CN1794371A - Welding layer forming method - Google Patents
Welding layer forming method Download PDFInfo
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- CN1794371A CN1794371A CN 200510136174 CN200510136174A CN1794371A CN 1794371 A CN1794371 A CN 1794371A CN 200510136174 CN200510136174 CN 200510136174 CN 200510136174 A CN200510136174 A CN 200510136174A CN 1794371 A CN1794371 A CN 1794371A
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Abstract
The invention relates to a method for forming a solder layer having a predetermined thickness easily and efficiently. When a solder layer is formed on the surface of an electrode, a quantity of molten solder is supplied onto the surface of the electrode at a distance therefrom. Consequently, a solder layer is formed on the surface of the electrode.
Description
Technical field
The present invention relates to solder layer formation method.In more detail, relate in various electronic units and circuit substrate etc., form the solder layer formation method of the solder layer that is fit to of even height on the surface of the electrode layer that is used for electrode etc.
Background technology
Miniaturization, densification and complicated along with electric/electronic, in various electronic units and circuit substrate as its component parts, the change of the layer thickness of the standby solder layer that provides in advance and inconsistent reliability generation influence greatly to electric/electronic.For example, in electronic unit, on same plane a plurality of electrodes are arranged, standby solder layer is set on the surface of these electrodes, utilize standby solder layer, need be with the counterpart of the relative electric/electronic of corresponding electronic unit, carry out under the situation of soldering at grade, if the variable thickness of standby solder layer causes, then electronic unit is obliquely by soldering, soldering is incomplete, and the reliability of soldering might suffer damage.Also produce same problem when on circuit substrate, forming standby solder layer.
Make the certain prior art of thickness of standby solder layer, for example be disclosed in patent documentation 1.In patent documentation 1 in the disclosed existing method, in the pad on being arranged at printed base plate behind the coating solder flux, suck the scolder in solder core in advance and supply on the pad with the flatiron fusing.Then, with the scolder on the flatiron absorption pad, making thickness is that the scolder of counting about μ m is retained on the pad, finishes standby soldering.
But, in above-mentioned example in the past, owing to the pad that nuzzles up with flatiron, so on pad, produce damage, perhaps because at scolder drawing flatiron and pad is peeled off under the state of fusion not, and the operation that need bother equally, so the shortcoming (Japanese patent laid-open 05-007073 communique 0004 section) of operating efficiency difference is arranged to all pads on the printed base plate.
And, patent documentation 1 discloses the means that following method conduct addresses the above problem: standby solder wire reticulated printing is supplied with on the plate at the scolder that Pai Ruikesi (Pyrex) glass constitutes, after this, scolder supplied with that plate is crimped on the printed base plate and fix scolder and supply with plate by magnet and mask (mask) and foundary weight, then, the standby scolder that scolder is supplied with on the plate flows backwards and the standby scolder of supply on described pad.
But, this method in Pai Ruikesi silk screen printing on glass behind the standby scolder, the scolder that also needs to obtain is supplied with the operation of standby scolder transfer printing on pad on the plate, needs complicated step.In addition, because this method is the application of considering circuit substrate etc., so there be not the application of teaching to electronic unit.
Summary of the invention
The technical problem that will solve of the present invention provides can be simply and form the solder layer formation method of the solder layer of specific thickness expeditiously.
Another technical problem that the present invention will solve provides main to small electronic unit, can be simply and form the solder layer formation method of the solder layer of specific thickness expeditiously.
Another technical problem that the present invention will solve provides the electronic unit with electrode structure of having used above-mentioned solder layer formation method, in particular as the noise absorber element of the parts of the noise that absorbs dc micro-motor.
Another technical problem that the present invention will solve provides the dc micro-motor of the above-mentioned noise absorber element of having packed into.
In order to solve the problems of the technologies described above, when solder layer formation method of the present invention forms solder layer at electrode surface, with the fusion welding of ormal weight from described electrode surface partition distance supply to described electrode surface, on described electrode surface, form solder layer thus.In the present invention, electrode refers to use metal material or alloy material and forms membranaceous structure.
As above-mentioned, in the method for the invention, the fusion welding of ormal weight is supplied to electrode surface.The fusion welding that supplies to electrode surface has flowability, so widen at electrode surface.
At this moment, for example, if such heater blocks such as flatiron are directly contacted scolder and make its fusion, then heater block self becomes obstacle for the diffuses flow of scolder, hinders the diffusion into the surface of scolder.
In the present invention, for fear of such undesirable condition,, electrode surface is supplied with fusion welding from electrode surface partition distance ground.According to this structure, because relatively the fusion welding heater block that becomes the diffuses flow obstacle does not exist fully at electrode surface, thus can with fusion welding along with its oneself diffuses flow on electrode surface to all directions diffuses flow equably roughly.
Therefore,, only be defined the solder attachment face of area, just the layer thickness of solder layer can be controlled in the certain value by setting at electrode surface.
And, only be the weight of fusion welding for the external force of object, so the soldering that produces with flatiron is different, even the object mechanical strength a little less than, do not have breakage yet.Utilize nature to fall,, for object, belong to the very easy method that causes damaged excessive external force that do not apply to the drip method of fusion welding of the surface of electrode.In order easily to carry out dripping of fusion welding, the operation or the mode that comprise fusion welding provides mechanicalness vibration, the inboard of nozzle blows out faint hot blast etc. under the solder droplets get final product.
When forming solder layer, preferably comprise operation at least with the supporting mass preheating of the surperficial of electrode or supporting electrode.The effect of this preheating is in slim variable resistor (バ リ ス ), remarkable especially.Can avoid the variable resistor matrix to be subjected to thermal shock and breakage.
In addition, in order to widen the face of the fusion welding that is fed into electrode surface sleekly, preferably apply solder flux etc. at electrode surface.
Concrete mode as the fusion welding of supplying with ormal weight, can adopt following structure: the solid solder that will have fixed volume is supplied with the heating part, in the heating part, makes the solid solder fusion of supply, obtains the fusion welding of ormal weight.In this case, the supply port of the fusion welding of heating part is set at the position that separates the space length of regulation from electrode surface.
The invention also discloses electronic unit with the electrode structure that has adopted above-mentioned solder layer formation method.This electronic unit has the electrode that has been attached solder layer in one side.Described electrode has the solder attachment face of reduced regulation area in its face.Described solder attachment face is distinguished from the remainder of described electrode by the non-cohesive zone of the scolder in the face that is formed on described electrode.
In this electronic unit, adopted under the situation of solder layer formation method of the present invention, only supply with fusion welding at the solder attachment face of electrode, formation has definite certain thickness solder layer by the area of fusion welding amount of supplying with and solder attachment face on the solder attachment face.
The non-cohesive zone of described scolder can be described electrode partly to be eliminated and the zone that forms, also can be the zone that forms by attached to the non-cohesive material of the scolder on the described electrode.In addition, the figure in the non-cohesive zone of scolder can be arbitrarily.
The preferred example of the kind of electronic unit is toroidal rheostat, ring-plate capacitor, ring resistance device or the annular RC element that has capacitor and resistor simultaneously.They can be used as the noise absorber element of dc micro-motor, promptly are absorbed in the element of the noise that produces in the commutator.
In dc micro-motor, described noise absorber element by coaxial shape be installed on the electric machine rotational axis, in the face of the commutator plate that conducts with the motor commutator segment, and soldered.
Other features of the present invention and consequent action effect illustrate in greater detail with reference to the accompanying drawings and by embodiment.
Description of drawings
Fig. 1 is illustrated in the figure of the operation that comprises in the solder layer formation method of the present invention;
Fig. 2 represents the figure of the operation after the operation shown in Figure 1;
Fig. 3 represents the figure of the operation after the operation shown in Figure 2;
Fig. 4 represents the figure of the operation after the operation shown in Figure 3;
Fig. 5 represents the figure of the operation after the operation shown in Figure 4;
Fig. 6 represents the figure of the operation after the operation shown in Figure 5;
Fig. 7 is the variable-resistance plane graph as the noise absorber element of dc micro-motor;
Fig. 8 is the profile along the 8-8 line of Fig. 7;
Fig. 9 represents that solder layer formation method according to the present invention has formed the variable-resistance plane graph of solder layer;
Figure 10 represent as the noise absorber element of dc micro-motor variable-resistance another
The plane graph of embodiment;
Figure 11 is the profile along the 11-11 line of Figure 10;
Figure 12 represent as the noise absorber element of dc micro-motor variable-resistance another
The plane graph of embodiment;
Figure 13 represent as the noise absorber element of dc micro-motor variable-resistance another
The plane graph of embodiment; And
Figure 14 is that expression is with the part sectioned view of electronic unit of the present invention as the part of the dc micro-motor of noise absorber element.
