TW200608500A - Wafer level chip size package of a CMOS image sensor and method for manufacturing the same - Google Patents

Wafer level chip size package of a CMOS image sensor and method for manufacturing the same

Info

Publication number
TW200608500A
TW200608500A TW093124594A TW93124594A TW200608500A TW 200608500 A TW200608500 A TW 200608500A TW 093124594 A TW093124594 A TW 093124594A TW 93124594 A TW93124594 A TW 93124594A TW 200608500 A TW200608500 A TW 200608500A
Authority
TW
Taiwan
Prior art keywords
wafer level
back side
same
manufacturing
image sensor
Prior art date
Application number
TW093124594A
Other languages
Chinese (zh)
Other versions
TWI254391B (en
Inventor
Bruce C S Chou
Chen-Chih Fan
Wei-Ting Lin
Original Assignee
Lightuning Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lightuning Tech Inc filed Critical Lightuning Tech Inc
Priority to TW93124594A priority Critical patent/TWI254391B/en
Publication of TW200608500A publication Critical patent/TW200608500A/en
Application granted granted Critical
Publication of TWI254391B publication Critical patent/TWI254391B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Solid State Image Pick-Up Elements (AREA)

Abstract

A wafer level chip size package (CSP) of a CMOS image sensor and a method for manufacturing the same. A transparent substrate is adhered to a face side of a silicon wafer to protect an image sensing circuit on the face side. Then, the deep silicon etching technology in the MEMS (Micro-Electro-Mechanical-System) process is adopted to form vertical through holes on a back side of the wafer corresponding to bonding pads on the face side. Next, an insulation layer is formed on the back side to ensure the insulation between the holes at the pads. Then, vertical conductive electrodes are formed in the holes to conduct the face side and the back side. Next, metal wires connected to the vertical conductive electrodes are formed on the back side. Finally, solder bumps are formed on the wires to complete the wafer level package and make the package base have the same size as the chip.
TW93124594A 2004-08-17 2004-08-17 Wafer level chip size package of a CMOS image sensor and method for manufacturing the same TWI254391B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93124594A TWI254391B (en) 2004-08-17 2004-08-17 Wafer level chip size package of a CMOS image sensor and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93124594A TWI254391B (en) 2004-08-17 2004-08-17 Wafer level chip size package of a CMOS image sensor and method for manufacturing the same

Publications (2)

Publication Number Publication Date
TW200608500A true TW200608500A (en) 2006-03-01
TWI254391B TWI254391B (en) 2006-05-01

Family

ID=37587297

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93124594A TWI254391B (en) 2004-08-17 2004-08-17 Wafer level chip size package of a CMOS image sensor and method for manufacturing the same

Country Status (1)

Country Link
TW (1) TWI254391B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI458058B (en) * 2010-07-09 2014-10-21 Xintec Inc Chip package and method for forming the same
CN109950237A (en) * 2017-12-21 2019-06-28 北京万应科技有限公司 Sensor microsystems packaging method and sensor microsystems
CN113725160A (en) * 2021-09-01 2021-11-30 浙江同芯祺科技有限公司 Ultrathin wafer front cutting process
WO2023208207A1 (en) * 2022-04-29 2023-11-02 清华大学 Multi-mode sensing micro-system integration device based on conductive holes and manufacturing method therefor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI458058B (en) * 2010-07-09 2014-10-21 Xintec Inc Chip package and method for forming the same
CN109950237A (en) * 2017-12-21 2019-06-28 北京万应科技有限公司 Sensor microsystems packaging method and sensor microsystems
CN113725160A (en) * 2021-09-01 2021-11-30 浙江同芯祺科技有限公司 Ultrathin wafer front cutting process
WO2023208207A1 (en) * 2022-04-29 2023-11-02 清华大学 Multi-mode sensing micro-system integration device based on conductive holes and manufacturing method therefor

Also Published As

Publication number Publication date
TWI254391B (en) 2006-05-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees