TW200611302A - Device and method for cleaning the edges of substrates - Google Patents

Device and method for cleaning the edges of substrates

Info

Publication number
TW200611302A
TW200611302A TW093129507A TW93129507A TW200611302A TW 200611302 A TW200611302 A TW 200611302A TW 093129507 A TW093129507 A TW 093129507A TW 93129507 A TW93129507 A TW 93129507A TW 200611302 A TW200611302 A TW 200611302A
Authority
TW
Taiwan
Prior art keywords
media
flange
substrates
suctioning
port
Prior art date
Application number
TW093129507A
Other languages
English (en)
Inventor
Christian Krauss
Karl Appich
Jakob Szekeresch
Dr Peter Dress
Original Assignee
Steag Hamatech Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steag Hamatech Ag filed Critical Steag Hamatech Ag
Publication of TW200611302A publication Critical patent/TW200611302A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
TW093129507A 2003-10-08 2004-09-30 Device and method for cleaning the edges of substrates TW200611302A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10346667 2003-10-08

Publications (1)

Publication Number Publication Date
TW200611302A true TW200611302A (en) 2006-04-01

Family

ID=34428229

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093129507A TW200611302A (en) 2003-10-08 2004-09-30 Device and method for cleaning the edges of substrates

Country Status (3)

Country Link
CN (1) CN1864243A (zh)
DE (1) DE102004048691A1 (zh)
TW (1) TW200611302A (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4841451B2 (ja) * 2007-01-31 2011-12-21 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
CN102214553A (zh) * 2011-05-23 2011-10-12 叶伟清 晶圆端面清洗方法

Also Published As

Publication number Publication date
CN1864243A (zh) 2006-11-15
DE102004048691A1 (de) 2005-05-12

Similar Documents

Publication Publication Date Title
KR101039765B1 (ko) 디스크상 물품의 습식 처리장치 및 처리방법
WO2002068712A3 (en) Removal of etchant residues
KR950034447A (ko) 웨이퍼 연마 설비
IL161550A (en) Apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
TW200802526A (en) Substrate treatment apparatus and substrate treatment method
MY140300A (en) Enhanced wafer cleaning method
MY159175A (en) Method and apparatus for cleaning a substrate using non-newtonian fluids
TW200632541A (en) Mask for film-forming and mask assembling jig
ATE159461T1 (de) Vorrichtung zum reinigen von sich bewegenden gegenständen
TW200500152A (en) Apparatus and method for cleaning surfaces of semiconductor wafers using ozone
TW200715456A (en) Substrate mounting base, method for manufacturing the same and substrate processing apparatus
IL178946A0 (en) Apparatus and methods for slurry cleaning of etch chambers
TW200700812A (en) Coating apparatus and operating method thereof
WO2005010948A3 (en) Cleaning process and apparatus for silicate materials
WO2006060752A8 (en) Wet etching of the edge and bevel of a silicon wafer
TW200743145A (en) Semiconductor apparatus and clean unit thereof
TW200630167A (en) Spin-coating apparatus and coated substrates prepared using the same
TW200636808A (en) Novel semicoductor wafer lifter
DE60031852D1 (de) Verfahren und system zur reinigung eines wafers nach chemisch- mechanischem polieren oder plasmabehandlung
TW200611302A (en) Device and method for cleaning the edges of substrates
PL1714605T3 (pl) Urządzenie i sposób
WO2008021265A3 (en) Semiconductor substrate cleaning apparatus
TW200618045A (en) A method and apparatus for cleaning semiconductor substrates
ATE402126T1 (de) Hydrophile oberfläche mit temporären schutzverkleidungen
GB2371003B (en) Method and device for cleaning abrasive plates of abrasive machine