Embodiment
Referring to figs. 1 through Fig. 6, in solder layer formation method of the present invention, at first, in it is implemented, below the cut-out portion 1 that cuts off the scolder 2 supplied with continuously with fixed dimension and this cut-out portion 1, prepare the solder sheet that is cut into fixed dimension by cut-out portion 1 is heated and makes the heating part 3 of its fusion.Heating part 3 has heating element, as heating element, adopts nichrome heater or ceramic heater.In addition, also can be to use ceramic heater and with heating element and the incorporate mode of nozzle.
Below heating part 3, devices spaced apart D1 place forms the object 4 of object, has for example disposed object 4 adhesive electrodes 42 on the one side of supporting mass 41 of electronic unit and circuit substrate etc. as solder layer.Make this electrode 42 be positioned at heating part 3 fusion welding outlet 31 under.Be set to such size from interval (highly) D1 of the fusion welding outlet 31 of surface to the heating part 3 of electrode 42: from the heating part 3 fusion weldings of supplying with in fact can not cool off attached to the surface of electrode 42, and do not touch the fusion welding that adheres to.
When the surface of electrode 42 forms solder layer, at first, as shown in Figure 1, scolder 2 fixed dimension on the direction of representing with arrow X is carried, then, as shown in Figure 2, cut-out portion 1 is moved on the direction shown in the arrow Y, cut off the leading section of scolder 2 by fixed dimension L1.
Cut solder sheet 21 drops to the inside of heating part 3 shown in arrow Y1 among Fig. 3, and in the heating part 3 inside be heated, fusion.In Fig. 3, solder sheet 21 is described to former state ground and freely falls, but heating part 3 forms temporary transient maintenance solder sheet 21 and is heated to molten condition.
As described above, in the method for the invention, the fusion welding 22 of ormal weight is supplied to the surface of electrode 42.The fusion welding 22 that supplies to the surface of electrode 42 has flowability, so widen on the surface of electrode 42.
At this moment, for example, if make such heater block such as flatiron directly contact scolder and make its fusion, then heater block self constitutes obstacle for the diffuses flow of scolder, hinders the face of scolder and widens.In addition, be under the situation of variable resistor etc. at object 4, also have the variable resistor matrix because of the damaged danger of the pressing force of flatiron.
In the present invention, from the surperficial partition distance D1 of electrode 42, fusion welding 22 is supplied with on the surface of electrode 42.According to this structure, the heater block that constitutes the diffuses flow obstacles for fusion welding 22 does not exist fully on the surface of electrode 42, thus can with fusion welding 22 along with its diffuses flow on the surface of electrode 42 to all directions diffuses flow equably roughly.
Therefore,, only be defined the solder attachment face of area, just the layer thickness of solder layer 24 can be controlled in the certain value by setting on the surface of electrode 42.That is, be V1 if establish the amount (volume) of fusion welding 22, the area of solder attachment face is S1, then the thickness T 1 of the solder layer 24 that forms on the surface of electrode 42 is
T1=V1/S1 here, the amount V1 of fusion welding 22 is ormal weight (a certain amount of), so the thickness T 1 of solder layer 24 is a certain value.
And, be the weight of fusion welding 22 for the external force of object 4, so the solder attachment that produces with flatiron is different,, do not produce breakage even object 4 is the weak objects of mechanical strength yet.Under the situation of illustrated embodiment, utilize nature to fall, fusion welding 22 drips on the surface of electrode 42.This method belongs to for object 4, does not apply the extremely easy method that can produce damaged excessive external force.
When forming solder layer, preferably comprise the operation that the supporting mass to the surface of electrode 42 or supporting electrode carries out preheating at least.Preheat temperature is from the surface of electrode 42, and 100～300 ℃ scope is suitable.Thus, can prevent the cause thermal damage of object 4.
In addition, for the face of the fusion welding 22 on the surface that will supply to electrode 42 is widened sleekly, preferably at surface applied solder flux of electrode 42 etc.
The invention also discloses electronic unit with the electrode structure that has adopted above-mentioned solder layer formation method.Below, with reference to Fig. 7～Figure 13 this respect is described.
