200537113 九、發明說明： 【發明所屬之技術領域】 ▲、本發明大體上關於一種用以測試—晶圓上積體 试系統之組態。本發明特別是關於— 4 卡機械支樓組態，該探針卡具有低曲木針卡之探針 基板。 有低钱械撓曲強度之電路由 【先前技術】 因晶圓尺寸加大，用以測試該 尺寸及複雜性相對提昇。考量該較大尺寸的晶圓 = 測試系統中之探針卡基板尺寸通常較大，且係設計用= 樓較多探針或簧片接點（spring _tae 十用以支 #曰冋L J以連接至並測試 该曰曰因上更夕的積體電路（ICs)。該具有附加探針之較大探 針卡通常在探針卡上造成較大之彎曲負載。 雖然晶圓尺寸加大導致呈右齡古 八有鈥回探針岔度之較大探針卡 、，且H、仍傾向使用低撓曲強度材料之探針卡。 撓曲強度材料之探針卡之原因在 - 千导體裝置之複雜性 曰加’ 乂及-晶圓上單位面積欲測試之積體電路⑽)资卢 ：需改良該探針卡之電子性能。為能達到電子性能 、擇做為—支撺探針之空間變屋器基板之材料及f 造技術將形成較薄且強度較低之組態。當該探針卡較多的 貪片接點接觸到一受測試之晶圓，因積體電路⑽密度提 幵而Un之採針數量（負载）進一步使該探針卡基板產生較 大的彎曲。 參見圖1 ’圖中顯示利用一探針卡測試一半導體晶圓上 99084.doc 200537113 積體電路（ICs)之測試系統之簡化方塊圖。該測試系統包含 一測試控制器4，其藉由一通訊纜線6連接至一測試頭8。 該測試系統另包含-探測器1〇 ’其由一用以裝設一欲測試 之晶圓14之平台12所組成，該平台12可移動而利用一探針 卡18上之採針16與該晶圓14接觸。該探測器丨〇包含支撐著 與該晶圓14上積體電路（ICs)接觸之探針“的探針卡18。 在該測試系統中，該測試控制器4產生之測試資料藉由 該通訊纜線6、測試頭8、探針卡18、探針16及最後傳輸至 該晶圓14上積體電路（ICs)。之後來自該晶圓上積體電路 (ICs)之測試結果反向經由該探針卡18至該測試頭$以利回 傳至該測試控制器4。當測試完成時，該晶圓分切為個別 之積體電路（ICs)。 由該測試控制器4所提供之測試資料被劃分進入該個別 的測試器通道，其由該纜線6所提供且在該測試頭8中分 開，故每個通道連通至該等探針16中之—個別探針。來自 該測試頭8之通道藉由連接器24連接至該探針卡“。該連 接器24可為零插人作用力（ZI.F)之柔軟i線連接器、彈菩接 針（P〇g〇 pin)或其他型式之連接器。之後該探針卡“將每 個通道連接至該等探針16中之一個別探針。 圖2顯示該探針卡18元件之剖示圖。該探針㈣被組態 以提供與該晶圓直接接觸之彈性探針“所需之電子通路及 機械支撐。該探針卡電子通路係藉由一印刷電路板 (PCB)3〇, 一内插板32及一空間變壓器“所構成。：自該 測試頭8之測試資料由柔軟纜線連接器24所提供，該連接 99084.doc 200537113 器24通常環繞著該印刷電路板（PCB)30連接。通道傳輸線 40將來自孩連接器24之信號水平分配進入該印刷電路板 (PCB)30至該印刷電路板（pCB)3〇上之接觸墊片，以配合該 空間變壓器34上墊片之繞線間距（routing pitch)。該内插板 32包含一基板42，其彈性探針電子觸點料配置在兩側邊。 該内插板32電子連接該印刷電路板（PCB)30上之個別墊 片，在該空間變壓器34上形成一基板柵格陣列（lga)。該 基板柵格陣列（LGA)墊片連接一般以正規多排圖樣予以配 置。孩空間變壓器34的一基板45中之傳輸線46將來自該基 板柵格陣列（LGA)之信號線以陣列方式分配至彈性探針 16。具有嵌入式電氣回路、探針及連接點之該空間變壓器 基板45被稱為一探針頭。 因一晶圓上欲測試之元件通常是在一相當高的頻率下操 作，故提供該電子通路支撐之元件機械特性係藉由電子需 求加以說明。此一基板之機械支撐應包括下列·· 1·該空間變壓器基板45之偏斜及應力控制。 2·空間變壓器基板45之側向位置控制。 3·空間變壓器基板45之精密度整平。 4·在空間變壓器基板45及印刷電路板（pcb)3 〇之間建立 電乳連通之内插板32電氣接點之機械壓縮控制。 5·所有獨特及棑列式電氣回路結構之電氣絕緣。 。一驅動板50、支架（探針頭支架）52、内部機架（探針頭機 =)54内插板32及葉片彈簧56提供該電子元件之機械支 撐。該驅動板50位於該印刷電路板（pCB)3〇一側邊，該支 99084.doc 200537113 木利用太τ'、、、糸钉5 9附接並位於另一側邊。該等葉片彈簧$ 6 藉由螺絲釘58附接至該支架52。該内插板32含有兩對位於 對角線相對角落之對準接針41及43。位於㈣插板底部之 ★ 對準接針43與該機架54中之精確對準孔對齊，位於頂部之 對準接針與印刷電路板（PCB)30中之精確對準孔對齊。該 • 内插板接針41及43之位置及該印刷電路板（pcB)3〇及機架 54中對準孔控制著該側向運動，以及因此經由該内插板彈 黃44使基板45上的基板柵格陣列（LGA)接觸墊片對準該印 刷電路板（PCB)30上之接觸墊片。該機架54另包含水平延 伸邛60，用以支撐位於其内側壁部中之該空間變壓器％。 % 著忒空間變壓器34之外側邊緣配備的該支架52及機架 54維持側向位置控制。之後在該機架“附接支撐著該等葉 片彈簀56時，該内插板32之探針彈簧私產生一機械作用力 而將該印刷電路板（PCB)3〇及空間變壓器34分開。 整平用途之機械元件包括四個銅球（兩個標示為66及 φ 68)，其在各邊角附近與該空間變壓器34接觸。該銅支撐 球在該空間變壓器34之基板栅袼陣列（LGA)周邊外側提供 一點接觸，以保持與電子元件絕緣。藉由推進稱為整平接 針之螺絲釘（圖中繪示兩個螺絲釘62及6句來調整這些球 體，即可達成該基板之整平。該整平接針62及64係螺旋轉 一 動經過位於該驅動板50中及該印刷電路板（PC：B)30兩側邊 之支撐物6 5。 整干接針62及64係可調整而推動該空間變壓器34以整平 4空間變壓器基板，以及可能補償一非平面或彎曲之基 99084.doc 200537113 板。就整平而言，當在該空間變壓器基板45一側邊上之多 個彈性探針1 6與晶圓之間施加過大作用力時，該整平接針 62及64在基板45上之推進將防止輕微齊平偏差，以避免造 成該空間變壓器基板45另一側邊上的多個彈性探針16與晶 圓接觸。對於非平面、彎曲或變形基板，藉由整平接針^ 及64之推進可用來補償變形。對具有彼此非平行或平坦表 面之空間變壓器而言，該整平接針62及64經調整使含有該 探針之表面與該晶圓表面平行。對彎曲之空間變壓器基板 而言，整平接針62及64在該基板邊緣處之推進可協助該彎 曲：狀到達某種程度的平直。因較大之基板更可能彎曲， 八而提仏支撐此力較佳之結構以補償該彎曲，例如名稱為 用於-半導體接觸器之使平坦化工具"(pla謝如a200537113 IX. Description of the invention: [Technical field to which the invention belongs] ▲ The present invention relates generally to the configuration of a test-on-wafer integrated test system. The invention particularly relates to the configuration of a 4-card mechanical branch. The probe card has a probe substrate of a low-curve needle card. Circuits with low buckling strength [Previous technology] Due to the increase in wafer size, it is used to test the relative increase in size and complexity. Considering the larger size of the wafer = The size of the probe card substrate in the test system is usually large and designed for use = more probes or reed contacts (spring _tae 十 用 支 # 叫 冋 LJ to connect To test and test the integrated circuits (ICs). The larger probe card with additional probes usually causes a large bending load on the probe card. Although the increase in wafer size results in Youling Guba has a large probe card with a high degree of probe bifurcation, and H, still tends to use a probe card with a low flexural strength material. The reason for a probe card with a flexural strength material is-thousand conductors The complexity of the device is added, and the integrated circuit to be tested per unit area on the wafer ⑽): The electronic performance of the probe card needs to be improved. In order to achieve electronic performance, the materials and f-making technology of the space-changer substrate used in the probe-supporting probe will form a thinner and lower-strength configuration. When more of the probe card contacts of the probe card contact a wafer under test, the number of needles (load) of Un due to the increase in the density of the integrated circuit and the load further causes a large curvature of the probe card substrate. . Referring to FIG. 1 ′, a simplified block diagram of a test system for testing integrated circuits (ICs) on a semiconductor wafer using a probe card 99084.doc 200537113 is shown. The test system includes a test controller 4 connected to a test head 8 through a communication cable 6. The test system further comprises a detector 10 ′, which is composed of a platform 12 for mounting a wafer 14 to be tested, and the platform 12 is movable using a needle 16 on a probe card 18 and the The wafer 14 is in contact. The detector includes a probe card 18 that supports probes that are in contact with integrated circuits (ICs) on the wafer 14. In the test system, the test data generated by the test controller 4 is communicated through the communication. Cable 6, test head 8, probe card 18, probe 16 and finally transferred to the integrated circuits (ICs) on the wafer 14. The test results from the integrated circuits (ICs) on the wafer