TW200607059A - Integrated circuit package - Google Patents
Integrated circuit packageInfo
- Publication number
- TW200607059A TW200607059A TW093124331A TW93124331A TW200607059A TW 200607059 A TW200607059 A TW 200607059A TW 093124331 A TW093124331 A TW 093124331A TW 93124331 A TW93124331 A TW 93124331A TW 200607059 A TW200607059 A TW 200607059A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat spreader
- integrated heat
- die
- circuit package
- integrated circuit
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093124331A TWI309877B (en) | 2004-08-13 | 2004-08-13 | Integrated circuit package |
US11/044,953 US7301232B2 (en) | 2004-08-13 | 2005-01-27 | Integrated circuit package with carbon nanotube array heat conductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093124331A TWI309877B (en) | 2004-08-13 | 2004-08-13 | Integrated circuit package |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200607059A true TW200607059A (en) | 2006-02-16 |
TWI309877B TWI309877B (en) | 2009-05-11 |
Family
ID=35799229
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093124331A TWI309877B (en) | 2004-08-13 | 2004-08-13 | Integrated circuit package |
Country Status (2)
Country | Link |
---|---|
US (1) | US7301232B2 (zh) |
TW (1) | TWI309877B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI512916B (zh) * | 2012-04-09 | 2015-12-11 | Uunup Technology Co Ltd | 半導體之絕緣封裝裝置及其製造方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070164424A1 (en) * | 2003-04-02 | 2007-07-19 | Nancy Dean | Thermal interconnect and interface systems, methods of production and uses thereof |
WO2004109795A2 (en) * | 2003-06-06 | 2004-12-16 | Honeywell International Inc. | Thermal interconnect system and method of production thereof |
US20060231237A1 (en) * | 2005-03-21 | 2006-10-19 | Carlos Dangelo | Apparatus and method for cooling ICs using nano-rod based chip-level heat sinks |
US20060270106A1 (en) * | 2005-05-31 | 2006-11-30 | Tz-Cheng Chiu | System and method for polymer encapsulated solder lid attach |
US8890312B2 (en) * | 2006-05-26 | 2014-11-18 | The Hong Kong University Of Science And Technology | Heat dissipation structure with aligned carbon nanotube arrays and methods for manufacturing and use |
KR100818273B1 (ko) * | 2006-09-04 | 2008-04-01 | 삼성전자주식회사 | 기판 사이의 온도 차이를 줄이는 방법 및 이를 이용한 유체반응 장치 |
CN101209832B (zh) * | 2006-12-29 | 2010-05-12 | 清华大学 | 碳纳米管阵列的制备方法 |
CN101471329B (zh) * | 2007-12-29 | 2012-06-20 | 清华大学 | 半导体封装件 |
TWI455260B (zh) * | 2007-12-31 | 2014-10-01 | Hon Hai Prec Ind Co Ltd | 半導體封裝件 |
KR101989516B1 (ko) * | 2012-09-24 | 2019-06-14 | 삼성전자주식회사 | 반도체 패키지 |
US11940233B2 (en) | 2021-01-21 | 2024-03-26 | Cisco Technology, Inc. | Graphene and carbon nanotube based thermal management device |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6407922B1 (en) | 2000-09-29 | 2002-06-18 | Intel Corporation | Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader |
US6891724B2 (en) * | 2002-06-12 | 2005-05-10 | Intel Corporation | Increasing thermal conductivity of thermal interface using carbon nanotubes and CVD |
US6856016B2 (en) | 2002-07-02 | 2005-02-15 | Intel Corp | Method and apparatus using nanotubes for cooling and grounding die |
US6994584B1 (en) * | 2002-08-30 | 2006-02-07 | Advanced Micro Devices, Inc. | Thermally conductive integrated circuit mounting structures |
CN1248959C (zh) | 2002-09-17 | 2006-04-05 | 清华大学 | 一种碳纳米管阵列生长方法 |
KR100648952B1 (ko) | 2002-12-23 | 2006-11-24 | 삼성전자주식회사 | 탄소 나노 튜브를 이용하는 필터 |
US7316061B2 (en) * | 2003-02-03 | 2008-01-08 | Intel Corporation | Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface |
US7112472B2 (en) * | 2003-06-25 | 2006-09-26 | Intel Corporation | Methods of fabricating a composite carbon nanotube thermal interface device |
US20050061496A1 (en) * | 2003-09-24 | 2005-03-24 | Matabayas James Christopher | Thermal interface material with aligned carbon nanotubes |
US20050255304A1 (en) * | 2004-05-14 | 2005-11-17 | Damon Brink | Aligned nanostructure thermal interface material |
JP4167212B2 (ja) * | 2004-10-05 | 2008-10-15 | 富士通株式会社 | カーボンナノチューブ構造体、半導体装置、および半導体パッケージ |
-
2004
- 2004-08-13 TW TW093124331A patent/TWI309877B/zh not_active IP Right Cessation
-
2005
- 2005-01-27 US US11/044,953 patent/US7301232B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI512916B (zh) * | 2012-04-09 | 2015-12-11 | Uunup Technology Co Ltd | 半導體之絕緣封裝裝置及其製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20060033203A1 (en) | 2006-02-16 |
TWI309877B (en) | 2009-05-11 |
US7301232B2 (en) | 2007-11-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |