TW200623252A - 3 bath 1 batch type wafer cleaning apparatus - Google Patents
3 bath 1 batch type wafer cleaning apparatusInfo
- Publication number
- TW200623252A TW200623252A TW094132069A TW94132069A TW200623252A TW 200623252 A TW200623252 A TW 200623252A TW 094132069 A TW094132069 A TW 094132069A TW 94132069 A TW94132069 A TW 94132069A TW 200623252 A TW200623252 A TW 200623252A
- Authority
- TW
- Taiwan
- Prior art keywords
- bath
- cleaning
- cleaning process
- bathes
- minimize
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention relates to an automatic wafer cleaning apparatus, which performs cleaning and drying processes for a plurality of wafers in batch fashion. The apparatus includes three bathes aligned sequentially, wherein the first bath is used for performing a cleaning process with SC1, the second bath is used for performing a cleaning process with a liquid mixture of ozone water and HF, and the third bath is used for performing a final cleaning process with HF then performing a drying process by introducing nitrogen with a high temperature thereinto while repeatedly pressurizing and depressurizing its inside. Therefore, with three bathes, the apparatus can minimize its footprint and offer excellent cleaning effects, such as minimizing growth of the natural oxide layer, so that throughput improvement can be expected. Further, it is possible to minimize the consumed amount and sorts of chemicals, thereby achieving an effect of reducing costs.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004382428A JP2006156924A (en) | 2004-11-29 | 2004-11-29 | Three-tank and one-bath type automatic wafer cleaning apparatus |
KR1020050059008A KR20060059785A (en) | 2004-11-29 | 2005-07-01 | 3 bath 1 batch type wafer cleaning apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200623252A true TW200623252A (en) | 2006-07-01 |
Family
ID=36634784
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094132069A TW200623252A (en) | 2004-11-29 | 2005-09-16 | 3 bath 1 batch type wafer cleaning apparatus |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2006156924A (en) |
KR (1) | KR20060059785A (en) |
TW (1) | TW200623252A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8225804B2 (en) * | 2007-03-02 | 2012-07-24 | Safety-Kleen Systems, Inc. | Multipurpose aqueous parts washer |
KR100909337B1 (en) * | 2007-12-14 | 2009-07-24 | 주식회사 동부하이텍 | Wet cleaning method and wet cleaning device controller |
CN117059534B (en) * | 2023-10-12 | 2024-01-19 | 无锡京运通科技有限公司 | Liquid level control method and system for cleaning machine |
-
2004
- 2004-11-29 JP JP2004382428A patent/JP2006156924A/en active Pending
-
2005
- 2005-07-01 KR KR1020050059008A patent/KR20060059785A/en not_active Application Discontinuation
- 2005-09-16 TW TW094132069A patent/TW200623252A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2006156924A (en) | 2006-06-15 |
KR20060059785A (en) | 2006-06-02 |
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