TW200601914A - Method for forming solder mask for circuit board - Google Patents
Method for forming solder mask for circuit boardInfo
- Publication number
- TW200601914A TW200601914A TW093119482A TW93119482A TW200601914A TW 200601914 A TW200601914 A TW 200601914A TW 093119482 A TW093119482 A TW 093119482A TW 93119482 A TW93119482 A TW 93119482A TW 200601914 A TW200601914 A TW 200601914A
- Authority
- TW
- Taiwan
- Prior art keywords
- solder mask
- circuit board
- forming solder
- wirings
- baking
- Prior art date
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
A method for forming a solder mask for a circuit board. A circuit board comprising a plurality of wirings therein is provided. Each wiring comprises a pad. A solder mask is formed overlying the circuit board to cover the plurality of wirings. Photolithography and etching are performed on the solder mask to expose the pads. A first baking is performed on the solder mask prior to a first exposure of ultraviolet light. A second baking is performed on the solder mask prior to a second exposure of ultraviolet light followed by a plasma treatment. A metal layer is formed on the pads.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93119482A TWI253886B (en) | 2004-06-30 | 2004-06-30 | Method for forming solder mask for circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93119482A TWI253886B (en) | 2004-06-30 | 2004-06-30 | Method for forming solder mask for circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200601914A true TW200601914A (en) | 2006-01-01 |
TWI253886B TWI253886B (en) | 2006-04-21 |
Family
ID=37586750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93119482A TWI253886B (en) | 2004-06-30 | 2004-06-30 | Method for forming solder mask for circuit board |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI253886B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI387027B (en) * | 2009-02-16 | 2013-02-21 | Advanced Semiconductor Eng | Coreless substrate and method for making the same |
-
2004
- 2004-06-30 TW TW93119482A patent/TWI253886B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI387027B (en) * | 2009-02-16 | 2013-02-21 | Advanced Semiconductor Eng | Coreless substrate and method for making the same |
Also Published As
Publication number | Publication date |
---|---|
TWI253886B (en) | 2006-04-21 |
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