TW200601524A - Circuit board structure integrated with semiconductor chip and method for fabricating the same - Google Patents

Circuit board structure integrated with semiconductor chip and method for fabricating the same

Info

Publication number
TW200601524A
TW200601524A TW093119372A TW93119372A TW200601524A TW 200601524 A TW200601524 A TW 200601524A TW 093119372 A TW093119372 A TW 093119372A TW 93119372 A TW93119372 A TW 93119372A TW 200601524 A TW200601524 A TW 200601524A
Authority
TW
Taiwan
Prior art keywords
circuit board
semiconductor chip
fabricating
same
structure integrated
Prior art date
Application number
TW093119372A
Other languages
Chinese (zh)
Other versions
TWI239086B (en
Inventor
Shih-Ping Hsu
Chu-Chin Hu
Original Assignee
Phoenix Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology Corp filed Critical Phoenix Prec Technology Corp
Priority to TW093119372A priority Critical patent/TWI239086B/en
Application granted granted Critical
Publication of TWI239086B publication Critical patent/TWI239086B/en
Publication of TW200601524A publication Critical patent/TW200601524A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect

Abstract

A circuit board structure integrated with semiconductor chip and a method for fabricating the same are proposed, wherein a supporting plate formed with at least an opening is provided and a semiconductor chip formed with a plurality of pads is embedded in the opening. An anisotropic conductive film and a circuit board formed with electrical connections are provided. The circuit board and the supporting plate are compressed with the anisotropic conductive film, wherein the electrical connections of the circuit board are electrically connected to the pads of the chip embedded in the supporting plate by the anisotropic film.
TW093119372A 2004-06-30 2004-06-30 Circuit board structure integrated with semiconductor chip and method for fabricating the same TWI239086B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW093119372A TWI239086B (en) 2004-06-30 2004-06-30 Circuit board structure integrated with semiconductor chip and method for fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093119372A TWI239086B (en) 2004-06-30 2004-06-30 Circuit board structure integrated with semiconductor chip and method for fabricating the same

Publications (2)

Publication Number Publication Date
TWI239086B TWI239086B (en) 2005-09-01
TW200601524A true TW200601524A (en) 2006-01-01

Family

ID=37001186

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093119372A TWI239086B (en) 2004-06-30 2004-06-30 Circuit board structure integrated with semiconductor chip and method for fabricating the same

Country Status (1)

Country Link
TW (1) TWI239086B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449657B (en) * 2008-07-04 2014-08-21 Hon Hai Prec Ind Co Ltd Micro electro-mechanical system

Also Published As

Publication number Publication date
TWI239086B (en) 2005-09-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees