TW200627596A - Chip packaging method and producing method of substrate having a cavity thereof - Google Patents

Chip packaging method and producing method of substrate having a cavity thereof

Info

Publication number
TW200627596A
TW200627596A TW094102059A TW94102059A TW200627596A TW 200627596 A TW200627596 A TW 200627596A TW 094102059 A TW094102059 A TW 094102059A TW 94102059 A TW94102059 A TW 94102059A TW 200627596 A TW200627596 A TW 200627596A
Authority
TW
Taiwan
Prior art keywords
substrate
cavity
chip
chip packaging
packaging method
Prior art date
Application number
TW094102059A
Other languages
Chinese (zh)
Inventor
Chi-Chao Tseng
Ching-Fu Horng
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW094102059A priority Critical patent/TW200627596A/en
Publication of TW200627596A publication Critical patent/TW200627596A/en

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  • Die Bonding (AREA)

Abstract

A chip packaging method comprises the following steps. First, a substrate, a heat sink and a chip are provided. There is a solder mask respectively on an upper surface and a bottom surface of the substrate. And the substrate forms an aperture. Then, an adhesive is applied. Afterward, the substrate and the head sink are adhered. Thereon, the chip and the heat sink are adhered. Finally, the chip and the substrate are wire-bonded.
TW094102059A 2005-01-24 2005-01-24 Chip packaging method and producing method of substrate having a cavity thereof TW200627596A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094102059A TW200627596A (en) 2005-01-24 2005-01-24 Chip packaging method and producing method of substrate having a cavity thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094102059A TW200627596A (en) 2005-01-24 2005-01-24 Chip packaging method and producing method of substrate having a cavity thereof

Publications (1)

Publication Number Publication Date
TW200627596A true TW200627596A (en) 2006-08-01

Family

ID=57808858

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094102059A TW200627596A (en) 2005-01-24 2005-01-24 Chip packaging method and producing method of substrate having a cavity thereof

Country Status (1)

Country Link
TW (1) TW200627596A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8127441B2 (en) 2007-02-09 2012-03-06 National Taiwan University Method of manufacturing ceramic/metal composite structure
US9586382B2 (en) 2008-01-24 2017-03-07 National Taiwan University Ceramic/metal composite structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8127441B2 (en) 2007-02-09 2012-03-06 National Taiwan University Method of manufacturing ceramic/metal composite structure
US9586382B2 (en) 2008-01-24 2017-03-07 National Taiwan University Ceramic/metal composite structure

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