TW200623439A - Low noise thin photo detector device and fabrication method thereof - Google Patents

Low noise thin photo detector device and fabrication method thereof

Info

Publication number
TW200623439A
TW200623439A TW093140970A TW93140970A TW200623439A TW 200623439 A TW200623439 A TW 200623439A TW 093140970 A TW093140970 A TW 093140970A TW 93140970 A TW93140970 A TW 93140970A TW 200623439 A TW200623439 A TW 200623439A
Authority
TW
Taiwan
Prior art keywords
photo detector
low noise
detector device
fabrication method
thin photo
Prior art date
Application number
TW093140970A
Other languages
Chinese (zh)
Other versions
TWI257710B (en
Inventor
Shih-Hsien Tseng
Original Assignee
Shih-Hsien Tseng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shih-Hsien Tseng filed Critical Shih-Hsien Tseng
Priority to TW093140970A priority Critical patent/TWI257710B/en
Application granted granted Critical
Publication of TW200623439A publication Critical patent/TW200623439A/en
Publication of TWI257710B publication Critical patent/TWI257710B/en

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

An low noise thin photo detector is formed by using directly bonding the photo detector with a transparent substrate, and the bonding process is preferred use with either whole wafer manufacturing or partial wafer, which has at least one photo detector device, that offers a higher productivity and a lower cost manufacturing.
TW093140970A 2004-12-28 2004-12-28 Low noise thin photo detector device and fabrication method thereof TWI257710B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW093140970A TWI257710B (en) 2004-12-28 2004-12-28 Low noise thin photo detector device and fabrication method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093140970A TWI257710B (en) 2004-12-28 2004-12-28 Low noise thin photo detector device and fabrication method thereof

Publications (2)

Publication Number Publication Date
TW200623439A true TW200623439A (en) 2006-07-01
TWI257710B TWI257710B (en) 2006-07-01

Family

ID=37764243

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093140970A TWI257710B (en) 2004-12-28 2004-12-28 Low noise thin photo detector device and fabrication method thereof

Country Status (1)

Country Link
TW (1) TWI257710B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI749636B (en) * 2020-07-14 2021-12-11 力晶積成電子製造股份有限公司 Imaging sensing apparatus
TWI771875B (en) * 2020-01-21 2022-07-21 台灣積體電路製造股份有限公司 Image sensor device and fabrication method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI771875B (en) * 2020-01-21 2022-07-21 台灣積體電路製造股份有限公司 Image sensor device and fabrication method thereof
US11810933B2 (en) 2020-01-21 2023-11-07 Taiwan Semiconductor Manufacturing Co., Ltd. Image sensor device and fabrication method thereof
TWI749636B (en) * 2020-07-14 2021-12-11 力晶積成電子製造股份有限公司 Imaging sensing apparatus

Also Published As

Publication number Publication date
TWI257710B (en) 2006-07-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees