fluorescent agent to prevent the human body from injury due to the ultraviolet-ray, and simultaneously is excited to emit the visible light to enhance the brightness.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093141714A TWI261349B (en) | 2004-12-31 | 2004-12-31 | Illumination improved structure of light emitter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093141714A TWI261349B (en) | 2004-12-31 | 2004-12-31 | Illumination improved structure of light emitter |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200629518A true TW200629518A (en) | 2006-08-16 |
TWI261349B TWI261349B (en) | 2006-09-01 |
Family
ID=37876158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093141714A TWI261349B (en) | 2004-12-31 | 2004-12-31 | Illumination improved structure of light emitter |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI261349B (en) |
-
2004
- 2004-12-31 TW TW093141714A patent/TWI261349B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI261349B (en) | 2006-09-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |