TW200612194A - Photosensitive element, method of forming resist pattern therewith, and process for producing printed circuit board - Google Patents

Photosensitive element, method of forming resist pattern therewith, and process for producing printed circuit board

Info

Publication number
TW200612194A
TW200612194A TW094101007A TW94101007A TW200612194A TW 200612194 A TW200612194 A TW 200612194A TW 094101007 A TW094101007 A TW 094101007A TW 94101007 A TW94101007 A TW 94101007A TW 200612194 A TW200612194 A TW 200612194A
Authority
TW
Taiwan
Prior art keywords
layer
photosensitive element
representing
benzophenone
circuit board
Prior art date
Application number
TW094101007A
Other languages
Chinese (zh)
Inventor
Masahiro Miyasaka
Takashi Kumaki
Yasuhisa Ichihashi
Toshiki Ito
Makoto Kaji
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200612194A publication Critical patent/TW200612194A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

A photosensitive element that in the use of light of 400 to 450 nm wavelength as an exposure light, realizes satisfactory sensitivity and resolution and further enables obtaining excellent resist morphology. There is provided a photosensitive element comprising support film (X) and photosensitive resin composition layer (Z). The photosensitive resin composition as a material of the layer (Z) comprises binder polymer (A), photopolymerizable compound (B) having at least one polymerizable ethylenic unsaturated bond and photopolymerization initiator (C), wherein the photopolymerization initiator (C) contains at least 4,4'-bis(dialkylamino)benzophenone and/or 4,4'-bis(alkylamino)benzophenone as a constituent thereof, and wherein conditioning is made so that Q representing the thickness of the layer (Z) [ m], Wa[g] representing the total mass of binder polymer (A) in the layer (Z), Wb[g] representing the total mass of compound (B) in the layer (Z) and Wc[g] representing the mass of benzophenone in the layer (Z) simultaneously satisfy the relationships: (1) P={Wc/(Wa+Wb100, (2) PQ=R and (3) 6.5=R=21.5.
TW094101007A 2004-10-04 2005-01-13 Photosensitive element, method of forming resist pattern therewith, and process for producing printed circuit board TW200612194A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2004/014612 WO2006038279A1 (en) 2004-10-04 2004-10-04 Photosensitive element, method of forming resist pattern therewith, and process for producing printed wiring board

Publications (1)

Publication Number Publication Date
TW200612194A true TW200612194A (en) 2006-04-16

Family

ID=36142370

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094101007A TW200612194A (en) 2004-10-04 2005-01-13 Photosensitive element, method of forming resist pattern therewith, and process for producing printed circuit board

Country Status (3)

Country Link
JP (1) JPWO2006038279A1 (en)
TW (1) TW200612194A (en)
WO (1) WO2006038279A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI778784B (en) * 2021-09-08 2022-09-21 諾沛半導體有限公司 Two-stage photopolymerization equipment for photopolymer layer on a printed circuit board
TWI778783B (en) * 2021-09-08 2022-09-21 李蕙如 Two-stage photopolymerization method for photopolymer layer on a printed circuit board

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001133968A (en) * 1999-11-09 2001-05-18 Fuji Photo Film Co Ltd Photosensitive composition
JP4488601B2 (en) * 2000-07-13 2010-06-23 旭化成イーマテリアルズ株式会社 Photosensitive resin laminate
JP3503640B2 (en) * 2000-09-27 2004-03-08 日立化成工業株式会社 Photosensitive resin composition
KR100578987B1 (en) * 2000-09-27 2006-05-12 히다치 가세고교 가부시끼가이샤 Resist pattern, process for producing the same, and utilization thereof
JP2002351086A (en) * 2001-03-22 2002-12-04 Fuji Photo Film Co Ltd Exposure device
JP2003195492A (en) * 2001-12-28 2003-07-09 Hitachi Chem Co Ltd Photosensitive film for forming circuit and method of manufacturing printed wiring board using the same
JP2003202669A (en) * 2002-01-09 2003-07-18 Hitachi Chem Co Ltd Photosensitive resin composition, photosensitive element using the same, resist pattern forming method and method for producing printed wiring board
JP3957513B2 (en) * 2002-01-22 2007-08-15 旭化成エレクトロニクス株式会社 Photopolymerizable resin composition
JP4082186B2 (en) * 2002-11-19 2008-04-30 三菱化学株式会社 Blue-violet laser photosensitive composition, and image forming material, image forming material, and image forming method using the same
JP2004326084A (en) * 2003-04-08 2004-11-18 Hitachi Chem Co Ltd Photosensitive element, resist pattern forming method using the same and method for manufacturing printed wiring board
JP4298391B2 (en) * 2003-06-12 2009-07-15 三菱化学株式会社 Blue-violet light-sensitive composition, and image forming material, image forming material, and image forming method using the same
JP2005128412A (en) * 2003-10-27 2005-05-19 Mitsubishi Chemicals Corp Image forming material and image forming method using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI778784B (en) * 2021-09-08 2022-09-21 諾沛半導體有限公司 Two-stage photopolymerization equipment for photopolymer layer on a printed circuit board
TWI778783B (en) * 2021-09-08 2022-09-21 李蕙如 Two-stage photopolymerization method for photopolymer layer on a printed circuit board
US11619881B2 (en) 2021-09-08 2023-04-04 Lee Hui-Ju Method for exposing photopolymerization layer comprising photopolymer

Also Published As

Publication number Publication date
JPWO2006038279A1 (en) 2008-05-15
WO2006038279A1 (en) 2006-04-13

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