TW200536030A - Ball grid array package structure, package substrate and solder-ball pad structure thereon - Google Patents
Ball grid array package structure, package substrate and solder-ball pad structure thereon Download PDFInfo
- Publication number
- TW200536030A TW200536030A TW93111709A TW93111709A TW200536030A TW 200536030 A TW200536030 A TW 200536030A TW 93111709 A TW93111709 A TW 93111709A TW 93111709 A TW93111709 A TW 93111709A TW 200536030 A TW200536030 A TW 200536030A
- Authority
- TW
- Taiwan
- Prior art keywords
- patent application
- scope
- item
- ball
- substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 101
- 229910000679 solder Inorganic materials 0.000 claims abstract description 106
- 239000000463 material Substances 0.000 claims description 55
- 238000004806 packaging method and process Methods 0.000 claims description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- 230000001788 irregular Effects 0.000 claims description 6
- 239000000084 colloidal system Substances 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 16
- 238000000034 method Methods 0.000 description 7
- 238000007789 sealing Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229940125898 compound 5 Drugs 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
200536030 五、發明說明（1) 發明所屬之技術領城 本發明是有關於一種封裝結構、封裝基板 (packaging substrate)及其銲球墊（s〇lder—baU pad )結構’且特別是有關於一種能夠增進接合強度之封裝基 板及其銲球墊結構與球腳袼狀陣列封裝結構。 先前技術 一近年來，隨著半導體製程技術的不斷成熟與發展，各 種高效能的電子產品不斷推陳出新，而電子產品的功能朝 向人性化與多功能等方面發展，然而電子產品内部均有各 種功能不一的積體電路（IC)元件。在電子元件的製作過 程中，，體電路封裝扮演著相當重要的角色，而積體電路 封裝型悲可大致區分為雙邊引腳封裝（Dual In_line Package，DIP )、球狀陣列封裝（BaU Grid Array Package， BGA )與貼帶自動接合（Tape Aut〇matic Binding」 TAB )封裝等型式，且每種封裝形式均具有其特 生。就球狀陣列式而言，此種封裝技術利用銲球 方^ d6 Γ BaU)佈滿整個基板（Substrate)之底面積的 方式’ ^取代傳統的金屬導線架（Lead fram〇的引腳。 覆曰之^狀陣列封裝係採用打線（Wire BondinS)或 覆日日（Flip Chip)的方式，將曰 電性耦桩，* u 將日日片的接點與基板的接點 = =基板之内Λ線路層連接到基板底面，最 面之接點，而上述之接點上均有銲表刀'植接基板底 陣列式封裝能夠利用整個基板的底面構。由於球狀 m積作為接點的分佈200536030 V. Description of the invention (1) The technology that the invention belongs to The present invention relates to a packaging structure, a packaging substrate and a solder-baU pad structure ', and more particularly to a packaging structure A packaging substrate capable of improving bonding strength, a solder ball pad structure thereof, and a ball-foot ball-shaped array packaging structure. The previous technology. In recent years, with the continuous maturity and development of semiconductor process technology, various high-performance electronic products are constantly being introduced, and the functions of electronic products are developing towards humanization and multi-function. However, there are various functions in electronic products. One integrated circuit (IC) component. In the manufacturing process of electronic components, the body circuit package plays a very important role, and the integrated circuit package type can be roughly divided into bilateral lead package (Dual In_line Package (DIP)), spherical array package (BaU Grid Array Package (BGA) and tape automatic binding (Tape Automatic Binding "TAB) packaging and other types, and each packaging form has its own characteristics. As far as the spherical array is concerned, this packaging technology uses a solder ball square ^ d6 Γ BaU) to cover the entire bottom area of the substrate (Substrate) '^ instead of the traditional metal lead frame (Lead fram0 pins. The ^ -shaped array package adopts the method of wire bonding (Flip Chip) or Flip Chip to electrically couple the piles. * U The contact between the Japanese-Japanese chip and the substrate = = within the substrate The Λ circuit layer is connected to the bottom surface of the substrate, the topmost contact point, and the above-mentioned contact points are provided with a soldering knife. The "bottomed substrate bottom array package" can utilize the bottom surface structure of the entire substrate. Because the spherical m-product is used as the contact point distributed
