TW200625518A - Fabrication of semiconductor integrated circuit chips - Google Patents
Fabrication of semiconductor integrated circuit chipsInfo
- Publication number
- TW200625518A TW200625518A TW094100617A TW94100617A TW200625518A TW 200625518 A TW200625518 A TW 200625518A TW 094100617 A TW094100617 A TW 094100617A TW 94100617 A TW94100617 A TW 94100617A TW 200625518 A TW200625518 A TW 200625518A
- Authority
- TW
- Taiwan
- Prior art keywords
- active circuit
- circuit die
- overcoat
- line region
- fabrication
- Prior art date
Links
Landscapes
- Dicing (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
A semiconductor wafer includes a plurality of active circuit die areas, each of which being bordered by a dicing line region through which the plurality of active circuit die areas are separated from each other by mechanical wafer dicing. Each of the plurality of active circuit die areas has four sides. An overcoat covers both the active circuit die areas and the dicing line region. An inter-layer dielectric layer is disposed underneath the overcoat. A reinforcement structure includes a plurality of holes formed within the dicing line region. The plurality of holes are formed by etching through the overcoat into the inter-layer dielectric layer and are disposed along the four sides of each active circuit die area. A die seal ring is disposed in between the active circuit chip area and the reinforcement structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94100617A TWI255006B (en) | 2005-01-10 | 2005-01-10 | Fabrication of semiconductor integrated circuit chips |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94100617A TWI255006B (en) | 2005-01-10 | 2005-01-10 | Fabrication of semiconductor integrated circuit chips |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI255006B TWI255006B (en) | 2006-05-11 |
TW200625518A true TW200625518A (en) | 2006-07-16 |
Family
ID=37607574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94100617A TWI255006B (en) | 2005-01-10 | 2005-01-10 | Fabrication of semiconductor integrated circuit chips |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI255006B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111162072A (en) * | 2018-11-07 | 2020-05-15 | 南亚科技股份有限公司 | Semiconductor device and method for manufacturing the same |
-
2005
- 2005-01-10 TW TW94100617A patent/TWI255006B/en active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111162072A (en) * | 2018-11-07 | 2020-05-15 | 南亚科技股份有限公司 | Semiconductor device and method for manufacturing the same |
TWI701716B (en) * | 2018-11-07 | 2020-08-11 | 南亞科技股份有限公司 | Semiconductor device and the method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
TWI255006B (en) | 2006-05-11 |
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