TW200628635A - Plating resin molding body - Google Patents

Plating resin molding body

Info

Publication number
TW200628635A
TW200628635A TW094141388A TW94141388A TW200628635A TW 200628635 A TW200628635 A TW 200628635A TW 094141388 A TW094141388 A TW 094141388A TW 94141388 A TW94141388 A TW 94141388A TW 200628635 A TW200628635 A TW 200628635A
Authority
TW
Taiwan
Prior art keywords
molding body
plating
resin molding
resin
excluded
Prior art date
Application number
TW094141388A
Other languages
Chinese (zh)
Inventor
Toshihiro Tai
wei-hong Gu
Tatsuo Izumiya
Original Assignee
Daicel Polymer Ltd
Daicel Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Polymer Ltd, Daicel Chem filed Critical Daicel Polymer Ltd
Publication of TW200628635A publication Critical patent/TW200628635A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/06—Coating with compositions not containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers

Abstract

This invention provides a plating resin molding body with high adhesive strength of plating. Specifically, this invention provides a plating resin molding body consisted of (A) a polyamide resin having crystal melting calorie more than 10 J/g, (B) a polyamide resin other than those of (A), the polyphenylene ether resin is excluded, and (C) a resin composition containing the required dissolvable agents; wherein the etching process using chrome and/or manganese-containing acids are excluded. Further, the plating resin molding body has a metallic plating layer formed on the surface of the resin molding body to which a part of non-crystal part of the (A) elements are fallen down.
TW094141388A 2004-11-26 2005-11-25 Plating resin molding body TW200628635A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004341448A JP2006152041A (en) 2004-11-26 2004-11-26 Molded resin article having plated layer

Publications (1)

Publication Number Publication Date
TW200628635A true TW200628635A (en) 2006-08-16

Family

ID=36498105

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094141388A TW200628635A (en) 2004-11-26 2005-11-25 Plating resin molding body

Country Status (3)

Country Link
JP (1) JP2006152041A (en)
TW (1) TW200628635A (en)
WO (1) WO2006057372A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5364237B2 (en) * 2006-08-28 2013-12-11 ダイセルポリマー株式会社 Plating resin molding
US20110135949A1 (en) * 2009-12-08 2011-06-09 E. I. Du Pont De Nemours And Company Metal-Coated Plastic Articles and Methods Therefor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI224120B (en) * 2001-09-11 2004-11-21 Daicel Polymer Ltd Process for manufacturing plated resin molded article

Also Published As

Publication number Publication date
JP2006152041A (en) 2006-06-15
WO2006057372A1 (en) 2006-06-01

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