are then passed in reverse The probe card 18 to the test head $ are transmitted back to the test controller 4. When the test is completed, the wafer is divided into individual integrated circuits (ICs). Provided by the test controller 4 The test data is divided into the individual tester channels, which are provided by the cable 6 and are separated in the test head 8, so each channel is connected to one of the probes 16, an individual probe. From the test The channel of the head 8 is connected to the probe card through a connector 24 ". The connector 24 may be a soft i-line connector with zero insertion force (ZI.F), a pogo pin or other types of connectors. The probe card then "connects each channel to an individual probe of the probes 16. Figure 2 shows a cross-sectional view of the probe card 18 elements. The probe is configured to provide a connection with the crystal Round direct contact of the elastic probe "requires the electronic pathway and mechanical support. The probe card electronic path is composed of a printed circuit board (PCB) 30, an interposer 32, and a space transformer ". The test data from the test head 8 is provided by the flexible cable connector 24 The connection 99084.doc 200537113 device 24 is usually connected around the printed circuit board (PCB) 30. The channel transmission line 40 distributes the signal level from the child connector 24 into the printed circuit board (PCB) 30 to the printed circuit board ( pCB) contact pads on 30 to match the routing pitch of the pads on the space transformer 34. The interposer 32 includes a substrate 42 with electronic contacts for the elastic probes arranged on both sides The interposer 32 is electrically connected to individual pads on the printed circuit board (PCB) 30, and a substrate grid array (lga) is formed on the space transformer 34. The substrate grid array (LGA) pads are connected Generally arranged in a regular multi-row pattern. The transmission line 46 in a substrate 45 of the space transformer 34 distributes signal lines from the substrate grid array (LGA) to the elastic probe 16 in an array manner. It has embedded electrical circuits, Probes and connection points The intermediate transformer substrate 45 is called a probe head. Because the components to be tested on a wafer are usually operated at a relatively high frequency, the mechanical characteristics of the components that provide the electronic path support are explained by electronic requirements. The mechanical support of this substrate should include the following: 1. The deflection and stress control of the space transformer substrate 45. 2. The lateral position control of the space transformer substrate 45. 3. The precision leveling of the space transformer substrate 45. 4 · Mechanical compression control of the electrical contacts of the interposer 32 between the space transformer substrate 45 and the printed circuit board (pcb) 30. 5. Electrical insulation of all unique and inline electrical circuit structures. A driving board 50, a bracket (probe head holder) 52, an internal frame (probe head machine =) 54, an interposer 32 and a leaf spring 56 provide mechanical support for the electronic component. The driving board 50 is located on the printed circuit board (PCB) 3〇 On one side, the branch 99084.doc 200537113 is attached using τ ′ ,,, and 糸 nails 5 9 and is located on the other side. The leaf springs $ 6 are attached to this by screws 58 Bracket 52. This interposer 32 contains Two pairs of alignment pins 41 and 43 located at opposite corners of the diagonal line. ★ The alignment pins 43 on the bottom of the card board are aligned with the precise alignment holes in the frame 54. The alignment pins on the top and The precise alignment holes in the printed circuit board (PCB) 30 are aligned. The positions of the interposer pins 41 and 43 and the alignment holes in the printed circuit board (pcB) 30 and the chassis 54 control the lateral direction The movement and thus the substrate grid array (LGA) contact pads on the substrate 45 are aligned with the contact pads on the printed circuit board (PCB) 30 via the interposer spring yellow 44. The frame 54 further includes a horizontal extension 邛 60 for supporting the space transformer% located in the inner side wall portion thereof. The bracket 52 and the frame 54 provided on the outer edge of the striking space transformer 34 maintain lateral position control. Later, when the frame "attaches and supports the blade springs 56, the probe spring of the interposer 32 generates a mechanical force to separate the printed circuit board (PCB) 30 and the space transformer 34. Mechanical components for leveling include four copper balls (two labeled 66 and φ 68), which are in contact with the space transformer 34 near the corners. The copper support balls are on the substrate grid array of the space transformer 34 ( LGA) Provide a little contact on the outside of the periphery to maintain insulation with the electronic components. By advancing a screw called a leveling pin (two screws 62 and 6 are shown in the figure to adjust these spheres, the substrate can be adjusted The leveling pins 62 and 64 are spirally moved through the supports 65 located on the driving board 50 and on both sides of the printed circuit board (PC: B) 30. The leveling pins 62 and 64 are The adjustment pushes the space transformer 34 to level 4 space transformer substrates, and possibly compensate for a non-planar or curved base 99084.doc 200537113 board. As far as leveling is concerned, when there are as many as one side of the space transformer