TW200604269A - Thermosetting composition and curing method thereof - Google Patents

Thermosetting composition and curing method thereof

Info

Publication number
TW200604269A
TW200604269A TW094110373A TW94110373A TW200604269A TW 200604269 A TW200604269 A TW 200604269A TW 094110373 A TW094110373 A TW 094110373A TW 94110373 A TW94110373 A TW 94110373A TW 200604269 A TW200604269 A TW 200604269A
Authority
TW
Taiwan
Prior art keywords
curing method
thermosetting composition
molecule
compound
composition
Prior art date
Application number
TW094110373A
Other languages
English (en)
Inventor
Hirotoshi Kamata
Kazuya Kimura
Hiroshi Uchida
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Publication of TW200604269A publication Critical patent/TW200604269A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1525—Four-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08L67/025—Polyesters derived from dicarboxylic acids and dihydroxy compounds containing polyether sequences
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C09J167/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C09J167/025—Polyesters derived from dicarboxylic acids and dihydroxy compounds containing polyether sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/06—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
    • C08L101/08—Carboxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW094110373A 2004-04-06 2005-03-31 Thermosetting composition and curing method thereof TW200604269A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004111971 2004-04-06

Publications (1)

Publication Number Publication Date
TW200604269A true TW200604269A (en) 2006-02-01

Family

ID=37398457

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094110373A TW200604269A (en) 2004-04-06 2005-03-31 Thermosetting composition and curing method thereof

Country Status (6)

Country Link
US (1) US20080227946A1 (zh)
EP (1) EP1732980A1 (zh)
KR (1) KR20070015131A (zh)
CN (1) CN1938372A (zh)
TW (1) TW200604269A (zh)
WO (1) WO2005097882A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2090610A1 (en) * 2006-11-29 2009-08-19 Toyo Boseki Kabushiki Kasisha Oxetane-containing resin, and adhesive agent and resist agent each using the same
JP2012253420A (ja) 2011-05-31 2012-12-20 Toshiba Corp 可変長符号復号装置、復号システムおよび可変長符号復号方法
KR20140082708A (ko) * 2011-09-28 2014-07-02 헨켈 아게 운트 코. 카게아아 옥세탄 함유 화합물 및 그의 조성물

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1129028A (en) * 1965-11-22 1968-10-02 Ciba Ltd New compounds containing oxetane groups, a process for their preparation, and use
JPS61243869A (ja) * 1985-04-19 1986-10-30 Taiyo Ink Seizo Kk レジストインキ組成物
KR20040000387A (ko) * 1996-10-08 2004-01-03 히다치 가세고교 가부시끼가이샤 접착제 및 양면 접착 필름
US6015864A (en) * 1996-11-12 2000-01-18 Akzo Nobel Nv Thermosetting powder coating composition
JP3629907B2 (ja) * 1997-07-29 2005-03-16 宇部興産株式会社 熱硬化性オキセタン組成物
WO2002064662A1 (fr) * 2001-02-15 2002-08-22 Kanagawa University Compose de polyester insature, resine durcissable aux radiations actiniques, procedes de production de ces derniers et composition durcissable
US20050048700A1 (en) * 2003-09-02 2005-03-03 Slawomir Rubinsztajn No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance
TW200533692A (en) * 2003-11-06 2005-10-16 Showa Denko Kk Curable polyester having an oxetanyl group at end and process for preparing the same, resist composition, jet printing ink composition, curing methods and uses thereof

Also Published As

Publication number Publication date
WO2005097882A1 (en) 2005-10-20
KR20070015131A (ko) 2007-02-01
EP1732980A1 (en) 2006-12-20
US20080227946A1 (en) 2008-09-18
CN1938372A (zh) 2007-03-28

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