200536030 五、發明說明（2) 區，故具有高腳數（High Pin Count)的優勢。此外，在 迴銲（ref low )作業時，銲球熔解後的表面張力可產生自 我校準（Self Alignment)的現象，故銲球之對位精度要 求不高，再加上接合強度好、優良的電氣特性，使得^狀 陣列式封裝成為目前積體電路封裝的主流之一。 請參考第1圖，其繪示習知的封裝基板之單一銲球的 别面圖。習知的封裝基板丨00包括一基材丨1〇、一線路 112、一銲球墊120與一銲球13〇。其中，基材n〇具有一線 路1 1 2，而線路1丨2位於基材丨丨〇内部，且銲球墊1 2 〇位於某 材11〇表面，並與線路112電性連接。此外，銲球13〇係配二 銲球墊120上。為了量測銲球13〇與銲球墊12〇的接合 ? = if銲球130與銲球塾120進行相關的機械性 土 = 5式例5剪力推球測試（BaU Shear Test)等，而势 上，：:式ΐ ί是用一推柄（未繪示）接觸於銲球13 〇 測之最大』Λ、ί固定，率的位移，並且同時量測推柄所感 球塾12〇之接二声而\大推力值也可以視為銲球13〇與銲 丄Γ二Vi二 由於鮮球墊12°為平面，所以銲球 13 ”鈐球墊120之接合面積最多等於 =而=製程會影響銲球13()與銲球塾12()之接20合之面面積積大 造成鮮i Γ3 〇佳與的銲迴球*=之J :::广製程參數^ =銲—輝球巧墊120之* 有鑒於此’本發明的目的就是在提供一種鲜球塾結 I2643twf.ptd 第9頁 200536030 五、發明說明（3) 構，以致於銲球與銲球墊的接合面積能夠增加，而改善銲 球與銲球墊的接合強度。 此外，本發明的再一目的是提供一種封裝基板，以致 於銲球與銲球墊的接合面積能夠增加。 基於上述目的或其他目的，本發明提出一種銲球墊結 構，其適於配置在一基材上，以與基材中之一線路電性連 接，並承載一銲球，而銲球墊結構例如包括一連接墊與一 凸起部（protrusion)。其中，連接塾係配置於基材上， 以與線路電性連接，而凸起部係配置於連接墊上。 依照本發明較佳實施例所述之銲球墊結構，上述之連 接墊之材質與凸起部之材質相同。此外，連接墊之材質與 凸起部之材質例如包括銅或铭。 依照本發明較佳實施例所述之銲球墊結構，上述之連 接墊之材質與凸起部之材質不相同。此外，連接墊之材質 例如包括銅，且凸起部之材質例如包括铭。或者，連接墊 之材質例如包括紹，且凸起部之材質例如包括銅。 依照本發明較佳實施例所述之銲球墊結構，上述之凸 起部例如包括一柱狀結構。此外，柱狀結構例如包括圓形 柱狀結構、橢圓形柱狀結構、多邊形柱狀結構或不規則形 柱狀結構。 基於上述目的或其他目的，本發明提出一種封裝基 板，其例如包括一基材、多個銲球墊與多個銲球。其中， 基材係具有一線路，而每一銲球墊係配置於基材上，以與 線路電性連接，而連接墊係配置於基材上以與線路電性連200536030 V. Description of the invention (2) area, so it has the advantage of High Pin Count. In addition, during the reflow (ref low) operation, the surface tension after the solder ball melts can produce a self-alignment phenomenon. Therefore, the alignment accuracy of the solder ball is not high, and the joint strength is good and excellent. Electrical characteristics make ^ -shaped array packaging become one of the mainstream of integrated circuit packaging. Please refer to FIG. 1, which illustrates another view of a single solder ball of a conventional package substrate. The conventional package substrate 00 includes a substrate 110, a circuit 112, a solder ball pad 120, and a solder ball 130. Among them, the substrate n0 has a line 1 12, the line 1 2 is located inside the substrate 1, and the solder ball pad 12 2 is located on the surface of a certain material 11 and is electrically connected to the line 112. In addition, the solder ball 130 is provided on the two solder ball pads 120. In order to measure the joint between the solder ball 13 and the solder ball pad 12? = If the solder ball 130 and the solder ball 塾 120 are related to the mechanical soil = Equation 5 Example 5 Shear Test (BaU Shear Test), etc., and On the potential: :: styleΐ ί is the maximum measured with a push handle (not shown) in contact with the solder ball 13 〇 Λ, ί is fixed, the displacement of the rate is measured, and the ball received by the push handle is measured at the same time. The value of two sounds and high thrust can also be regarded as solder ball 13 and solder ball Γ Γ Vi. Because the fresh ball pad 12 ° is flat, the joint area of solder ball 13 ”ball pad 120 is at most equal to = and = process will A large area of the area where the solder ball 13 () and the solder ball 塾 12 () are connected to each other results in a large i Γ3 〇Good welding back ball * = J :: Wide process parameters ^ = Welding-glow ball In view of this, 'the purpose of the present invention is to provide a fresh ball knot I2643twf.ptd page 9 200536030 V. Description of the invention (3) structure, so that the bonding area of the solder ball and the solder ball pad can be increased, And the bonding strength between the solder ball and the solder ball pad is improved. In addition, another object of the present invention is to provide a package substrate so that the bonding area between the solder ball and the solder ball pad can be Based on the foregoing or other objectives, the present invention provides a solder ball pad structure, which is suitable for being disposed on a substrate to be electrically connected to one of the lines in the substrate, and to carry a solder ball, and the solder ball pad The structure includes, for example, a connection pad and a protrusion. The connection pad is disposed on the base material to be electrically connected to the circuit, and the protrusion is disposed on the connection pad. According to a preferred embodiment of the present invention In the solder ball pad structure, the material of the above-mentioned connection pad is the same as that of the convex portion. In addition, the material of the connection pad and the material of the convex portion include, for example, copper or an inscription. According to the