TW200629435A - Pre-laid electroconductive thin film package and molding method thereof - Google Patents

Pre-laid electroconductive thin film package and molding method thereof

Info

Publication number
TW200629435A
TW200629435A TW094103389A TW94103389A TW200629435A TW 200629435 A TW200629435 A TW 200629435A TW 094103389 A TW094103389 A TW 094103389A TW 94103389 A TW94103389 A TW 94103389A TW 200629435 A TW200629435 A TW 200629435A
Authority
TW
Taiwan
Prior art keywords
thin film
electro
laid
molding method
film package
Prior art date
Application number
TW094103389A
Other languages
Chinese (zh)
Inventor
Ming-Te Tsou
Original Assignee
Ming-Te Tsou
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ming-Te Tsou filed Critical Ming-Te Tsou
Priority to TW094103389A priority Critical patent/TW200629435A/en
Publication of TW200629435A publication Critical patent/TW200629435A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9212—Sequential connecting processes
    • H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
    • H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invented pre-laid electro-conductive thin film comprises electro-conductive particles and a polymer thin film, in which the electro-conductive particles are fixed onto the polymer thin film or pressed into the thin film in an array or predetermined positions. During the packaging operation, the pre-laid electro-conductive thin film is placed between two electrodes made from two or more kinds of material. Based on predetermined conditions such as pressure, temperature, heating time, etc., the polymer material therein is adhered and solidified so that the electro-conductive particles contact the two electrodes so as to combine the two electrodes thereby achieving the objective of electrical connection.
TW094103389A 2005-02-03 2005-02-03 Pre-laid electroconductive thin film package and molding method thereof TW200629435A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094103389A TW200629435A (en) 2005-02-03 2005-02-03 Pre-laid electroconductive thin film package and molding method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094103389A TW200629435A (en) 2005-02-03 2005-02-03 Pre-laid electroconductive thin film package and molding method thereof

Publications (1)

Publication Number Publication Date
TW200629435A true TW200629435A (en) 2006-08-16

Family

ID=57808978

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094103389A TW200629435A (en) 2005-02-03 2005-02-03 Pre-laid electroconductive thin film package and molding method thereof

Country Status (1)

Country Link
TW (1) TW200629435A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI613679B (en) * 2011-09-15 2018-02-01 兆科學公司 Microcavity carrier belt and method of manufacture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI613679B (en) * 2011-09-15 2018-02-01 兆科學公司 Microcavity carrier belt and method of manufacture

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