TW200626037A - Manufacture method for multiple-circuit chip with protruding electrode - Google Patents

Manufacture method for multiple-circuit chip with protruding electrode

Info

Publication number
TW200626037A
TW200626037A TW094100739A TW94100739A TW200626037A TW 200626037 A TW200626037 A TW 200626037A TW 094100739 A TW094100739 A TW 094100739A TW 94100739 A TW94100739 A TW 94100739A TW 200626037 A TW200626037 A TW 200626037A
Authority
TW
Taiwan
Prior art keywords
manufacture method
circuit chip
substrate
protruding electrode
electrode
Prior art date
Application number
TW094100739A
Other languages
Chinese (zh)
Other versions
TWI281842B (en
Inventor
mao-song Cao
cai-bao Jiang
Original Assignee
Ta I Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ta I Technology Co Ltd filed Critical Ta I Technology Co Ltd
Priority to TW94100739A priority Critical patent/TWI281842B/en
Publication of TW200626037A publication Critical patent/TW200626037A/en
Application granted granted Critical
Publication of TWI281842B publication Critical patent/TWI281842B/en

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

This invention provides a manufacture method for multiple-circuit chip with protruding electrode. Firstly, it forms an insulation layer for covering an upper surface, a lower surface, and a through hole interior wall of the substrate. The substrate possesses plural bodies allocated as an array and the body has several electrically conducting blocks allocated side by side. Further, through the upper and lower surface of the body, the left and right side of the two adjacent electrically conducting blocks. Furthermore, the substrate is vertically divided into several bands. Moreover, by sputtering upon the right-side wall and the left-side wall of the band, it forms the side electrodes. Afterwards, it divides the band into independent bodies. Eventually, it electroplates the body to form an end electrode on each side electrode.
TW94100739A 2005-01-11 2005-01-11 Manufacture method for multiple-circuit chip with protruding electrode TWI281842B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94100739A TWI281842B (en) 2005-01-11 2005-01-11 Manufacture method for multiple-circuit chip with protruding electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94100739A TWI281842B (en) 2005-01-11 2005-01-11 Manufacture method for multiple-circuit chip with protruding electrode

Publications (2)

Publication Number Publication Date
TW200626037A true TW200626037A (en) 2006-07-16
TWI281842B TWI281842B (en) 2007-05-21

Family

ID=38751666

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94100739A TWI281842B (en) 2005-01-11 2005-01-11 Manufacture method for multiple-circuit chip with protruding electrode

Country Status (1)

Country Link
TW (1) TWI281842B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI406616B (en) * 2011-02-21 2013-08-21 Viking Tech Corp Passive components and their methods
TWI411099B (en) * 2011-05-13 2013-10-01

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI406616B (en) * 2011-02-21 2013-08-21 Viking Tech Corp Passive components and their methods
TWI411099B (en) * 2011-05-13 2013-10-01

Also Published As

Publication number Publication date
TWI281842B (en) 2007-05-21

Similar Documents

Publication Publication Date Title
SG146611A1 (en) Methods of forming pluralities of capacitors
HK1129950A1 (en) Surface mountable lightemitting element
TW200711221A (en) Artificial impedance structure
TW200718564A (en) Laminate structure
WO2016053623A3 (en) Three dimensional memory device having comb-shaped source electrode and methods of making thereof
EP1830614A4 (en) Method for producing substrate having through hole filled with conductive material
TW200627288A (en) Resistive touch panel, and it manufacturing method
TW200501182A (en) A capacitor structure
WO2011087870A3 (en) Solid electrolytic capacitor and method of manufacture
WO2008108331A1 (en) Low temperature plasma generator
TW200635473A (en) Capacitor-embedded PCB having blind via hole and method of manufacturing the same
TW200509057A (en) A brightness irregularity eliminating organic el display and a manufacturing method thereof
EA201270276A1 (en) PANEL SUPPLIED BY ELECTRICALLY CONDUCTING STRUCTURES
WO2013068169A3 (en) Carrier for an electrical circuit with an integrated energy store
WO2006119753A3 (en) Electrical feedthrough component with a multilayer structure and method for the production thereof
TW200626037A (en) Manufacture method for multiple-circuit chip with protruding electrode
TW200508760A (en) Organic electroluminescent device, its manufacturing method, and electronic apparatus
WO2008061524A3 (en) Lighting element, and method for the production thereof
WO2012031728A3 (en) Capacitive distance sensor
WO2007102882A3 (en) Multiple zone sputtering target created through conductive and insulation bonding
TW200607049A (en) Method for fabricating a trench capacitor, method for fabricating a memory cell, trench capacitor and memory cell
HK1126642A1 (en) Planar electrode
TW200719364A (en) Surface mount device having a cushioning layer therein and the method of making the same
WO2008052229A3 (en) Sensor structure
WO2005074050A3 (en) Piezo actuator and a method for the production thereof

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees