TW200626272A - A constant-temperature control device and method for de-soldering - Google Patents

A constant-temperature control device and method for de-soldering

Info

Publication number
TW200626272A
TW200626272A TW094102330A TW94102330A TW200626272A TW 200626272 A TW200626272 A TW 200626272A TW 094102330 A TW094102330 A TW 094102330A TW 94102330 A TW94102330 A TW 94102330A TW 200626272 A TW200626272 A TW 200626272A
Authority
TW
Taiwan
Prior art keywords
soldering
constant
control device
electronic element
temperature control
Prior art date
Application number
TW094102330A
Other languages
Chinese (zh)
Other versions
TWI268827B (en
Inventor
Chia-Ching Lin
Original Assignee
Mitac Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitac Prec Technology Corp filed Critical Mitac Prec Technology Corp
Priority to TW94102330A priority Critical patent/TWI268827B/en
Publication of TW200626272A publication Critical patent/TW200626272A/en
Application granted granted Critical
Publication of TWI268827B publication Critical patent/TWI268827B/en

Links

Abstract

This invention relates to a constant-temperature control device and method for de-soldering, for using to measure and detect the heating temperature of electronic element, and then adjust the distance between the heating unit and the electronic elements accordingly so as to keep the temperature of the electronic element constant. Moreover, a removal device is used to remove the de-soldered electronic element automatically so as to prevent the electronic element from being damaged due to overheating during de-soldering.
TW94102330A 2005-01-26 2005-01-26 A constant-temperature control device and method for de-soldering TWI268827B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94102330A TWI268827B (en) 2005-01-26 2005-01-26 A constant-temperature control device and method for de-soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94102330A TWI268827B (en) 2005-01-26 2005-01-26 A constant-temperature control device and method for de-soldering

Publications (2)

Publication Number Publication Date
TW200626272A true TW200626272A (en) 2006-08-01
TWI268827B TWI268827B (en) 2006-12-21

Family

ID=38291344

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94102330A TWI268827B (en) 2005-01-26 2005-01-26 A constant-temperature control device and method for de-soldering

Country Status (1)

Country Link
TW (1) TWI268827B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113649661A (en) * 2021-10-20 2021-11-16 徐州全达金属制品有限公司 Electronic component dismounting device
TWI828171B (en) * 2022-06-01 2024-01-01 創新服務股份有限公司 Maintenance device and method of electronic components

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105983743A (en) * 2015-01-28 2016-10-05 泓准达科技(上海)有限公司 Desoldering method of semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113649661A (en) * 2021-10-20 2021-11-16 徐州全达金属制品有限公司 Electronic component dismounting device
CN113649661B (en) * 2021-10-20 2021-12-24 徐州全达金属制品有限公司 Electronic component dismounting device
TWI828171B (en) * 2022-06-01 2024-01-01 創新服務股份有限公司 Maintenance device and method of electronic components

Also Published As

Publication number Publication date
TWI268827B (en) 2006-12-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees