TW200601914A - Method for forming solder mask for circuit board - Google Patents

Method for forming solder mask for circuit board

Info

Publication number
TW200601914A
TW200601914A TW093119482A TW93119482A TW200601914A TW 200601914 A TW200601914 A TW 200601914A TW 093119482 A TW093119482 A TW 093119482A TW 93119482 A TW93119482 A TW 93119482A TW 200601914 A TW200601914 A TW 200601914A
Authority
TW
Taiwan
Prior art keywords
solder mask
circuit board
forming solder
wirings
baking
Prior art date
Application number
TW093119482A
Other languages
Chinese (zh)
Other versions
TWI253886B (en
Inventor
Ching-Wen Hsueh
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW93119482A priority Critical patent/TWI253886B/en
Publication of TW200601914A publication Critical patent/TW200601914A/en
Application granted granted Critical
Publication of TWI253886B publication Critical patent/TWI253886B/en

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

A method for forming a solder mask for a circuit board. A circuit board comprising a plurality of wirings therein is provided. Each wiring comprises a pad. A solder mask is formed overlying the circuit board to cover the plurality of wirings. Photolithography and etching are performed on the solder mask to expose the pads. A first baking is performed on the solder mask prior to a first exposure of ultraviolet light. A second baking is performed on the solder mask prior to a second exposure of ultraviolet light followed by a plasma treatment. A metal layer is formed on the pads.
TW93119482A 2004-06-30 2004-06-30 Method for forming solder mask for circuit board TWI253886B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93119482A TWI253886B (en) 2004-06-30 2004-06-30 Method for forming solder mask for circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93119482A TWI253886B (en) 2004-06-30 2004-06-30 Method for forming solder mask for circuit board

Publications (2)

Publication Number Publication Date
TW200601914A true TW200601914A (en) 2006-01-01
TWI253886B TWI253886B (en) 2006-04-21

Family

ID=37586750

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93119482A TWI253886B (en) 2004-06-30 2004-06-30 Method for forming solder mask for circuit board

Country Status (1)

Country Link
TW (1) TWI253886B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI387027B (en) * 2009-02-16 2013-02-21 Advanced Semiconductor Eng Coreless substrate and method for making the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI387027B (en) * 2009-02-16 2013-02-21 Advanced Semiconductor Eng Coreless substrate and method for making the same

Also Published As

Publication number Publication date
TWI253886B (en) 2006-04-21

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