substrate 45 Between the flexible probes 16 and the wafer When a large force is applied, the advancement of the leveling pins 62 and 64 on the substrate 45 will prevent slight flushing deviations, so as to prevent multiple elastic probes 16 on the other side of the space transformer substrate 45 from contacting the wafer. For non-planar, curved or deformed substrates, flattening pins ^ and 64 can be used to compensate for deformation. For space transformers with non-parallel or flat surfaces, the leveling pins 62 and 64 are adjusted Make the surface containing the probe parallel to the surface of the wafer. For curved space transformer substrates, the advancement of leveling pins 62 and 64 at the edge of the substrate can assist the bending: the shape reaches a certain level of flatness .Because the larger substrate is more likely to bend, it is necessary to support the structure with better force to compensate for the bending. For example, the name is-Flattening tool for semiconductor contactors. (Pla 谢 如 a
Sem1Conduct()r C()ntact。^美國第 I·，？"號專利所示， 其以引用方式併入本文中。 、°之曰曰圓尺寸較小且一空間變壓器上之彈性探針數量 :到限制。因此，一”探測器，，須使該晶圓重新定位而產生 ^ °亥铋針之觸點，故該晶圓上之所有積體電路（ICs)皆 ^ ^曰曰圓捸針卡構造中使用之一般空間變壓器基板 相f的堅硬（高挽曲強度），且利用圖2中所示之該探針卡結 構志夠控制該變形及應力。 由於具有較大表面積及較多接針的空間變壓器需要較少 的觸石JL即可測試較大的晶圓，該空間變壓器基板可能因該 内插板所施加的作用力或探測所產生之彎曲作用力而破裂 甲 I : 正斜之表面。典型空間變壓器基板“係由相當堅硬 99084.doc -10 - 200537113 之多層陶瓷所建構而成。利用例如圖2中所示之該内插板 32、整平接針62和64及機架54等元件，其所達成之整平係 利用這些具有有限應力之堅硬陶瓷基板。該機架54防止該 基板因内插板32而撓曲，但郤未應付探測所造成之彎曲作 用力，因為該空間變壓器基板45在探測該晶圓時已被推離 該機架54。若基板較柔軟，其需提供較多的支撐以防止因 内插板作用力及探測過程中所施加之彎曲作用力所造成之 彎曲。 在未來，例如有機薄層板或薄膜之較柔軟基板可運用於 相當低或相對無撓曲硬度之探針卡中。其需提供一種用於 棟針卡基板之機械支撐組態，使這些低撓曲硬度/強度之 基板能夠在未承受過大變形或應力之情況下支撐。 【發明内容】 根據本發明，一種用於一探針卡之機械支撐組態提供一 低撓曲硬度/強度基板之較大支撐。 種元件根據本發明加以改良以提供該探針頭較多的機 械支撐及整平，且能使用低撓曲硬度/強度之基板。該五 種70件包括：（1)一具有較大水平延伸部長度之機架；（2) 八有4曲邛之葉片彈簧，使該等葉片彈簧可垂直伸展及接 合較靠近該等彈性探針的該内側機架；（3)—隔離撓性薄 膜’或一裝置於該探針頭機架中之負載支撐構件，其被附 加以接合較m離其邊緣的該空間變壓器基板；（4)例如整平 接針=附加支撐結構，其提供該空間變壓器基板中心附近 勺支 > 及（5) 一位於該探針及一較低撓曲強度空間變壓器 99084.doc -11 - 200537113 基板之間的高硬度介面微磚。 =一個改良是增加自該機架處水平延伸部之長度，該增 度使向外伸展超出該空間變壓器基板之金屬支撐 之機架伸展。該增加後之水平延伸部降低了施加 在1 亥工間變磨器基板邊緣上之作用力，將該作用力分散在 t間料器基板上以防止—較大基板之破裂或變形。Sem1Conduct () r C () ntact. ^ U.S.I.? As shown in the " patent, which is incorporated herein by reference. The number of elastic probes on a space transformer is smaller than the circle size: to the limit. Therefore, for a "detector", the wafer must be repositioned to produce the contact of the bismuth pin, so all integrated circuits (ICs) on the wafer are in the round pin card structure. The general space transformer substrate used is hard (high buckling strength), and the deformation and stress can be controlled by using the structure of the probe card shown in Figure 2. Because it has a larger surface area and more pin space Transformers need less touchstone JL to test larger wafers. The space transformer substrate may break due to the force exerted by the interposer or the bending force generated by detection. A: Sloping surface. A typical space transformer substrate "is constructed from a fairly rigid multilayer ceramic of 99084.doc -10-200537113. Using components such as the interposer 32, leveling pins 62 and 64, and frame 54 shown in FIG. 2, the leveling achieved is by using these hard ceramic substrates with limited stress. The rack 54 prevents the substrate from being deflected by the interposer 32, but does not cope with the bending force caused by the detection because the space transformer substrate 45 has been pushed away from the frame 54 when detecting the wafer. If the substrate is soft, it needs to provide more support to prevent bending caused by the force of the interposer and the bending force applied during the detection process. In the future, softer substrates, such as organic thin-layer boards or films, may be used in probe cards with relatively low or relatively no flex stiffness. It is necessary to provide a mechanical support configuration for the pin card substrate, so that these substrates with low flexural hardness / strength can be supported without being subjected to excessive deformation or stress. SUMMARY OF THE INVENTION According to the present invention, a mechanical support configuration for a probe card provides a large support for a low flexural hardness / strength substrate. This element is improved according to the present invention to provide more mechanical support and leveling of the probe head, and a substrate with low flexural hardness / strength can be used. The five types of 70 pieces include: (1) a frame with a large horizontal extension length; (2) eight leaf springs with four bends, allowing the leaf springs to extend vertically and engage closer to the elastic probes The inner frame of the needle; (3)-an isolation flexible film 'or a load supporting member installed in the probe head frame, which is attached to engage the space transformer base plate which is further away from its edge; (4) ) For example, leveling pin = additional support structure, which provides a spoon support near the center of the space transformer substrate > and (5) a probe and a lower flexural space transformer 99084.doc -11-200537113 substrate High hardness interface between micro-bricks. = An improvement is to increase the length of the horizontal extension from the frame. This increase extends the frame extending outward beyond the metal support of the space transformer substrate. The increased horizontal extension reduces the force exerted on the edge of the substrate of the mill converter, and disperses the force on the substrate of the feeder to prevent-cracking or deformation of the larger substrate.
