TW200612576A - Light-emitting diode backlighting module and method for manufacturing the same - Google Patents

Light-emitting diode backlighting module and method for manufacturing the same

Info

Publication number
TW200612576A
TW200612576A TW093130916A TW93130916A TW200612576A TW 200612576 A TW200612576 A TW 200612576A TW 093130916 A TW093130916 A TW 093130916A TW 93130916 A TW93130916 A TW 93130916A TW 200612576 A TW200612576 A TW 200612576A
Authority
TW
Taiwan
Prior art keywords
light
emitting diode
circuit board
print circuit
manufacturing
Prior art date
Application number
TW093130916A
Other languages
Chinese (zh)
Other versions
TWI238551B (en
Inventor
Shi-Ming Chen
Original Assignee
Epitech Corp Ltd
Shi-Ming Chen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epitech Corp Ltd, Shi-Ming Chen filed Critical Epitech Corp Ltd
Priority to TW93130916A priority Critical patent/TWI238551B/en
Application granted granted Critical
Publication of TWI238551B publication Critical patent/TWI238551B/en
Publication of TW200612576A publication Critical patent/TW200612576A/en

Links

Landscapes

  • Liquid Crystal (AREA)
  • Led Device Packages (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

A light-emitting diode (LED) backlighting module and a method for manufacturing the same are described. The light-emitting diode backlighting module comprises a print circuit board (PCB), a plurality of light-emitting diode chips and a plurality of solder films. A plurality of conducting lines are located on a surface of the print circuit board, and the print circuit board comprises a plurality of openings. The light-emitting diode chips are disposed respectively in the openings. Each light-emitting diode chip comprises: a metal substrate; three light-emitting diode dies respectively located on a surface of the metal substrate; and a plurality of electrodes respectively located on the rim of the metal substrate, wherein two poles of each light-emitting diode die are electrically connected to the electrodes respectively. The solder films electrically connect the conducting lines of the print circuit board and the electrodes of each light-emitting diode chip.
TW93130916A 2004-10-12 2004-10-12 Light-emitting diode backlighting module and method for manufacturing the same TWI238551B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93130916A TWI238551B (en) 2004-10-12 2004-10-12 Light-emitting diode backlighting module and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93130916A TWI238551B (en) 2004-10-12 2004-10-12 Light-emitting diode backlighting module and method for manufacturing the same

Publications (2)

Publication Number Publication Date
TWI238551B TWI238551B (en) 2005-08-21
TW200612576A true TW200612576A (en) 2006-04-16

Family

ID=37000301

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93130916A TWI238551B (en) 2004-10-12 2004-10-12 Light-emitting diode backlighting module and method for manufacturing the same

Country Status (1)

Country Link
TW (1) TWI238551B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8258623B2 (en) 2009-05-12 2012-09-04 Chunghwa Picture Tubes, Ltd. Circuit layout of circuit substrate, light source module and circuit substrate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112578598B (en) * 2020-12-14 2022-10-18 业成科技（成都）有限公司 Direct type backlight device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8258623B2 (en) 2009-05-12 2012-09-04 Chunghwa Picture Tubes, Ltd. Circuit layout of circuit substrate, light source module and circuit substrate

Also Published As

Publication number Publication date
TWI238551B (en) 2005-08-21

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