TW200618209A - Semiconductor package and manufacturing for the same - Google Patents

Semiconductor package and manufacturing for the same

Info

Publication number
TW200618209A
TW200618209A TW093136292A TW93136292A TW200618209A TW 200618209 A TW200618209 A TW 200618209A TW 093136292 A TW093136292 A TW 093136292A TW 93136292 A TW93136292 A TW 93136292A TW 200618209 A TW200618209 A TW 200618209A
Authority
TW
Taiwan
Prior art keywords
chip
ring
shaped adhesive
cavity
manufacturing
Prior art date
Application number
TW093136292A
Other languages
Chinese (zh)
Other versions
TWI242272B (en
Inventor
Tong-Hong Wang
Chang-Chi Lee
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW093136292A priority Critical patent/TWI242272B/en
Application granted granted Critical
Publication of TWI242272B publication Critical patent/TWI242272B/en
Publication of TW200618209A publication Critical patent/TW200618209A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Abstract

A semiconductor includes a chip, a substrate, a ring-shaped adhesive, a thermal interface material and a heat spreader. The chip has an active surface and back surface opposite to the active surface. The substrate supports the chip and is electrically connected to the active surface of the chip. The ring-shaped adhesive is disposed the back surface of the chip and defines a cavity on the chip, wherein the ring-shaped adhesive has a cured property and is formed a cured dame after a cure process. The cavity is filled with the thermal interface material. The heat spreader covers the cavity and is disposed on the back surface of the chip by means of the ring-shaped adhesive.
TW093136292A 2004-11-25 2004-11-25 Semiconductor package and manufacturing for the same TWI242272B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW093136292A TWI242272B (en) 2004-11-25 2004-11-25 Semiconductor package and manufacturing for the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093136292A TWI242272B (en) 2004-11-25 2004-11-25 Semiconductor package and manufacturing for the same

Publications (2)

Publication Number Publication Date
TWI242272B TWI242272B (en) 2005-10-21
TW200618209A true TW200618209A (en) 2006-06-01

Family

ID=37021518

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093136292A TWI242272B (en) 2004-11-25 2004-11-25 Semiconductor package and manufacturing for the same

Country Status (1)

Country Link
TW (1) TWI242272B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120188721A1 (en) * 2011-01-21 2012-07-26 Nxp B.V. Non-metal stiffener ring for fcbga

Also Published As

Publication number Publication date
TWI242272B (en) 2005-10-21

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