第個改良疋该等葉片彈簧，且包含在該等葉片彈菁中 之多個彎曲部，使其可自該支架處垂直伸展。運用該f曲 部，利用螺絲針附接至該支架之該等葉片彈菁一尾端之弯 W ’使该寻葉片彈黃之另一端在機架上較垂直靠近該等 彈性探針之處形成彈性接觸。該彎曲部使該支架自機架處 凹陷丄故用於固時該等葉片彈簧之螺絲針不會垂直伸展靠 近該等彈性探針。使該等葉片彈簧垂直伸展之f曲部進一 步讓所施加之彈性作用力遠離該空間㈣器之邊緣而朝向 該基板之中心，以防止較大空間變壓器基板之變形或破 裂0 第二個改良是利用撓性薄m，或在該機架之水平伸展上 提供-負载支#構件，使該機架在施加之作用力遠離該空 間變壓器基板邊緣時與該空間變壓器基板接合，以防止較 大基板之變形或破裂。該水平伸展之目的是在該内插板彈 簧施加作用力至該探針頭底部上之主要區域正上方支撐著 該基板，使該空間變壓器基板夾在該内插板彈簧及已伸展 之機架堅硬支撐之間。該撓性薄膜位於該空間變壓器基板 及機架之間，以有效的形成一可變負載支撐構件，故該機 99084.doc -12- 200537113 架在遠離該空間變壓器基板周邊一點處與之接觸。利用不 同尺寸之薄膜使該負載支撐之接觸位置易於移動或調整， 以便在最小之，彎曲作用力施加至該空間變壓器基板位置處 定位該負載支撐之接觸區域。該撓性薄膜另由一聚合物材 料製成，以利在該金屬機架及空間變壓器基板上電子元件 之間提供電氣絕緣。該負載支撐構件可裝置於該機架中， 但該電氣絕緣特性及利用該撓性薄膜而改變負載支揮接觸 位置之彈性將不存在。 對第四個改良而言，附加之支撐結構配置於該空間變壓 器基板中心附近，在該基板中心提供額外的支撐以防止彎 曲或變形。該附加之支撐結構利用例如整平接針之支斤接 針’其具有直接與該基板接觸之gimble球體，或利用將一 彈性體墊片附接至該基板之類似支撐接針，或與一附接至 該空間變壓器基板之高強度金屬支撐構件接觸之支撑接 針。為避免該中央支撲結構與空間變壓器基板上基板栅格 陣列（LGA)墊片之間的電氣接觸，該空間變壓器中繞線已 改良’使中央支撲與該空間變Μ器接觸之區域中無基板栅 格陣列（LGA)塾片。在一具體實施例中，例如隔離電容器 之分離元件配置於基板栅格陣列（LGA)墊片移除之位置。 爲配合該等移除之基板栅格陣列（LGA)墊片，該内插板、碎 改良而具有彈簧觸點，其被重新排列成對應於該空間變壓 器基板上新的基板柵格陣列（LGA)墊片位置。該内插板進 一步改良含有多個開口 ’使中央支撐接針可穿過該内插板 與該空間變壓器基板接觸。該中央支撐結構可補償—空間 99084.doc -13- 200537113 變壓器基板之彎曲，且進一步在晶圓測試過程中支撐著該 基板之背部，以避免該空間變壓器因承受探針作用力而彎 曲或破裂。 對第五個改良而a，一相當堅硬之介面微碑配置於該探 針與一較低撓曲強度空間變壓器基板之間。若無該堅硬之 介面微磚，僅一低撓曲強度之空間變壓器基板，當該探針 因過大之負載使探針壓入該基板中時會造成”浮動，，接觸。 該相當堅硬之微磚分散該探針負載，防止此一低撓曲強度 之空間變壓器基板受損。該堅硬之微磚含有連接該等探針 觸點至δ亥空間變壓裔之直線饋給貫穿孔，而且在該低硬度 之空間變壓器中配備水平繞線。 【實施方式】 圖3為一用於一晶圓測試系統之探針卡之剖視圖，其根 據本發明改良以提供低撓曲硬度/強度基板所需之額外機 械支撐。圖3所示之該探針卡之元件提供類似於圖2該傳統 探針卡之電氣通路，包括一印刷電路板（pcb)3〇a、一内插 板32A及一空間變壓器34A。圖3所示之該探針卡另具有類 似於圖2之該傳統探針卡且用於該電子元件之機械支撐， 包括一驅動板50A、機架（探針頭機架）54A、支架（探針頭 支架）52A及葉片彈簧56A。圖2所示之元件具有與圖3類似 之編號，惟圖3所示之改良後元件數字標示含有字母”A，，。 本舍明採針卡之改良欲使空間變壓器基板具有限定之繞 曲強度’並非特別關注於基板在檢驗上之硬度，而是基板 將變形之探針負載。探測過程中須在該基板上反覆的施加 99084.doc •14- 200537113 負載’其可導致該基板内線跡疲勞時電氣失效。適當之線 路基板包含聚合物材料，例如聚醯亞胺、Br樹脂、fr_4、 bcb、環氧樹脂或此項技術中吾人已知的其他有機材料。 基板亦可包含銘所組成之陶竞材料、氣化石夕、低溫陶究丘 燒及例如鍵盤板夹心（coppeMnvar_copper)之絕緣金屬核: 材料。 第個改良包含相對於該水平延伸部60增加機架54八上 水平延伸部6GA之長度，如圖3所示。該長度增加之水平延 伸4 60A提供-金屬t揮，#向外伸展超出該空間變壓器 基板45A之程度大於先前之機架54。該長度增加之水平延 伸部使施加在該空間變壓器基板45A邊緣上之作用力變 小，將該作用力分散至該空間變壓器基板45A外，以防止 一較大基板之變形或破裂。傳統之水平延伸部覆蓋該空間 變壓器基板少於1〇%的區域，圖3改良後之水平延伸部6〇a 宜覆蓋該空間變壓器基板7〇%或更多的區域。 第一個改良是該等葉片彈簧56A含有彎曲部71及73。該 等彎曲部71及73使該等葉片彈簧56八自該支架52處垂直及 水平伸展。由於此彎曲部71及73，該等葉片彈簀56A 一端 利用螺絲釘58附接至該支架52，且該彎曲部使該等葉片彈 簧56A另一端與該機架54A上一位置75彈性接觸，該位置 較圖2中接觸區域77更垂直靠近該等彈性探針16。該彎曲 部71及73使該支架52自該機架54A處凹陷，故附接該等葉 片彈簣5 6 A之該螺絲釘5 8未垂直伸展靠近該等彈性探針 16。該彎曲部71及73使該等葉片彈簧56A垂直伸展而進一 99084.doc -15- 200537113 步使彈簧作用力施加至該機架54A，故所施加之作用力進 步遠離該空間變壓器基板45 A邊緣，以防止較大基板之 變形或破裂。 在一具體實施例中，第三個改良包含在該機架54A上配 置一負載支撐構件70。該負載支撐構件70自該機架54A之 水平延伸部60A處伸展而在所施加作用力遠離該基板45aThe first improvement: the leaf springs, and a plurality of bends included in the leaf springs, so that they can extend vertically from the bracket. Using the f-curved part, the screw end attached to the bracket of the blade springs with a screw pin is bent at the rear end W 'to make the other end of the blade spring yellow closer to the elastic probes on the frame. Form elastic contact. The bent portion causes the bracket to be recessed from the frame, so the screw pins of the leaf springs used for fixing will not extend vertically near the elastic probes. The f-curved portions that make the leaf springs extend further allow the applied elastic force to move away from the edge of the space container and toward the center of the substrate to prevent deformation or cracking of the transformer substrate in a larger space. The second improvement is Utilize flexible thin m, or provide-load support # members on the horizontal extension of the frame, so that the frame is engaged with the space transformer substrate when the applied force is far away from the edge of the space transformer substrate to prevent a larger substrate Deformed or cracked. The purpose of the horizontal extension is to support the substrate directly above the main area on the bottom of the probe head by applying force from the interposer spring, so that the space transformer substrate is sandwiched between the interposer spring and the extended frame Between hard supports. The flexible film is located between the space transformer substrate and the frame to effectively form a variable load supporting member, so the machine 99084.doc -12- 200537113 is in contact with the space transformer at a point far from the periphery of the space transformer substrate. The contact position of the load support is easily moved or adjusted by using films of different sizes, so as to locate the contact area of the load support at the position where the bending force is applied to the space transformer substrate at a minimum. The flexible film is also made of a polymer material to provide electrical insulation between the metal frame and the electronic components on the space transformer substrate. The load supporting member can be installed in the frame, but the electrical insulation characteristics and the flexibility of using the flexible film to change the contact position of the load support will not exist. For the fourth improvement, an additional support structure is disposed near the center of the space transformer base plate, and provides additional support at the center of the base plate to prevent bending or deformation. The additional supporting structure utilizes, for example, a leveling pin of a pin, which has a gimble sphere in direct contact with the substrate, or a similar supporting pin that attaches an elastomer pad to the substrate, or A support pin contacted by a high-strength metal support member attached to the space transformer substrate. In order to avoid electrical contact between the central branch flap structure and the substrate grid array (LGA) pad on the space transformer substrate, the windings in the space transformer have been improved to 'make the central branch flap contact the space transformer's area. Substrate-free grid array (LGA) cymbals. In a specific embodiment, a separation element such as an isolation capacitor is disposed at a position where a substrate grid array (LGA) pad is removed. In order to cope with the removed substrate grid array (LGA) pads, the interposer is improved and has spring