TW200627596A - Chip packaging method and producing method of substrate having a cavity thereof - Google Patents
Chip packaging method and producing method of substrate having a cavity thereofInfo
- Publication number
- TW200627596A TW200627596A TW094102059A TW94102059A TW200627596A TW 200627596 A TW200627596 A TW 200627596A TW 094102059 A TW094102059 A TW 094102059A TW 94102059 A TW94102059 A TW 94102059A TW 200627596 A TW200627596 A TW 200627596A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- cavity
- chip
- chip packaging
- packaging method
- Prior art date
Links
Landscapes
- Die Bonding (AREA)
Abstract
A chip packaging method comprises the following steps. First, a substrate, a heat sink and a chip are provided. There is a solder mask respectively on an upper surface and a bottom surface of the substrate. And the substrate forms an aperture. Then, an adhesive is applied. Afterward, the substrate and the head sink are adhered. Thereon, the chip and the heat sink are adhered. Finally, the chip and the substrate are wire-bonded.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094102059A TW200627596A (en) | 2005-01-24 | 2005-01-24 | Chip packaging method and producing method of substrate having a cavity thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094102059A TW200627596A (en) | 2005-01-24 | 2005-01-24 | Chip packaging method and producing method of substrate having a cavity thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200627596A true TW200627596A (en) | 2006-08-01 |
Family
ID=57808858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094102059A TW200627596A (en) | 2005-01-24 | 2005-01-24 | Chip packaging method and producing method of substrate having a cavity thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200627596A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8127441B2 (en) | 2007-02-09 | 2012-03-06 | National Taiwan University | Method of manufacturing ceramic/metal composite structure |
US9586382B2 (en) | 2008-01-24 | 2017-03-07 | National Taiwan University | Ceramic/metal composite structure |
-
2005
- 2005-01-24 TW TW094102059A patent/TW200627596A/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8127441B2 (en) | 2007-02-09 | 2012-03-06 | National Taiwan University | Method of manufacturing ceramic/metal composite structure |
US9586382B2 (en) | 2008-01-24 | 2017-03-07 | National Taiwan University | Ceramic/metal composite structure |
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