preferred embodiment of the present invention, In the structure of a solder ball pad, the material of the above-mentioned connection pad is different from that of the protrusion. In addition, the material of the connection pad includes, for example, copper, and the material of the protrusion includes, for example, inscription. Or, the material of the connection pad includes, for example, Shao, The material of the protrusions includes, for example, copper. According to the solder ball pad structure described in the preferred embodiment of the present invention, the protrusions include, for example, a columnar structure. In addition, the columnar structure includes, for example, a circular columnar structure. Structure, elliptical columnar structure, polygonal columnar structure, or irregular columnar structure. Based on the above or other objectives, the present invention provides a package substrate, which includes, for example, a substrate, a plurality of solder ball pads, and a plurality of solders. Wherein, the substrate has a circuit, and each solder ball pad is disposed on the substrate to be electrically connected to the circuit, and the connection pad is disposed on the substrate to be electrically connected to the circuit.
12643twf.ptd 第10頁 200536030 五、發明說明（4) 接，而凸起部係配置於連接墊上。此外，每一銲球係配置 於這些銲球墊其中之一上。 依照本發明較佳實施例所述之封裝基板，上述之連接 墊之材質與凸起部之材質相同。此外，連接墊之材質例如 包括銅或鋁。 依照本發明較佳實施例所述之封裝基板，上述之連接 墊之材質與凸起部之材質不相同。此外，連接墊之材質例 如包括銅，且凸起部之材質例如包括紹。或者，連接塾之 材質例如包括鋁，且凸起部之材質例如包括銅。 依照本發明較佳實施例所述之封裝基板，上述之凸起 部例如包括一柱狀結構。此外，柱狀結構例如包括圓形柱 狀結構、橢圓形柱狀結構、多邊形柱狀結構或不規則形柱 狀結構。 在本發明較佳實施例所述之封裝基板中，封裝基板例 如更包括一銲罩層（solder mask layer)，其係配置於 這些銲球墊以外之基材表面上。 基於上述目的或其他目的，本發明提出一種球腳格狀 陣列封裝結構，其例如包括一封裝基板、一晶片與一封膠 體（molding compound )。封裝基板例如包括一基材、多 個銲球墊與多個銲球。其中，基材係具有一線路，而每一 銲球墊係配置於基材上，以與線路電性連接，而連接墊係 配置於基材上以與線路電性連接，而凸起部係配置於連接 塾上。此外，每一鲜球係配置於這些鮮球塾其中之一上。 另外，晶片係配置於基材之第一表面上，並電性連接至線12643twf.ptd Page 10 200536030 V. Description of the invention (4) The convex part is arranged on the connection pad. In addition, each solder ball is arranged on one of these solder ball pads. According to the package substrate according to the preferred embodiment of the present invention, the material of the above-mentioned connection pad is the same as that of the convex portion. In addition, the material of the connection pad includes, for example, copper or aluminum. According to the package substrate according to the preferred embodiment of the present invention, the material of the above-mentioned connection pads is different from that of the protrusions. In addition, the material of the connection pad includes, for example, copper, and the material of the convex portion includes, for example, Shao. Alternatively, the material of the connection ridge includes, for example, aluminum, and the material of the convex portion includes, for example, copper. According to the package substrate according to the preferred embodiment of the present invention, the above-mentioned convex portion includes, for example, a columnar structure. In addition, the columnar structure includes, for example, a circular columnar structure, an elliptical columnar structure, a polygonal columnar structure, or an irregular columnar structure. In the package substrate according to the preferred embodiment of the present invention, for example, the package substrate further includes a solder mask layer, which is disposed on the surface of the substrate other than the solder ball pads. Based on the foregoing or other objectives, the present invention proposes a ball-foot grid array packaging structure, which includes, for example, a packaging substrate, a wafer, and a molding compound. The package substrate includes, for example, a substrate, a plurality of solder ball pads, and a plurality of solder balls. Wherein, the substrate has a circuit, and each solder ball pad is disposed on the substrate to be electrically connected to the circuit, and the connection pad is disposed on the substrate to be electrically connected to the circuit, and the raised portion is Configured on the link. In addition, each fresh ball is arranged on one of these fresh balls. In addition, the chip is disposed on the first surface of the substrate and is electrically connected to the wire.
12643twf.ptd 第11頁 200536030 五、發明說明（5) 路。再者，封膠體係覆蓋於 ' ~ 依照本發明較佳實施^材與晶片上。 構，上述之連接墊之材質與，之球腳格狀陣列 接墊之材質例如包括鋼或鋁凸起部之材質相^結 依照本發明較佳實施例 此外，連 構，上述之連接墊之材質與，之球腳格狀陣列 連接墊之材質例如包括鋼，、起部之材質不相同。:μ 依照本發明較佳實施例 4之材質例如包 構’上述之凸起部例如包括〜斤述之球腳袼狀陣列 例如包括圓形柱狀結構、 杈狀結構。此 f結 構或不規則形桎狀結構。橢固形杈狀結構、多^狀結構 依照本發明較佳實施你 7挺狀結 構，其中封裝基板例如更包2述之球腳袼狀陣 銲球墊以外之基材表面上r括—銲罩層，其係配】二二：结 在本發明較佳實施例所 ^些 ί片=ί:車列封裳結構例：： i各=列封|結構 線路電性連接。 藉由這些凸塊與封裴基板於 (b〇nding wi re )，而晶片藉 ，鲜線 路電性連接。 曰曰片糟由4些鲜線與封裳基板之線 第12頁 12643tWf.ptd 200536030 五、發明說明（6) 基於上述，本發明 日 較於習知的技術，本於^ ^，墊結構具有凸起部，因此相 接觸面積，所以銲球‘杜球墊結構與銲球具有較大的 外，本發明之封裝基板^ ^二焊球之接合強度也增加。此 的技術，本發明之封步^ 鋅球墊結構，因此相較於習知 裝基板更具有較佳的機二反具有較佳的接合強度，而且封 球腳格狀陣列封裝結構操用:^ Ζ ί度。外，本發明之 本發明之球腳格狀陣列 ；;^凸出部之銲球墊結構，故 度。 狀皁歹j封裝結構能夠提供較佳的接合強 為讓本發明之上述和苴 易懂，下文特舉一較佳I ；_\ j、特徵和優點能更明顯 說明如下。 佳實％例’並配合所附圖式，作詳細 實施方式 請參照第2圖，其繪示# _ 士從αα + 墊钍構的立丨丨面+立冃 士依…本么明較佳實施例之銲球 墊、、口構的剖面不思圖。本發明提出一種 其適於配置在-基材2 0 0上，卩盘Α材‘2ηη ^墊、、、°構300 φ从4α 7也 卜 以興暴材2 0 〇中之一線路2 1 0 :ϊίί二二Λ球4 00 ’而料墊結構3 00例如包括 :ίίΛ 〇 。其中，連接墊310係配置於 與線 0電性連接，而凸起部32〇係配置於 連接墊3 1 0上。 明Μ續參照第2圖’基材2 〇 〇例如是印刷電路板、軟性 電路板或晶片。此外，上述之連接墊31〇之材質盥凸起部 3 2 0之材質相同，而連接墊310與凸起部32〇之材&例如皆 為銅或紹。或者，連接墊310之材質與凸起部32〇之材質不12643twf.ptd Page 11 200536030 V. Description of Invention (5) Road. Furthermore, the sealing system covers the substrate and the wafer according to the preferred embodiment of the present invention. Structure, the material of the above-mentioned connection pad is similar to the material of the ball-foot grid array connection pad, for example, the material including the steel or aluminum protrusions according to the preferred embodiment of the present invention. The material is different from the material of the ball-foot grid array connection pad, such as steel, and the material of the starting part. : μ The material according to the preferred embodiment 4 of the present invention is, for example, a package structure. The above-mentioned raised portions include, for example, ball-shaped cymbal arrays of, for example, circular pillar structures and branch structures. This f structure or irregularly shaped 桎 -like structure. The elliptical solid branch-like structure and the multi-shaped structure are preferably implemented in accordance with the present invention. The package substrate, for example, the package foot described in the ball-foot 袼 -shaped array solder ball pad described above, includes a solder mask. Layer, which is matched] 22: Some knots in the preferred embodiment of the present invention = ί: car train seal structure Example: i each = train seal | structural lines are electrically connected. With these bumps and the substrate, the chip is electrically connected to the fresh line. The film is made up of 4 lines of fresh wire and the board of the seal board. Page 1212643tWf.ptd 200536030 V. Description of the invention (6) Based on the above, the present invention is more advanced than the conventional technology. The pad structure has The raised portions therefore have a contact area, so that the solder ball 'du ball pad structure and the solder ball have a larger outer diameter, and the bonding strength of the packaging substrate of the present invention is also increased. With this technology, the sealing step of the present invention has a zinc ball pad structure, so it has better mechanical strength and better bonding strength than the conventional mounting substrate, and the ball-footed grid array package structure operates: ^ Ž Degree. In addition, the ball-foot grid array of the present invention; ^ projection of the solder ball pad structure, so. In order to make the above-mentioned sum of the present invention easy to understand, a better I is given below; the features and advantages can be more clearly explained as follows. For example, please refer to Figure 2 for detailed implementation. Please refer to Figure 2. # 士 从 αα + 立 从 立 丨 丨 面 + 立 冃 士 依… Ben Moming is better The cross section of the solder ball pad and the mouth structure of the embodiment is not shown. The present invention proposes a circuit board 2 which is suitable for disposing on a substrate 2 0, a pan plate A material '2ηη ^ pad, 、, 300 φ from 4α7, and also one of the violent materials 2 0 〇 line 2 1 0: ϊίί 2 Λ ball 4 00 'and the material pad structure 3 00 includes, for example: ίίΛ 〇. Among them, the connection pad 310 is arranged to be electrically connected to the line 0, and the protruding portion 320 is arranged on the connection pad 310. Next, referring to FIG. 2, the substrate 200 is, for example, a printed circuit board, a flexible circuit board, or a wafer. In addition, the material of the above-mentioned connection pads 31 and the raised portions 320 are the same, and the materials of the connection pad 310 and the projections 32 are both copper or copper, for example. Alternatively, the material of the connection pad 310 and the material of the protrusion 32 are not the same.
