TW200620720A - Circuit board of back light module of LED capable of increasing heat dissipating efficiency and the manufacturing method thereof - Google Patents
Circuit board of back light module of LED capable of increasing heat dissipating efficiency and the manufacturing method thereofInfo
- Publication number
- TW200620720A TW200620720A TW095106778A TW95106778A TW200620720A TW 200620720 A TW200620720 A TW 200620720A TW 095106778 A TW095106778 A TW 095106778A TW 95106778 A TW95106778 A TW 95106778A TW 200620720 A TW200620720 A TW 200620720A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipating
- circuit board
- manufacturing
- hollow part
- back light
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095106778A TWI290380B (en) | 2006-03-01 | 2006-03-01 | Circuit board of back light module of LED capable of increasing heat dissipating efficiency and the manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095106778A TWI290380B (en) | 2006-03-01 | 2006-03-01 | Circuit board of back light module of LED capable of increasing heat dissipating efficiency and the manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200620720A true TW200620720A (en) | 2006-06-16 |
TWI290380B TWI290380B (en) | 2007-11-21 |
Family
ID=39301438
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095106778A TWI290380B (en) | 2006-03-01 | 2006-03-01 | Circuit board of back light module of LED capable of increasing heat dissipating efficiency and the manufacturing method thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI290380B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101280891B (zh) * | 2007-04-02 | 2010-10-06 | 财团法人工业技术研究院 | 光源模块 |
CN102810534A (zh) * | 2011-06-03 | 2012-12-05 | 苏州金美家具有限公司 | 发光二极管模组 |
TWI642335B (zh) * | 2017-12-11 | 2018-11-21 | 欣興電子股份有限公司 | 電路板及其製造方法 |
-
2006
- 2006-03-01 TW TW095106778A patent/TWI290380B/zh not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101280891B (zh) * | 2007-04-02 | 2010-10-06 | 财团法人工业技术研究院 | 光源模块 |
CN102810534A (zh) * | 2011-06-03 | 2012-12-05 | 苏州金美家具有限公司 | 发光二极管模组 |
TWI642335B (zh) * | 2017-12-11 | 2018-11-21 | 欣興電子股份有限公司 | 電路板及其製造方法 |
US10468570B2 (en) | 2017-12-11 | 2019-11-05 | Unimicron Technology Corp. | Circuit board and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
TWI290380B (en) | 2007-11-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |