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Application filed by Tdk CorpfiledCriticalTdk Corp
Publication of TW200628257ApublicationCriticalpatent/TW200628257A/en
Application grantedgrantedCritical
Publication of TWI347242BpublicationCriticalpatent/TWI347242B/en
Electric Connection Of Electric Components To Printed Circuits
(AREA)
Thermistors And Varistors
(AREA)
Motor Or Generator Current Collectors
(AREA)
Abstract
The present invention is directed to a method for forming a soldering layer with a constant thickness easily and efficiently. When forming a soldering layer on a surface of an electrode, molten solder is provided to the surface of the electrode with a distance, thereby a soldering layer is formed on the surface of the electrode.
TW094144987A2004-12-202005-12-19Method for forming a soldering layer
TWI347242B
(en)