TW200605216A - Polishing solution retainer - Google Patents

Polishing solution retainer

Info

Publication number
TW200605216A
TW200605216A TW094124597A TW94124597A TW200605216A TW 200605216 A TW200605216 A TW 200605216A TW 094124597 A TW094124597 A TW 094124597A TW 94124597 A TW94124597 A TW 94124597A TW 200605216 A TW200605216 A TW 200605216A
Authority
TW
Taiwan
Prior art keywords
polishing
solution
polishing solution
area during
pad
Prior art date
Application number
TW094124597A
Other languages
English (en)
Inventor
Han-Zhong Zhang
Feng Q Liu
Stan D Tsai
Rashid Mavliev
Donald Olgado
Liang Yuh Chen
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200605216A publication Critical patent/TW200605216A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW094124597A 2004-07-22 2005-07-20 Polishing solution retainer TW200605216A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59068304P 2004-07-22 2004-07-22
US10/942,600 US7232363B2 (en) 2004-07-22 2004-09-16 Polishing solution retainer

Publications (1)

Publication Number Publication Date
TW200605216A true TW200605216A (en) 2006-02-01

Family

ID=35276666

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094124597A TW200605216A (en) 2004-07-22 2005-07-20 Polishing solution retainer

Country Status (3)

Country Link
US (1) US7232363B2 (zh)
TW (1) TW200605216A (zh)
WO (1) WO2006014728A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113134789A (zh) * 2020-01-17 2021-07-20 台湾积体电路制造股份有限公司 化学机械研磨系统、用于其的托架装配件及其清洁方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3032029B1 (en) 2006-05-09 2017-12-06 Hill-Rom Services, Inc. Pulmonary mattress
US8656955B2 (en) 2010-05-20 2014-02-25 Bio-Rad Laboratories, Inc. Rotary column selector valve
US9228885B2 (en) 2012-06-21 2016-01-05 Hill-Rom Services, Inc. Patient support systems and methods of use
US9833369B2 (en) 2012-06-21 2017-12-05 Hill-Rom Services, Inc. Patient support systems and methods of use
JP6139188B2 (ja) * 2013-03-12 2017-05-31 株式会社荏原製作所 研磨装置および研磨方法
KR101723848B1 (ko) * 2015-12-30 2017-04-06 주식회사 케이씨텍 화학 기계적 연마장치 및 그 제어방법
US10682737B2 (en) * 2016-06-30 2020-06-16 Seagate Technology Llc Barrier device used in the manufacture of a lapping plate, and related apparatuses and methods of making
CN112658976B (zh) * 2019-12-17 2022-07-22 深圳硅基仿生科技有限公司 用于对陶瓷的表面进行研磨的方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4910155A (en) * 1988-10-28 1990-03-20 International Business Machines Corporation Wafer flood polishing
JP3334139B2 (ja) * 1991-07-01 2002-10-15 ソニー株式会社 研磨装置
US5149338A (en) * 1991-07-22 1992-09-22 Fulton Kenneth W Superpolishing agent, process for polishing hard ceramic materials, and polished hard ceramics
US5299393A (en) * 1992-07-21 1994-04-05 International Business Machines Corporation Slurry containment device for polishing semiconductor wafers
US5709593A (en) * 1995-10-27 1998-01-20 Applied Materials, Inc. Apparatus and method for distribution of slurry in a chemical mechanical polishing system
US6019670A (en) * 1997-03-10 2000-02-01 Applied Materials, Inc. Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system
US6007411A (en) * 1997-06-19 1999-12-28 Interantional Business Machines Corporation Wafer carrier for chemical mechanical polishing
US6019665A (en) * 1998-04-30 2000-02-01 Fujitsu Limited Controlled retention of slurry in chemical mechanical polishing
US6347979B1 (en) * 1998-09-29 2002-02-19 Vsli Technology, Inc. Slurry dispensing carrier ring
US6572453B1 (en) * 1998-09-29 2003-06-03 Applied Materials, Inc. Multi-fluid polishing process
US6527624B1 (en) * 1999-03-26 2003-03-04 Applied Materials, Inc. Carrier head for providing a polishing slurry
US6225224B1 (en) * 1999-05-19 2001-05-01 Infineon Technologies Norht America Corp. System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer
US6283840B1 (en) * 1999-08-03 2001-09-04 Applied Materials, Inc. Cleaning and slurry distribution system assembly for use in chemical mechanical polishing apparatus
JP2001121407A (ja) * 1999-10-21 2001-05-08 Nec Corp 研磨装置
US6386947B2 (en) * 2000-02-29 2002-05-14 Applied Materials, Inc. Method and apparatus for detecting wafer slipouts
US6443810B1 (en) * 2000-04-11 2002-09-03 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing platen equipped with guard ring for chemical mechanical polishing
US6409579B1 (en) * 2000-05-31 2002-06-25 Koninklijke Philips Electronics N.V. Method and apparatus for conditioning a polish pad at the point of polish and for dispensing slurry at the point of polish
JP3692970B2 (ja) * 2001-06-13 2005-09-07 ソニー株式会社 研磨パッド
US6458020B1 (en) * 2001-11-16 2002-10-01 International Business Machines Corporation Slurry recirculation in chemical mechanical polishing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113134789A (zh) * 2020-01-17 2021-07-20 台湾积体电路制造股份有限公司 化学机械研磨系统、用于其的托架装配件及其清洁方法
US11890718B2 (en) 2020-01-17 2024-02-06 Taiwan Semiconductor Manufacturing Co., Ltd. Removable tray assembly for CMP systems

Also Published As

Publication number Publication date
US7232363B2 (en) 2007-06-19
WO2006014728B1 (en) 2006-03-23
US20060019581A1 (en) 2006-01-26
WO2006014728A1 (en) 2006-02-09

Similar Documents

Publication Publication Date Title
TW200605216A (en) Polishing solution retainer
TW200624224A (en) Polishing apparatus and polishing method
WO2004001813A3 (en) Substrate holder and plating apparatus
MXPA05013215A (es) Almohadillas para limpieza.
EP2191936A3 (en) Retaining ring with convex bottom surface
JP2005123485A5 (zh)
TW200633045A (en) Method of polishing GaN substrate
TW200619039A (en) Methods and apparatus for aligning inkjet print head supports
JP2003234314A5 (zh)
SG144740A1 (en) Methods and systems for processing a substrate using a dynamic liquid meniscus
WO2006022452A3 (en) Polishing apparatus and polishing method
EP1066922A3 (en) Carrier head with pressurizable bladder
ATE296185T1 (de) Verfahren und vorrichtung zum planarisieren von mikroelektronischem substratenaufbau
PL1918675T3 (pl) Podstawa montażowa korpusu o strukturze plastra miodu i urządzenie kontrolne korpusu o strukturze plastra miodu
TW200610611A (en) Electrochemical-mechanical polishing system
PL2060658T3 (pl) Sposób obrabiania powierzchni ustrukturowanej
TW200722272A (en) Press-forming apparatus
NZ586833A (en) Interface pad for use between an abrasive article and a support tool
SG133543A1 (en) Apparatus and system for cleaning a substrate
WO2010132181A3 (en) Polishing head zone boundary smoothing
MY142374A (en) Polishing apparatus.
WO2001089763A3 (en) Multilayer retaining ring for chemical mechanical polishing
WO2011152958A3 (en) Tuning of polishing process in multi-carrier head per platen polishing station
WO2002002273A3 (en) Carrier head with reduced moment wear ring
PL1606075T3 (pl) Sposób, jak również urządzenie do obróbki jednostek zespolonych, utworzonych z elementu nośnego i poduszki do stempli