At first, Fig. 7 and variable resistor shown in Figure 8 have the centre bore 5 of the rotating shaft that passes dc micro-motor, on the one side of the variable resistor matrix 41 that the suitable shape with circular grade is shaped, form the structure that is provided with a plurality of electrodes 42～44 corresponding with the armature number of poles of dc micro-motor.Electrode 42～44 is an electrode, is provided with clearance for insulation G1～G3 each other.In diagram, only illustrate three electrodes 42～44, but as above-mentioned, its number is selected according to the armature number of poles of dc micro-motor.
Electrode 42 has the solder attachment face 422 of reduced regulation area in its face.Solder attachment face 422 is distinguished from the remainder 421,423 of electrode 42 by the scolder that forms in the face of electrode 42 non-cohesive regional 51,52.Non-cohesive regional 51,52 intervals that separate regulation of scolder are provided with, and extend from interior all side direction outer circumferential sides.Between the outer circumferential side front end and neighboring of scolder non-cohesive regional 51,52, be provided with the narrow interval of the circulation that can stop fusion welding.
Illustrated scolder non-cohesive regional 51,52 is for partly eliminating form slot-shaped with electrode 42.Its figure is not limited to illustrated linearity, can be curve-like, also can be the mode that scatter in long quadrangle slit.
In illustrated variable resistor, under the situation of the solder layer formation method of the present invention that has adopted Fig. 1～shown in Figure 6, only the solder attachment face 422,432,442 of electrode 42～44 is supplied with fusion welding, formation has the certain thickness solder layer of being determined by the area of fusion welding amount of supplying with and non-cohesive regional 51～56 solder attachment faces of being distinguished 422,432,442 of scolder on solder attachment face 422,432,442.
In addition, when adopting solder layer formation method of the present invention, preferably variable resistor is carried out preheating.Preheat temperature is suitable in 100～300 ℃ scope.If in this temperature range, then can avoid the breakage that causes as the heat of the variable resistor matrix of problem in the past.
Fig. 9 represents to have formed according to above-mentioned solder layer formation method the variable-resistance plane graph of solder layer.Supply to the fusion welding of the solder attachment face 422,432,442 of electrode 42～44, its diffuses flow is stoped because of scolder non-cohesive regional 51～56, only limited ground diffuses flow in the face of the solder attachment face 422,432,442 of electrode 42～44.Therefore, on each face of solder attachment face 422,432,442, formation has the certain thickness solder layer of being determined by the area of fusion welding amount of supplying with and non-cohesive regional 51～56 solder attachment faces of being distinguished 422,432,442 of scolder 241～243.
Figure 10 represents that Figure 11 is the profile along the 11-11 line of Figure 10 as the plane graph of variable-resistance another embodiment of the noise absorber element of dc micro-motor.In the drawings, to Fig. 7 and Fig. 8 in the corresponding part of structure division that shows, additional identical with reference to label, and omit repeat specification.
At first, observe electrode 42, the scolder non-cohesive regional 51,52 of delimiting the solder attachment face 422 of reduced regulation area is made of the electrode material of the material that is difficult for attached solder, for example various resists, selection etc.The be spaced interval of regulation of the scolder of these materials non-cohesive regional 51,52 is provided with, and extends from interior all side direction outer circumferential side.Between the outer circumferential side front end and neighboring of scolder non-cohesive regional 51,52, be provided with the narrow interval of the circulation that can stop fusion welding.Its figure is not limited to illustrated linearity, can be curve-like, also can be distribution method.In addition, under the situation of the two-layer electrode structure of wetting layers such as matrix adhesion layer that comprises Ag alloy (Ag-Ga, Ag-Zn) etc. and Ag, by delimiting or limit the zone of wetting layer, can constitute the solder attachment face of reduced regulation area, can form and have certain thickness solder layer.
In illustrated variable resistor, under the situation of the solder layer formation method of the present invention that has adopted Fig. 1～shown in Figure 6, only the solder attachment face 422,432,442 of electrode 42～44 is supplied with fusion welding, formation has the certain thickness solder layer of being determined by the area of fusion welding amount of supplying with and non-cohesive regional 51～56 solder attachment faces of being distinguished 422,432,442 of scolder on solder attachment face 422,432,442.
