TW200623252A - 3 bath 1 batch type wafer cleaning apparatus - Google Patents

3 bath 1 batch type wafer cleaning apparatus

Info

Publication number
TW200623252A
TW200623252A TW094132069A TW94132069A TW200623252A TW 200623252 A TW200623252 A TW 200623252A TW 094132069 A TW094132069 A TW 094132069A TW 94132069 A TW94132069 A TW 94132069A TW 200623252 A TW200623252 A TW 200623252A
Authority
TW
Taiwan
Prior art keywords
bath
cleaning
cleaning process
bathes
minimize
Prior art date
Application number
TW094132069A
Other languages
Chinese (zh)
Inventor
Sumio Hamatani
Sa-Mun Hong
Original Assignee
C&G Hi Tech Co Ltd
Sumio Hamatani
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by C&G Hi Tech Co Ltd, Sumio Hamatani filed Critical C&G Hi Tech Co Ltd
Publication of TW200623252A publication Critical patent/TW200623252A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers

Abstract

The present invention relates to an automatic wafer cleaning apparatus, which performs cleaning and drying processes for a plurality of wafers in batch fashion. The apparatus includes three bathes aligned sequentially, wherein the first bath is used for performing a cleaning process with SC1, the second bath is used for performing a cleaning process with a liquid mixture of ozone water and HF, and the third bath is used for performing a final cleaning process with HF then performing a drying process by introducing nitrogen with a high temperature thereinto while repeatedly pressurizing and depressurizing its inside. Therefore, with three bathes, the apparatus can minimize its footprint and offer excellent cleaning effects, such as minimizing growth of the natural oxide layer, so that throughput improvement can be expected. Further, it is possible to minimize the consumed amount and sorts of chemicals, thereby achieving an effect of reducing costs.
TW094132069A 2004-11-29 2005-09-16 3 bath 1 batch type wafer cleaning apparatus TW200623252A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004382428A JP2006156924A (en) 2004-11-29 2004-11-29 Three-tank and one-bath type automatic wafer cleaning apparatus
KR1020050059008A KR20060059785A (en) 2004-11-29 2005-07-01 3 bath 1 batch type wafer cleaning apparatus

Publications (1)

Publication Number Publication Date
TW200623252A true TW200623252A (en) 2006-07-01

Family

ID=36634784

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094132069A TW200623252A (en) 2004-11-29 2005-09-16 3 bath 1 batch type wafer cleaning apparatus

Country Status (3)

Country Link
JP (1) JP2006156924A (en)
KR (1) KR20060059785A (en)
TW (1) TW200623252A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8225804B2 (en) * 2007-03-02 2012-07-24 Safety-Kleen Systems, Inc. Multipurpose aqueous parts washer
KR100909337B1 (en) * 2007-12-14 2009-07-24 주식회사 동부하이텍 Wet cleaning method and wet cleaning device controller
CN117059534B (en) * 2023-10-12 2024-01-19 无锡京运通科技有限公司 Liquid level control method and system for cleaning machine

Also Published As

Publication number Publication date
KR20060059785A (en) 2006-06-02
JP2006156924A (en) 2006-06-15

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