TW200626289A - An optimized grooving structure for a CMP polishing pad - Google Patents

An optimized grooving structure for a CMP polishing pad

Info

Publication number
TW200626289A
TW200626289A TW094128914A TW94128914A TW200626289A TW 200626289 A TW200626289 A TW 200626289A TW 094128914 A TW094128914 A TW 094128914A TW 94128914 A TW94128914 A TW 94128914A TW 200626289 A TW200626289 A TW 200626289A
Authority
TW
Taiwan
Prior art keywords
polishing pad
optimized
cmp polishing
grooving structure
grooves
Prior art date
Application number
TW094128914A
Other languages
English (en)
Inventor
Peter Renteln
Original Assignee
J H Rhodes Company Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by J H Rhodes Company Inc filed Critical J H Rhodes Company Inc
Publication of TW200626289A publication Critical patent/TW200626289A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW094128914A 2004-08-25 2005-08-24 An optimized grooving structure for a CMP polishing pad TW200626289A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/924,835 US7252582B2 (en) 2004-08-25 2004-08-25 Optimized grooving structure for a CMP polishing pad

Publications (1)

Publication Number Publication Date
TW200626289A true TW200626289A (en) 2006-08-01

Family

ID=35462346

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094128914A TW200626289A (en) 2004-08-25 2005-08-24 An optimized grooving structure for a CMP polishing pad

Country Status (3)

Country Link
US (1) US7252582B2 (zh)
TW (1) TW200626289A (zh)
WO (1) WO2006026271A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7991216B2 (en) 2007-06-15 2011-08-02 National Taiwan University Of Science And Technology Method of analyzing effective polishing frequency and number of polishing times on polishing pads having different patterns and profiles

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006245445A (ja) * 2005-03-07 2006-09-14 Nihon Micro Coating Co Ltd 研磨パッド
KR100818523B1 (ko) * 2006-08-17 2008-03-31 동부일렉트로닉스 주식회사 연마 패드
US7544115B2 (en) * 2007-09-20 2009-06-09 Novellus Systems, Inc. Chemical mechanical polishing assembly with altered polishing pad topographical components
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
WO2012036444A2 (ko) * 2010-09-15 2012-03-22 주식회사 엘지화학 Cmp용 연마 패드
US9687956B2 (en) * 2012-11-06 2017-06-27 Cabot Microelectronics Corporation Polishing pad with offset concentric grooving pattern and method for polishing a substrate therewith
US9308620B2 (en) 2013-09-18 2016-04-12 Texas Instruments Incorporated Permeated grooving in CMP polishing pads
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
DE102015104467A1 (de) * 2015-03-25 2016-09-29 Acsys Lasertechnik Gmbh Verfahren zur Strukturerzeugung
TW201726881A (zh) 2015-10-02 2017-08-01 ３Ｍ新設資產公司 乾牆砂磨塊及其使用方法
TWI595968B (zh) * 2016-08-11 2017-08-21 宋建宏 研磨墊及其製造方法
USD897117S1 (en) * 2019-01-14 2020-09-29 Kimberly-Clark Worldwide, Inc. Absorbent sheet
USD995124S1 (en) * 2020-10-09 2023-08-15 Kimberly-Clark Worldwide, Inc. Tissue

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DE7619792U1 (de) * 1976-06-23 1977-03-17 Fa. Carl Freudenberg, 6940 Weinheim Schleif- und reinigungstuch
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
JP3042593B2 (ja) * 1995-10-25 2000-05-15 日本電気株式会社 研磨パッド
US6019666A (en) * 1997-05-09 2000-02-01 Rodel Holdings Inc. Mosaic polishing pads and methods relating thereto
US5921855A (en) * 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US6254456B1 (en) * 1997-09-26 2001-07-03 Lsi Logic Corporation Modifying contact areas of a polishing pad to promote uniform removal rates
US5990012A (en) * 1998-01-27 1999-11-23 Micron Technology, Inc. Chemical-mechanical polishing of hydrophobic materials by use of incorporated-particle polishing pads
CN1312742C (zh) 1999-03-30 2007-04-25 株式会社尼康 抛光垫、抛光机及制造半导体器件的方法
US6869343B2 (en) * 2001-12-19 2005-03-22 Toho Engineering Kabushiki Kaisha Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
US6241596B1 (en) * 2000-01-14 2001-06-05 Applied Materials, Inc. Method and apparatus for chemical mechanical polishing using a patterned pad
US6533645B2 (en) * 2000-01-18 2003-03-18 Applied Materials, Inc. Substrate polishing article
US6736709B1 (en) * 2000-05-27 2004-05-18 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
US6749485B1 (en) * 2000-05-27 2004-06-15 Rodel Holdings, Inc. Hydrolytically stable grooved polishing pads for chemical mechanical planarization
KR20030015567A (ko) * 2001-08-16 2003-02-25 에스케이에버텍 주식회사 웨이브 형태의 그루브가 형성된 화학적 기계적 연마패드
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
TWI250572B (en) 2002-06-03 2006-03-01 Jsr Corp Polishing pad and multi-layer polishing pad

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7991216B2 (en) 2007-06-15 2011-08-02 National Taiwan University Of Science And Technology Method of analyzing effective polishing frequency and number of polishing times on polishing pads having different patterns and profiles

Also Published As

Publication number Publication date
US20060046626A1 (en) 2006-03-02
WO2006026271A1 (en) 2006-03-09
US7252582B2 (en) 2007-08-07

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