Figure 12 is the plane graph of expression as variable-resistance another embodiment of the noise absorber element of dc micro-motor.In the drawings, to Fig. 7 and Fig. 8 in the corresponding part of structure division that presents, attached with same with reference to label, and omit repeat specification.
At first, observe electrode 42, scolder non-cohesive regional 51,52 forms, and scatters scolder non-cohesive 511,521 from interior all side direction outer circumferential sides, and as a whole, they have the function of the diffuses flow that stops fusion welding.Non-cohesive 511 in scolder, 521 is made of slit or the above-mentioned material that is difficult for attached solder etc.Interval between non-cohesive 521-521 of interval, scolder between non-cohesive 511-511 of scolder is set at the narrow interval of the diffuses flow that stops fusion welding.Non-cohesive regional 51,52 the figure of scolder is not limited to illustrated linearity, also can be curve-like.
Secondly, in electrode 44, scolder non-cohesive regional 55,56 scatters scolder non-cohesive 551,561 from interior all side direction outer circumferential sides, and as a whole, they have the function of the diffuses flow that stops fusion welding.
Under variable-resistance situation shown in Figure 12, under the situation of the solder layer formation method of the present invention that has adopted Fig. 1～shown in Figure 6, only the solder attachment face 422,432,442 of electrode 42～44 is supplied with fusion welding, formation has the certain thickness solder layer of being determined by the area of fusion welding amount of supplying with and non-cohesive regional 51～56 solder attachment faces of being distinguished 422,432,442 of scolder on solder attachment face 422,432,442.
Figure 13 is the plane graph of expression as variable-resistance another embodiment of the noise absorber element of dc micro-motor.In the drawings, to Fig. 7 and Fig. 8 in the corresponding part of structure division that presents, attached with same with reference to label, and omit repeat specification.
At first, observe electrode 42, on the entire electrode face that non-cohesive regional 51,52 both sides that cover solder attachment face 422 of scolder of division solder attachment face 422 are widened.Scolder non-cohesive regional 51,52 is by the material that is difficult for attached solder, the formations such as electrode material of for example various resists, selection.
Secondly, in electrode 43, on the entire electrode face that non-cohesive regional 53,54 both sides that cover solder attachment face 432 of scolder of division solder attachment face 432 are widened.In electrode 44, in the entire electrode face that non-cohesive regional 55,56 both sides that cover solder attachment face 442 of scolder of division solder attachment face 442 are widened.
Under the variable-resistance situation shown in Figure 14, under the situation of the solder layer formation method of the present invention that adopts Fig. 1～shown in Figure 6, only the solder attachment face 422,432,442 of electrode 42～44 is supplied with fusion welding, formation has the certain thickness solder layer of being determined by the area of fusion welding amount of supplying with and non-cohesive regional 51～56 solder attachment faces of being distinguished 422,432,442 of scolder on the face of solder attachment face 422,432,442.
In the above-described embodiments, be that example is illustrated with the toroidal rheostat, but in addition, ring-plate capacitor, ring resistance device or annular RC element of having capacitor and resistor simultaneously etc. are also contained in the electronic unit of the present invention.
Figure 14 is that expression is with the part sectioned view of electronic unit of the present invention as the part of the dc micro-motor of noise absorber element.Dc micro-motor 6 is provided with stator (magnetic field) 62 in the inboard of exterior body 61, at the inboard of stator 63 configuration armature 63.In the rotating shaft 64 that armature 63 has been installed, the commutator segment of cutting apart according to the number of poles of armature 63 65 is disposed by coaxial shape ground.Armature 63 is by insulant 66 and rotating shaft 64 insulation.
The brace 67 that each commutator segment 65 erects on an end of armature 63 sides has direction at rotating diameter connects armature coil 68 by welding modes such as 69 on this brace 67.
On brace 67 and face in the face of the face opposition side of armature 63, noise absorber element 4 is mounted under the state of general plane.What noise absorber element 4 used is Fig. 7～variable resistor shown in Figure 13, by adopting Fig. 1～solder layer formation method shown in Figure 6, in the solder attachment zone of electrode 42～44, has been attached certain thickness solder layer 241～243.
Therefore, noise absorber element 4 does not produce inclination for brace 67, and is soldered under parastate.
As the noise absorber element, except variable resistor, use ring-plate capacitor, ring resistance device or have simultaneously capacitor and resistor annular RC element etc. situation as described above.