contacts, which are rearranged to correspond to the new substrate grid array (LGA) on the space transformer substrate ) Gasket position. The interposer board is further improved to include a plurality of openings, so that the central support pin can pass through the interposer board to contact the space transformer substrate. The central support structure can compensate—space 99084.doc -13- 200537113 for the bending of the transformer substrate, and further supports the back of the substrate during wafer testing to avoid the space transformer from bending or breaking due to the probe force . For the fifth improvement, a, a relatively hard interface micro-plaque is arranged between the probe and a lower flexural space transformer substrate. Without the hard interface micro-brick, only a low-flexural strength space transformer substrate will cause "floating," contact when the probe is pressed into the substrate due to an excessive load. The fairly hard micro The bricks disperse the probe load to prevent damage to the low-deflection space transformer substrate. The hard micro-brick contains a linear feed through-hole that connects the probe contacts to the delta transformer. The low-hardness space transformer is equipped with horizontal windings. [Embodiment] FIG. 3 is a cross-sectional view of a probe card for a wafer test system, which is improved in accordance with the present invention to provide a low flexural hardness / strength substrate Additional mechanical support. The components of the probe card shown in Figure 3 provide electrical pathways similar to the traditional probe card of Figure 2, including a printed circuit board (pcb) 30a, an interposer 32A, and a space. Transformer 34A. The probe card shown in FIG. 3 also has a mechanical support similar to the conventional probe card of FIG. 2 and is used for mechanical support of the electronic component, including a drive board 50A and a frame (probe head frame) 54A. 、 Bracket (probe holder) 52A The leaf spring 56A. The elements shown in Figure 2 has a similar numbering of FIG. 3, but shown in FIG 3 after the modified element numerals with the letter "A ,,. The improvement of Ben Sheming's picking card is to make the space transformer substrate have a limited bending strength. 'It is not particularly concerned about the hardness of the substrate during inspection, but the probe load that the substrate will deform. During the detection process, it is necessary to repeatedly apply a load on the substrate 99084.doc • 14- 200537113 Load ’, which can cause electrical failure when the wiring inside the substrate is fatigued. Suitable circuit substrates include polymer materials such as polyimide, Br resin, fr_4, bcb, epoxy, or other organic materials known to me in the art. The substrate may also include ceramic materials composed of Ming, gasified rock, low-temperature ceramics, and insulating metal cores such as keyboard cores (coppeMnvar_copper): materials. The first improvement includes increasing the length of the horizontal extension 6GA on the frame 54 relative to the horizontal extension 60, as shown in FIG. The length increase of the horizontal extension 4 60A provides -metal twig, #extending beyond the space transformer substrate 45A to a greater extent than the previous frame 54. The increased horizontal extension portion reduces the force applied to the edge of the space transformer substrate 45A, and distributes the force outside the space transformer substrate 45A to prevent deformation or cracking of a larger substrate. Conventional horizontal extensions cover less than 10% of the space transformer substrate. The improved horizontal extension 60a of Figure 3 should cover 70% or more of the space transformer substrate. The first improvement is that the leaf springs 56A include curved portions 71 and 73. The curved portions 71 and 73 cause the leaf springs 56 to extend vertically and horizontally from the bracket 52. Due to the curved portions 71 and 73, one end of the blade springs 56A is attached to the bracket 52 with a screw 58 and the curved portion elastically contacts the other end of the blade springs 56A with a position 75 on the frame 54A. The position is closer to the elastic probes 16 than the contact area 77 in FIG. 2. The bent portions 71 and 73 recess the bracket 52 from the frame 54A, so the screws 5 8 attached to the leaf springs 5 6 A are not vertically extended near the elastic probes 16. The curved portions 71 and 73 extend the leaf springs 56A vertically to a distance of 99084.doc -15- 200537113, so that the spring force is applied to the frame 54A, so the applied force progresses away from the 45 A edge of the space transformer substrate. To prevent deformation or cracking of the larger substrate. In a specific embodiment, a third modification includes disposing a load supporting member 70 on the frame 54A. The load supporting member 70 extends from the horizontally extending portion 60A of the frame 54A and moves away from the substrate 45 a under an applied force.
周邊一位置處與該空間變壓器基板45 A接觸，以防止較大 基板之變形或破裂。 在另一具體實施例中，第三個改良利用位於該空間變壓 器基板45A及機架54B之間的撓性薄膜8〇及82，如圖4所 =。由圖3沿用至圖4之其他元件在圖4中具有類似之編號 標示。該撓性薄膜80及82有效地形成圖3之該負載支撐構 件70 ,使該機架54B在遠離其邊緣一位置處與該空間變壓 裔基板45A接觸。一第一薄膜80之輪廓配合該機架54b之 水平延伸部60A之形狀，而該第二薄膜82具有一受到較多 限制之尺寸，以有效的提供圖3該負載支撐構件7〇。該第 二薄膜82附接至該第一薄膜80以利支撐。利用不同尺寸之 該第二薄膜82,使該負載支撐之位置易於移動或調整，以 便該負載支撐位於作用力使該空間變壓器34A變形最少的 位置。 “根據本發明一具體實施例，該撓性薄膜8〇及82由聚合物 薄膜材料所製成，以利在該金屬機架54B及該空間變壓器 基板45A上電子元件之間提供電氣絕緣。做為隔離薄膜之 -替代選擇，-單-薄膜可藉由接合兩層較薄之聚合物薄 99084.doc -16 - 200537113 膜層80及82在―起而形成，使該薄膜表面之内側部位厚度 大於外側部位。做為另一替代選擇，可使用一含有該薄膜 80的單一薄膜82。 、 利用承合物薄臈提供該基板45Α與金屬機架54β電氣絕 緣。因圖3該負載支撐構件7〇配置於該金屬機架54β中，其 無法提供電氣絕緣特徵及利用不同尺寸撓性薄膜82而改變 該負載支撐區域之彈性。然而，在一具體實施例中，若該 薄膜為非必要的，該撓性薄膜8〇及82係用以決定圖3該金 屬負載支撐構件70之位置。爲決定該金屬負載支撐構件之 取佳位置，其利用不同尺寸之撓性薄膜82且分別量測該基 板45Α之撓性。當選定一最佳之薄膜82時，其位置係用以 決疋该金屬負載支撐構件70配置於圖3該機架54α中之位 置。 對第四個改良而言，額外的支撐結構接觸該空間變壓器 基板中心附近，提供該基板中心内額外的支撐，以防止變 形或f曲。在一具體實施例中，㈣外的支樓係利用兩附 加之支撐接針72及74以及球體76及78(材質可能是銅）接觸 該空間變壓器基板45A中心附近。雖然所示之支撐接針72 及74以及球體76及78是分離的，在一具體實施例中其可結 合以形成具有圓弧端之支撐接針。做為另一替代選擇，該 支撐接針72及74可具有平坦端，此時一與該空間變壓器基 板接觸之gimble點並不重要。 