TW200606280A - Etching solution for titanium and titanium alloy - Google Patents

Etching solution for titanium and titanium alloy

Info

Publication number
TW200606280A
TW200606280A TW094114625A TW94114625A TW200606280A TW 200606280 A TW200606280 A TW 200606280A TW 094114625 A TW094114625 A TW 094114625A TW 94114625 A TW94114625 A TW 94114625A TW 200606280 A TW200606280 A TW 200606280A
Authority
TW
Taiwan
Prior art keywords
titanium
etching solution
alloy
weight
etching
Prior art date
Application number
TW094114625A
Other languages
Chinese (zh)
Other versions
TWI360586B (en
Inventor
Kenichi Takahashi
Akira Hosomi
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of TW200606280A publication Critical patent/TW200606280A/en
Application granted granted Critical
Publication of TWI360586B publication Critical patent/TWI360586B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

The present invention provides an etching solution and an etching method for selectively etching titanium or titanium alloy and the metal which could not be etched will not be etched thereby, for example, Cu, Sn, Sn alloy and Al. The said etching solution comprises 10 to 40% by weight of hydrogen peroxide, 0.05 to 5% by weight of phosphoric acid, 0.01 to 0.1% by weight of phosphonic acid and ammonia.
TW094114625A 2004-05-11 2005-05-06 Etching solution for titanium or titanium alloy TWI360586B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004141438A JP4471094B2 (en) 2004-05-11 2004-05-11 Titanium or titanium alloy etchant

Publications (2)

Publication Number Publication Date
TW200606280A true TW200606280A (en) 2006-02-16
TWI360586B TWI360586B (en) 2012-03-21

Family

ID=35468080

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094114625A TWI360586B (en) 2004-05-11 2005-05-06 Etching solution for titanium or titanium alloy

Country Status (4)

Country Link
JP (1) JP4471094B2 (en)
KR (1) KR101154762B1 (en)
CN (1) CN100526507C (en)
TW (1) TWI360586B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI467055B (en) * 2007-12-21 2015-01-01 Wako Pure Chem Ind Ltd Etching agent and etching method

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101636688B (en) 2007-06-14 2011-12-14 夏普株式会社 Display panel, display device and method for manufacturing display panel
JP5150401B2 (en) * 2008-08-04 2013-02-20 株式会社アルバック Method for manufacturing component parts of vacuum chamber, method for recycling the parts, method for manufacturing the frame, and method for recycling the frame
KR20120067198A (en) * 2010-12-15 2012-06-25 제일모직주식회사 Etching paste and method for preparing thereof, method of forming a pattern using the same
CN105378901B (en) 2013-07-05 2020-09-15 富士胶片电子材料有限公司 Etchant, etching method and etchant preparation liquid
US20150368557A1 (en) 2014-06-23 2015-12-24 Hyosan Lee Metal etchant compositions and methods of fabricating a semiconductor device using the same
JP6545691B2 (en) * 2014-09-19 2019-07-17 三菱電機株式会社 Semiconductor device manufacturing method
JP6429079B2 (en) 2015-02-12 2018-11-28 メック株式会社 Etching solution and etching method
EP3436621B1 (en) 2016-03-29 2020-02-12 Technic France Solution and method for etching titanium based materials
SG11201908791SA (en) 2017-03-31 2019-10-30 Kanto Kagaku Etchant composition for etching titanium layer or titanium-containing layer, and etching method
KR20200105221A (en) 2019-02-28 2020-09-07 동우 화인켐 주식회사 An etchant composition and an ehting method and a mehtod for fabrication metal pattern using the same
CN110581061B (en) * 2019-09-25 2022-03-01 同辉电子科技股份有限公司 Processing technology of gallium nitride MMIC power amplifier chip
CN114196956B (en) * 2020-09-18 2024-03-12 珠海市丹尼尔电子科技有限公司 Etching solution for titanium

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100497835B1 (en) * 1997-01-27 2005-09-08 미쓰비시 가가꾸 가부시키가이샤 Surface treatment composition and method for treating surface of substrate by using rhe same
KR20040048374A (en) * 2001-10-09 2004-06-09 나가세케무텍쿠스가부시키가이샤 Etchant composition
TWI245071B (en) * 2002-04-24 2005-12-11 Mitsubishi Chem Corp Etchant and method of etching
JP2003328159A (en) 2002-05-02 2003-11-19 Mitsubishi Gas Chem Co Inc Surface treatment agent

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI467055B (en) * 2007-12-21 2015-01-01 Wako Pure Chem Ind Ltd Etching agent and etching method

Also Published As

Publication number Publication date
CN100526507C (en) 2009-08-12
CN1706986A (en) 2005-12-14
KR20060045996A (en) 2006-05-17
TWI360586B (en) 2012-03-21
KR101154762B1 (en) 2012-06-18
JP4471094B2 (en) 2010-06-02
JP2005320608A (en) 2005-11-17

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