More than, come specifically to understand content of the present invention with reference to preferred embodiment, but according to basic technological thought of the present invention and teaching, those skilled in the art can adopt various modes of texturing.
Claims (14)
1. a solder layer formation method is used for forming solder layer on electrode surface, comprising:
With the fusion welding of ormal weight, from described electrode surface partition distance supply to described electrode surface, and on described electrode surface, form the operation of solder layer.
2. solder layer formation method as claimed in claim 1, wherein:
Described electrode surface has the solder attachment face that has been defined area.
3. solder layer formation method as claimed in claim 1, wherein:
Comprise the operation of at least described electrode surface being carried out preheating.
4. as any one described solder layer formation method of claim 1 to 3, wherein:
Comprise that the solid solder that will have prescribed volume supplies with the heating part, and in described heating part, make the described solid solder fusion of supply, with the operation of the fusion welding that obtains ormal weight.
5. as any one described solder layer formation method of claim 1 to 3, wherein:
Comprise and to drip to the operation of described electrode surface under the described fusion welding.
6. an electronic unit has the electrode that one side has been adhered to solder layer, wherein:
Described electrode has the solder attachment face of reduced regulation area in its face,
Described solder attachment face is distinguished from the remainder of described electrode by the non-cohesive zone of the scolder in the face that is formed on described electrode.
7. electronic unit as claimed in claim 6, wherein:
The non-cohesive zone of described scolder is described electrode partly to be eliminated and the zone that forms.
8. electronic unit as claimed in claim 6, wherein:
The non-cohesive zone of described scolder is the zone that forms by attached to the non-cohesive material of the scolder on the described electrode.
9. as any one described electronic unit of claim 6 to 8, wherein:
Described electronic unit is any one in toroidal rheostat, ring-plate capacitor, ring resistance device or the annular RC element that has capacitor and resistor simultaneously.
10. electronic unit as claimed in claim 9, wherein:
Described electronic unit is used as the noise absorber element.
11. a dc micro-motor has the noise absorber element, wherein:
Described noise absorber element has the electrode that has adhered to solder layer on one side, described electrode has the solder attachment face of reduced regulation area in its face, described solder attachment face is distinguished from the remainder of described electrode by the non-cohesive zone of the scolder in the face that is formed on described electrode; And
By coaxial shape be installed on the electric machine rotational axis, in the face of the brace that is connected with the motor commutator segment, and soldered.
12. dc micro-motor as claimed in claim 11, wherein:
The non-cohesive zone of described scolder is described electrode partly to be eliminated and the zone that forms.
13. dc micro-motor as claimed in claim 11, wherein:
The non-cohesive zone of described scolder is the zone that forms by attached to the non-cohesive material of the scolder on the described electrode.
14. as any one described dc micro-motor of claim 11 to 13, wherein:
Described electronic unit is any one in toroidal rheostat, ring-plate capacitor, ring resistance device or the annular RC element that has capacitor and resistor simultaneously.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP368437/2004 | 2004-12-20 | ||
| JP2004368437A JP4062628B2 (en) | 2004-12-20 | 2004-12-20 | Ring varistor, small DC motor using the same, and method of forming solder layer on ring varistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1794371A true CN1794371A (en) | 2006-06-28 |
Family
ID=36733380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510136174 Pending CN1794371A (en) | 2004-12-20 | 2005-12-20 | Welding layer forming method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4062628B2 (en) |
| CN (1) | CN1794371A (en) |
| TW (1) | TWI347242B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110640292A (en) * | 2019-09-11 | 2020-01-03 | 东莞令特电子有限公司 | Method for manufacturing electrode by using ultrasonic welding process |
-
2004
- 2004-12-20 JP JP2004368437A patent/JP4062628B2/en active Active
-
2005
- 2005-12-19 TW TW094144987A patent/TWI347242B/en active
- 2005-12-20 CN CN 200510136174 patent/CN1794371A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110640292A (en) * | 2019-09-11 | 2020-01-03 | 东莞令特电子有限公司 | Method for manufacturing electrode by using ultrasonic welding process |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4062628B2 (en) | 2008-03-19 |
| TWI347242B (en) | 2011-08-21 |
| JP2006179534A (en) | 2006-07-06 |
| TW200628257A (en) | 2006-08-16 |
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