為防止該等球體76及78與該空間變壓器基板45 a上基板 柵格陣列（LGA)墊片之間的接觸，傳輪線46A在該空間變 99084.doc 17 200537113 壓器34A中之繞線已相對於圖2加以改良，故在兩個附加球 體76及78接觸之區域中無墊片。同樣的，該内插板32八經 改良而具有對應至該空間變壓器基板上新墊片位置之彈簧 一 觸點44A。該内插板32A進一步改良含有開口，使該兩接 針72及74可穿過該内插板32A中心接觸該等球體76及78至 _ 空間變壓器基板45A。 貫際上，可能先利用周邊整平接針螺絲釘62及64來調整 _ 該空間變壓器34A之平面性，藉此執行該探針卡之組裝及 整平。一旦該空間變壓器基板45A為平面的，中央支撐接 針螺絲釘72及74向前移動而與該基板45A接觸，以對應該 探針負載使該空間變壓器34A呈穩定狀態。該螺絲釘72及 74之調整進一步可補償該基板之任何彎曲。 移除該空間變壓器中央附近之基板栅格陣列（lga)墊片 以提供該中央支撐接針72及74，使該基板具有額外的分離 元件75。爲提昇該探針卡總成之性能，該分離元件乃宜為 φ 去耦合電容器。去耦合電容器用以補償該測試器與探針之 間的線路電容，線路電容造成信號延遲，以及透過探針往 返於晶圓提供之測試信號中的雜訊。 利用去耦合電容器，將該電容器至探針之設定距離最小 而使性能提昇。圖7顯示該空間變壓器34上去耦合電容器 • 75與探針16之間的距離，，d，，最小將提昇性能，但可能使該 • 基板強度降低。當該距離，，d”變短時，在裝載該探針16之 過程中，由中央支撐接針72及74所提供之背面支撐係有必 要0 99084.doc -18- 200537113 圖為圖34¼針卡凡件之爆炸組合圖，圖6為圖*該探針 卡：件之爆炸組合圖。圖6之組態是改良自圖5,其包含兩 層薄膜80及82。圖5之探針卡利用_配置於該機架54八中之 負載支撐構件70(面向下且圖5中未顯示），而非薄膜及 82 ° 參見圖5及6 ’如圖所示，背板5〇Α利用兩個螺絲釘洲 接至該印刷電路板（PCB)30A及支架52。包含螺絲釘似64 之整平螺絲釘穿過背板5〇A及印刷電路板（pcB)3〇A，在靠 近該空間變屋器34A邊角附近位置處到達包含球體織⑼ 個球體。庄忍圖3及4之剖示圖係非均勻切割’而非通 過圖5及6之線性平面，以顯示兩邊角整平螺絲釘^及料， 以及在該空間變壓器34A中央附近位置處提供給接觸球體 及78之新i曰中央支撐螺絲釘72及74。如圖$及6所示，該 中央支撐螺絲釘72及74穿過背板5〇A及印刷電路板 (PCB)3GA，其不同於螺絲釘62及64穿過該内插板32A中一 | 開口。圖5所示之該機架54A直接位於該空間變壓器34A上 方，且接合在該支架52中。雖然外加的螺絲釘圖中未 顯示）配置於整個周邊以附接該等葉片彈簧56八，惟所示之 兩個螺絲釘58係參考之用。圖6中機架34A藉由該薄膜髮 82與該空間變壓器基板隔開。 雖然圖3至6顯示一具體實施例之背面支撐由一或多個支 撐接針螺絲釘72及74所提供，惟圖8八至犯顯示其他有效 之具體實施例。圖8A之具體實施例含有一支撐接針料，其 可為該背板50及印刷電路板（PCB)30中貫穿之螺絲釘以推 99084.doc -19- 200537113 進一 gimble球體86。之後該等球體86與位於一高密度彈性 體墊片90上方之金屬板88形成一旋轉觸點，該彈性體墊片 9〇再與位於該空間變壓器34上方之分離元件75接觸。該彈 性體墊片90使該元件75自該金屬板88處絕緣。利用圖8八所 不之支撐組態，一單一整平接針84可將作用力傳遞至該金 屬板88，以利在該空間變壓器34—較大區域上提供一整平 作用力。此外，雖然該彈性體墊片直接與該空間變壓器基 鲁 板接觸，若分離元件75非必要，圖8A之該彈性體墊片確保 该分離元件7 5之絕緣。 圖8B顯示包含一支撐接針84之支撐結構另一具體實施 例，该支撐接針84可為該背板5〇及印刷電路板（pcB)3〇* 貝穿之螺絲釘以推進一gimble球體86，之後該等球體％與 附接至空間變壓器34背面之堅硬支撐構件92接觸。如圖 所不，該支撐構件92具有配合例如電容器之分離元件75之 開口，或為一無此類開口之平板。該高硬度構造92之材質 • 可為金屬或陶瓷材料。該高強度結構92可用以防止該等彈 性探針16與一晶圓接觸所產生之過大負載，造成由低挽曲 強f材料所製成之該空間變壓器機械損壞。當該探針16與 一晶圓接觸時，該支撐接針84可調整以進一步補償該支撐 構件92上彈性探針負載。 • 直雖羔圖3至6亦揭示利用一具有彈簧觸點之内插板32，惟 • 其他不同之構造亦可用於將該空間變壓器34電氣連接至該 刷電路板（PCB)30，如圖9及10所示。圖9顯示另一彈簧 接針94將該印刷電路板（PCB)30連接至該空間變壓器34之 99084.doc -20- 200537113 配置。該彈簧接針94承受彈性負載且位於一基板96兩側 邊，以類似於前述圖式中該内插板32之功能。雖然顯示在 兩側邊上，該彈簧接針94可位於該基板96一側邊上，其他 非彈性連接器位於另一側邊上，或彈簧接針可配置在其他 組態中，例如圖10另顯示彈簧接針96在無中間基板的情況 下將居印刷電路板（pCB)3連接至該空間變壓器。 圖11顯示根據本發明之第五個改良，其改變圖4該探針 卡結構，而包含一位於該探針16及一較低撓曲強度空間變 壓器基板45B之間的堅硬介面微磚1〇〇。在無該介面微磚 1〇〇的情況下，若探針負載過大時造成，，浮動”觸點，有效 地將該探針16壓入該空間變壓器基板45B。該高硬度介面 微磚1〇〇分散探針負載，防止此一低撓曲強度空間變壓器 基板之機械損壞。製造一低撓曲強度空間變壓器基板之材 料範例包含例如FR4之有機材料，或一低溫共燒陶免 (LTCC)。用於該堅硬介面微磚1〇〇 一較高撓曲強度材料之 範例包含一高溫共燒陶瓷（HTCC)。 該高硬度介面微磚100含有將該探針電氣連接至該空間 變壓器之直線饋給貫穿孔道1 〇2。該孔道丨〇2藉由銲錫珠 104加以附接，以類似該空間變壓器基板45B中之傳輸線。 產于錫珠1 0 4另將該介面微磚1 〇 〇附接至該空間變壓器基板 45B，之後水平繞線藉由傳輸線46A配置於該低硬度空間 變壓器基板45B中而連接至該内插板32A。雖然以圖4該探 釗組怨顯不该向硬度介面微碑10 〇，惟該堅硬介面微碑 100可類似用於圖3之組態或其他本文所揭示之其他組態。 99084.doc -21 - 200537113 雖然本發明以料項目揭示於敎，其僅係教導熟習本 項技藝者如何製造及利用本發明。許多額 發明後述申請專利之範•中。 良將在本 【圖式簡單說明】 本發明藉由附圖之協助而能進一步的詳述，其中： 圖1顯示一典型晶圓測試系統之元件方塊圖； 圖2為用於圖丨晶圓測試系統一傳統探針卡之剖視圖； 圖3為根據本發明用於一晶圓測試系統之一探針卡之剖 視圖； 彈I*生支撐薄膜之一探針卡之剖視圖，· 圖5為圖3探針卡元件之爆炸組合圖； 圖6為圖4探針卡元件之爆炸組合圖； =為。-探針卡具有隔離電容器部位之剖視圖，顯示空 間交壓器基板厚度"d"如何影響絕緣丨 ·‘、、The space transformer substrate 45 A is in contact with the peripheral location to prevent deformation or cracking of the larger substrate. In another specific embodiment, the third modification utilizes flexible films 80 and 82 located between the space transformer substrate 45A and the frame 54B, as shown in FIG. 4. The other components inherited from FIG. 3 to FIG. 4 are similarly labeled in FIG. 4. The flexible films 80 and 82 effectively form the load supporting member 70 of FIG. 3, so that the frame 54B is in contact with the space transformer substrate 45A at a position away from the edge thereof. The outline of a first film 80 matches the shape of the horizontal extension 60A of the frame 54b, and the second film 82 has a more restricted size to effectively provide the load supporting member 70 in FIG. The second film 82 is attached to the first film 80 for support. By using the second film 82 of a different size, the position of the load support is easily moved or adjusted, so that the load support is located at a position where the force causes the space transformer 34A to deform the least. "According to a specific embodiment of the present invention, the flexible films 80 and 82 are made of a polymer film material, so as to provide electrical insulation between the metal frame 54B and the electronic components on the space transformer substrate 45A. Do As an alternative to the insulation film, the -single-film can be formed by joining two thinner polymer films 99084.doc -16-200537113 to form the film layers 80 and 82, so that the thickness of the inner part of the film surface Larger than the outer part. As another alternative, a single thin film 82 containing the thin film 80 may be used. The substrate 45A is electrically insulated from the metal frame 54β using a support thin film. The load supporting member 7 is shown in FIG. 3 Disposed in the metal frame 54β, it cannot provide electrical insulation characteristics and use different sizes of flexible films 82 to change the elasticity of the load support area. However, in a specific embodiment, if the film is unnecessary, the Flexible films 80 and 82 are used to determine the position of the metal load supporting member 70 in Fig. 3. In order to determine the optimal position of the metal load supporting member, flexible films 82 of different sizes are used and divided. Measure the flexibility of the substrate 45A. When an optimal film 82 is selected, its position is used to determine the position of the metal load supporting member 70 in the frame 54α of FIG. 3. For the fourth improvement, In other words, the additional supporting structure contacts the center of the space transformer base plate, and provides additional support in the center of the base plate to prevent deformation or f-curve. In a specific embodiment, the branch building outside the base uses two additional support pins. 72 and 74 and spheres 76 and 78 (the material may be copper) contact the center of the space transformer substrate 45A. Although the support pins 72 and 74 and the spheres 76 and 78 shown are separated, in a specific embodiment, they may Combined to form a support pin with an arcuate end. As another alternative, the support pins 72 and 74 may have flat ends, at which time a gimble point that is in contact with the space transformer substrate is not important. To prevent this After the contact between the spheres 76 and 78 and the substrate grid array (LGA) pads on the space transformer substrate 45a, the winding of the transfer line 46A in the space has been changed. 99084.doc 17 200537113 Figure 2 is modified Good, so there are no shims in the area where the two additional spheres 76 and 78 are in contact. Similarly, the interposer 32 is modified to have a spring 44a corresponding to the position of the new shim on the space transformer substrate. The interposer 32A is further improved to include openings, so that the two pins 72 and 74 can pass through the center of the interposer 32A to contact the spheres 76 and 78 to the space transformer substrate 45A. In the past, it may be necessary to use the peripheral adjustment first. Adjust the flatness of the space transformer 34A with the flat pin screws _ 34A, to perform the assembly and leveling of the probe card. Once the space transformer substrate 45A is flat, the central support pin screws 72 and 74 It moves forward to make contact with the substrate 45A to make the space transformer 34A stable in response to the probe load. The adjustment of the screws 72 and 74 can further compensate for any bending of the substrate. The substrate grid array (lga) spacers near the center of the space transformer are removed to provide the central support pins 72 and 74, so that the substrate has an additional separation element 75. In order to improve the performance of the probe card assembly, the separation element is preferably a φ decoupling capacitor. The decoupling capacitor is used to compensate the line capacitance between the tester and the probe. The line capacitance causes signal delay and noise in the test signal provided by the probe back to the wafer. By using a decoupling capacitor, the set distance between the capacitor and the probe is minimized to improve performance. Figure 7 shows that the distance between the decoupling capacitor • 75 and the probe 16 on the space transformer 34, d, and the minimum will improve performance, but may reduce the substrate strength. When the distance, d "becomes shorter, the back support provided by the central support pins 72 and 74 is necessary during the loading of the probe 16. 0 99084.doc -18- 200537113 The picture shows the 34¼ pin Figure 6 shows the explosion combination of the card. Figure 6 is the probe card: The combination of the explosion of the probe card. The configuration of Figure 6 is improved from Figure 5 and contains two layers of films 80 and 82. The probe card of Figure 5 Utilize the load supporting member 70 (facing downwards and not shown in Fig. 5) arranged in the frame 54, instead of a thin film and 82 °. See Figs. 5 and 6 'As shown, the back plate 5〇Α uses two A screw continent is connected to the printed circuit board (PCB) 30A and the bracket 52. A leveling screw containing a screw-like 64 passes through the back plate 50A and the printed circuit board (pcB) 30A, and is near the space transformer. 34A near the corner reached the sphere containing the ball weave. Zhuang Ren's cross-sectional views in Figures 3 and 4 are non-uniform cuts' instead of passing through the linear planes in Figures 5 and 6 to show the leveling screws at both corners. , And the new central support screws 72 and 74 provided to the contact ball and 78 at a position near the center of the space transformer 34A. As shown in Figures 6 and 6, the central support screws 72 and 74 pass through the back plate 50A and the printed circuit board (PCB) 3GA, which is different from the screws 62 and 64 that pass through the first | opening in the interposer 32A. Figure 5 The frame 54A shown is located directly above the space transformer 34A and is engaged in the bracket 52. Although not shown in the extra screws), it is arranged on the entire periphery to attach the leaf springs 568. The two screws 58 are for reference. The frame 34A in FIG. 6 is separated from the space transformer substrate by the film hair 82. Although FIGS. 3 to 6 show the back support of a specific embodiment by one or more support pins The screws 72 and 74 are provided, but FIG. 8-8 shows other effective specific embodiments. The specific embodiment of FIG. 8A contains a supporting pin material, which can be the back plate 50 and the printed circuit board (PCB) 30 The through screws push 99084.doc -19- 200537113 into a gimble sphere 86. The spheres 86 then form a rotating contact with a metal plate 88 located above a high-density elastomer gasket 90. The elastomer gasket 9o. And the separation element 7 located above the space transformer 34 5. Contact. The elastomeric gasket 90 insulates the element 75 from the metal plate 88. Using the support configuration shown in Figure 8 and 8, a single leveling pin 84 can transmit the force to the metal plate 88, In order to provide a leveling force on a large area of the space transformer 34. In addition, although the elastomer gasket directly contacts the base plate of the space transformer, if the separation element 75 is unnecessary, the elastomer of FIG. 8A The spacer ensures the insulation of the separation element 75. Fig. 8B shows another specific embodiment of the supporting structure including a supporting pin 84. The supporting pin 84 can be the back board 50 and the printed circuit board (pcB) 3. * The screws are worn to advance a gimble sphere 86, after which the spheres are in contact with a rigid support member 92 attached to the back of the space transformer 34. As shown in the figure, the supporting member 92 has an opening to fit the separation element 75 of, for example, a capacitor, or a flat plate without such an opening. Material of this high hardness structure 92 • Can be made of metal or ceramic. The high-strength structure 92 can be used to prevent an excessive load caused by the elastic probes 16 coming into contact with a wafer, causing mechanical damage to the space transformer made of a low-buckling strong f material. When the probe 16 is in contact with a wafer, the support pin 84 can be adjusted to further compensate for the elastic probe load on the support member 92. • Although figures 3 to 6 also show the use of an interposer 32 with spring contacts, other different configurations can also be used to electrically connect the space transformer 34 to the brushed circuit board (PCB) 30, as shown in the figure. 