TW200602396A - Plated resin molded article - Google Patents

Plated resin molded article

Info

Publication number
TW200602396A
TW200602396A TW094104745A TW94104745A TW200602396A TW 200602396 A TW200602396 A TW 200602396A TW 094104745 A TW094104745 A TW 094104745A TW 94104745 A TW94104745 A TW 94104745A TW 200602396 A TW200602396 A TW 200602396A
Authority
TW
Taiwan
Prior art keywords
molded article
resin molded
plated resin
plated
plating layer
Prior art date
Application number
TW094104745A
Other languages
Chinese (zh)
Inventor
Toshihiro Tai
Ippei Tonosaki
Original Assignee
Daicel Polymer Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Polymer Ltd filed Critical Daicel Polymer Ltd
Publication of TW200602396A publication Critical patent/TW200602396A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The present invention is to provide a plated resin molded article having high adhesiveness strength of plating layer, without the need of an etching treatment with chromic acid. More particularly, the plated resin molded article has a metallic plating layer on the surface of a thermoplastic resin molded article comprising a thermoplastic resin and a chelating agent, wherein the resin molded article is not subjected to an etching treatment with a heavy metal-containing acid.
TW094104745A 2004-02-20 2005-02-18 Plated resin molded article TW200602396A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004043926A JP2005232338A (en) 2004-02-20 2004-02-20 Plated resin molding

Publications (1)

Publication Number Publication Date
TW200602396A true TW200602396A (en) 2006-01-16

Family

ID=34879325

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094104745A TW200602396A (en) 2004-02-20 2005-02-18 Plated resin molded article

Country Status (3)

Country Link
JP (1) JP2005232338A (en)
TW (1) TW200602396A (en)
WO (1) WO2005080485A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4468295B2 (en) * 2005-12-15 2010-05-26 ダイセルポリマー株式会社 Plating resin molding
JP4275157B2 (en) * 2006-07-27 2009-06-10 荏原ユージライト株式会社 Metallization method for plastic surfaces
JP5080117B2 (en) * 2006-08-04 2012-11-21 ダイセルポリマー株式会社 Plating resin molding
JP5364237B2 (en) * 2006-08-28 2013-12-11 ダイセルポリマー株式会社 Plating resin molding
JP5138394B2 (en) * 2008-01-21 2013-02-06 日立マクセル株式会社 Polymer parts

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07111385A (en) * 1993-10-12 1995-04-25 Hitachi Chem Co Ltd Plating pre-treatment liquid of through hole using conductive polymer
JP3150590B2 (en) * 1995-11-29 2001-03-26 株式会社日立製作所 Base treatment method for electroless plating
JP2001031788A (en) * 1999-07-22 2001-02-06 Teijin Meton Kk Plated crosslinked polymer molding
TWI224120B (en) * 2001-09-11 2004-11-21 Daicel Polymer Ltd Process for manufacturing plated resin molded article
JP2003193247A (en) * 2001-12-25 2003-07-09 Toyota Motor Corp Pretreatment method for electroless plating material

Also Published As

Publication number Publication date
WO2005080485A1 (en) 2005-09-01
JP2005232338A (en) 2005-09-02

Similar Documents

Publication Publication Date Title
MY144558A (en) Copper foil for printed circuit board
KR101727841B1 (en) Metallization and anodization of plastic and conductive parts of the body of an apparatus
MY151913A (en) Surface-treated copper foil, surface-treated copper foil with very thin primer resin layer, method for manufacturing the surface-treated copper foil, and method for manufacturing the surface-treated copper foil with very thin primer resin layer
TW200602396A (en) Plated resin molded article
WO2008020910A3 (en) Process for improving the adhesion of polymeric materials to metal surfaces
EP1795336A4 (en) Electrolytic copper foil with carrier foil furnished with primer resin layer and process for producing the same
TW200732511A (en) Composite coated metal sheet, treatment agent and method of manufacturing composite coated metal sheet
WO2008005782A3 (en) Conductive adhesive tape having different adhesion on both surfaces and method for manufacturing the same
MX2009013566A (en) Appliance transparency.
MX344173B (en) Process for the electroless copper plating of metallic substrates.
WO2009054456A1 (en) Method for manufacturing printed wiring board
EP2367967A1 (en) Surface metalizing method, method for preparing plastic article and plastic article made therefrom
TW200642702A (en) Silver coatings and methods of manufacture
CN101555613A (en) Surface treatment method of case and case manufactured therefrom
JP2008290295A (en) Plastic plated product and its manufacturing process
MY162509A (en) Copper foil for semiconductor package substrate and substrate for semiconductor package
TW201308041A (en) Housing for electronic device and method for making the same
MX2007009397A (en) Component with a coating for reducing the wettability of the surfaces and method for production thereof.
JP2001315159A (en) Method for manufacturing injection molding having metal plate
MX2022003015A (en) Molded article with metallic appearance.
WO2002064862A3 (en) Method for producing plated molded product
JP2017136839A (en) Metal/resin composite structure, method for manufacturing metal/resin composite structure, nickel plated steel member and method for producing nickel plated steel member
DE102004016098A1 (en) Production process for brake disk involves galvanic application of at least one intermediate layer
WO2003023087A1 (en) Plated resin molding and process for producing the same
WO2004038070A3 (en) Pulse reverse electrolysis of acidic copper electroplating solutions