9 and 10. FIG. 9 shows a configuration of 99084.doc -20-200537113 connecting another printed circuit board (PCB) 30 to the space transformer 34 with another spring pin 94. The spring contact 94 receives elastic load and is located on both sides of a base plate 96, so as to have a function similar to that of the interposer 32 in the aforementioned drawings. Although shown on both sides, the spring contact 94 can be located on one side of the base plate 96, other non-elastic connectors can be located on the other side, or the spring contact can be configured in other configurations, such as Figure 10 It is also shown that the spring pin 96 connects the residential printed circuit board (pCB) 3 to the space transformer without an intermediate substrate. FIG. 11 shows a fifth improvement according to the present invention, which changes the structure of the probe card of FIG. 4 and includes a hard interface micro-brick 1 between the probe 16 and a lower flexural space transformer substrate 45B. 〇. In the absence of the interface micro-brick 100, if the probe is overloaded, a “floating” contact effectively presses the probe 16 into the space transformer substrate 45B. The high-hardness interface micro-brick 100 O Disperse the probe load to prevent mechanical damage to the low flexural space transformer substrate. Examples of materials for making a low flexural space transformer substrate include organic materials such as FR4, or a low temperature co-fired ceramic (LTCC). An example of a high flexural strength material 100 for the hard interface microbrick includes a high temperature co-fired ceramic (HTCC). The high hardness interface microbrick 100 contains a linear feed that electrically connects the probe to the space transformer. The through-hole 10 is provided. The through-hole 2 is attached by solder beads 104 to resemble the transmission line in the space transformer substrate 45B. Produced in tin beads 104 and attaches the interface microbrick 100 To the space transformer substrate 45B, and then the horizontal winding is connected to the interposer 32A through the transmission line 46A in the low-hardness space transformer substrate 45B. Although the probe group in Figure 4 complains that it should not be a monument to the hardness interface 10 〇, but the hard interface micro monument 100 can be used similarly to the configuration of Figure 3 or other configurations disclosed herein. 99084.doc -21-200537113 Although the present invention is disclosed in the project, it is only a teaching practice How this artist made and used the invention. Many inventions will be described in the patent application process later. Good will be in this [simplified illustration of the drawing] The invention can be further detailed with the help of the drawings, where: 1 shows a block diagram of a typical wafer test system; FIG. 2 is a cross-sectional view of a conventional probe card used in the wafer test system; FIG. 3 is a probe card used in a wafer test system according to the present invention Sectional view; Sectional view of one of the probe cards with the elastic support film, Fig. 5 is an exploded assembly diagram of the probe card element of Fig. 3; Fig. 6 is an exploded assembly diagram of the probe card element of Fig. 4; = is.- The probe card has a cross-sectional view of the isolation capacitor portion, showing how the thickness of the space transformer substrate " d " affects the insulation 丨 · ,,,
圖8A顯示另一探針卡組態，其中央支擇利用 片配置於一空間變壓器； 體墊 圖8B顯示另一探針卡組態，其中 間變屢器之堅硬令央支撐結構；、牙-附接至該空 圖9為另一探針卡組態之剖視圖 之基板兩側邊處之彈簣測試針； 】用代曰—内插板 圖10顯示另一探針+ 4能 板（PCB)直接連接至該.變;^ :測試針將該印刷電路 圖-示-改良—之：視圖，以包含一位 99084.doc •22- 200537113 於該探針及一低撓曲強度空間變壓器基板之間的堅硬介面 微磚。 【主要元件符號說明】Fig. 8A shows another probe card configuration, the central option of which is used in a space transformer; Figure 8B shows another probe card configuration, the rigid support structure of the intermediate transformer; -Attached to the empty Figure 9 is a cross-sectional view of another probe card configuration with the impulse test pins at both sides of the base plate;] using a plug-in board Figure 10 shows another probe + 4 energy board ( PCB) directly connected to the transformer; ^: test pin to the printed circuit diagram-show-improve-of: a view to include a bit 99084.doc • 22- 200537113 to the probe and a low flex space transformer substrate Hard interface between microbricks. [Description of main component symbols]
4 控制器 6 通訊纜線 8 測試頭 10 探測器 12 平台 14 晶圓 16 探針 18 探針卡 24 連接器 30, 30A 印刷電路板 32, 32A 内插板 34, 34A 空間變壓器 40, 46, 46A 傳輸線 41，43 接針 42, 45, 45A，45B，96 基板 44, 44A 探針彈簀 50, 50A 驅動板 52, 52A 支架 54, 54A，54B 機架 56, 56A 葉片彈簧 58, 59, 62, 64, 72, 74 螺絲釘 99084.doc -23- 200537113 60, 60A 65 66, 68, 76, 78, 86 70 71，73 84, 94, 96 75 774 Controller 6 Communication cable 8 Test head 10 Detector 12 Platform 14 Wafer 16 Probe 18 Probe card 24 Connector 30, 30A Printed circuit board 32, 32A Interposer 34, 34A Space transformer 40, 46, 46A Transmission lines 41, 43 Pins 42, 45, 45A, 45B, 96 Baseplate 44, 44A Probe impeachment 50, 50A Drive plate 52, 52A Bracket 54, 54A, 54B Frame 56, 56A Leaf spring 58, 59, 62, 64, 72, 74 screws 99084.doc -23- 200537113 60, 60A 65 66, 68, 76, 78, 86 70 71, 73 84, 94, 96 75 77
80, 82 88 90 92 100 102 104 延伸部 支撐物 球體 負載支撐構件 彎曲部 接針 去耦合電容器 接觸區域 薄膜 金屬板 墊片 支撐構件 微磚 孔道 鲜錫珠80, 82 88 90 92 100 102 104 Extension Support Sphere Load support member Bending part Pin Decoupling capacitor Contact area Thin film Metal plate Gasket Support member Micro brick Hole Fresh tin beads
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