12643twf.ptd12643twf.ptd
200536030 五、發明說明（7) 相同，而連接墊2 1 〇之鉍皙也丨Λ ^ 例如為銘，或者連接塾L貝0 = ^彳銅J f凸起部2 2 0之材質 之材質例如為銅。當^ °在之本材實 起部32〇之材質亦可視需长在而本/楼\例/、/連接塾310與& 优而求而選擇其他導電材料。 承上所述，凸起部32 〇例如包一 柱狀結構例如包括圓形柱肤牡 4狀…構。此外’ 形柱狀結構或不規則形柱狀=、圓形柱狀結構、多邊 例銲球墊結構3 0 0為一立體Κ ::1/所示），本實施 構3〇〇具有較大的接合=、:Ϊ外戶斤：1【球4°〇與銲球塾結 塾結構3 0 0只具有一凸：U夕卜？發明並不限定銲球 有夕個型態相同或型態不相同的凸ϋ戈 4〇〇與銲球墊結構3〇〇的接人 丄以〜加知球 墊結構3 0 0之接合強度口積而知广久球40 0與銲球 封裝基板詳述如後。再者將具有此銲球墊結構3 00之 Α板ί ί照第3立圖’其繪示依照本發明較佳實施例之封f ίϊΓΙ:上圖。/發明提出-種封裝基板_ 罩層540 Λ巾，^^H52 0、多個銲球53 0與-銲 可以是鋼或…〜卜材二二二51^材質例 線路512電性連接，i 5 2〇係配置於基材51〇上以與 與一凸起銲球墊52。具有一連接墊M2 512電性連Γ且：ίί=配置於基材510上以與線路 地，可以複數個銲玫53〇八κι、配置於連接墊5 2 2上。較佳 複數個鲜球5 3 0分別配置於銲球墊52〇上，以作為200536030 V. The description of the invention (7) is the same, and the bismuth of the connection pad 2 1 〇 is also ^ ^ For example, it is a name, or the material of the connection 塾 L 贝 0 = ^ 彳 铜 J fprojection 2 2 0 For copper. When ^ ° is in this material, the material of the starting part 32 can also be selected as long as possible. This / building \ example /, / connection 塾 310 and & excellent and select other conductive materials. As mentioned above, the raised portion 32 may include, for example, a columnar structure, such as a circular columnar structure. In addition, the shape of a columnar structure or an irregular columnar structure =, a circular columnar structure, and a polygonal example solder ball pad structure (3 0 0 is shown as a three-dimensional κ :: 1 /)), this embodiment 300 has a larger The joint = ,: Ϊ outside household weight: 1 [ball 4 ° 〇 and solder ball 塾 knot structure 3 0 0 has only a convex: U Xibu? The invention does not limit the solder ball to have the same shape or different shape of the convex bump 400 and the solder ball pad structure 300. The connection strength of the ball pad structure 300 is known. It is well known that the Guangjiu ball 40 0 and the solder ball package substrate are detailed later. Furthermore, a plate A with this solder ball pad structure 3 00 is shown in a third elevation ′, which shows a seal f ϊϊΓΙ according to a preferred embodiment of the present invention: upper picture. / Invention-Kind of package substrate _ cover layer 540 Λ, ^^ H52 0, multiple solder balls 53 0 and-solder can be steel or ... ~ Bu 2222 51 ^ material example line 512 electrical connection, i 5 2 0 is disposed on the substrate 51 0 to communicate with a raised solder ball pad 52. A connection pad M2 512 is electrically connected to: and is placed on the substrate 510 to be connected to the circuit ground. A plurality of solder joints 5208 can be arranged on the connection pad 5 2 2. Preferably, a plurality of fresh balls 5 3 0 are respectively arranged on the solder ball pad 52 0 as
200536030 五、發明說明（8) 後續製程中之對外電性連結之用，此外，亦一 44 0配置於這些銲球墊5 2 0以外之基材51〇表面上，以避皁曰 助銲劑（soldering flux )殘留於基材51〇 保護基材7 1 0，較佳地，其例如是以環氧樹脂 r e s 1 η )系列之材質為主。當然本實施例並不限豆 銲罩層5 4 0與銲球5 3 0，亦即銲罩層54〇與為選 性構件。㈣’將此封裝基板5 0 0之製造流程、30係如為'擇 請再參照第3圖，首先，提供一芙好^ 在豆古娩玫wo ^ I 基材51〇，而基材510 係具有一線路5 12，而連接墊5 2 2係配置於 與線路512電性連接。之後，將一金屬 材f 箔或其他導電材料。隨後，對 j j =如銅續、鋁 程’以在連接墊5 22上形成凸起部524，而 j 2 5 2 0。然後’將助銲劑（未泠 衣作出如球墊 將銲球5 3 0置於銲球墊52〇上丫最”‘球墊5 2 0上，並 5 3 0迴銲於銲球墊52〇上， 實=由迴銲製程將銲球 的製作。 而70成本實施例之封裝基板500 本發明之目的。此外材5=f f線路層512亦能夠達成 球墊520並不一定需要斑、其〇 衣者當知，本實施例之銲 炎如、扣丄 疋而要與基材510之線路512電性遠技，m 為部分銲球52 0乃是做為分 ，因 裝結構UGA)，其詳\亦可用於球腳格狀陣列封200536030 V. Description of the invention (8) For external electrical connection in subsequent processes. In addition, 440 is arranged on the surface of the substrate 51 except for the solder ball pads 5 2 0 to avoid soap flux ( soldering flux) remains on the substrate 51 and protects the substrate 7 1 0. Preferably, it is made of, for example, an epoxy resin res 1 η) series material. Of course, this embodiment is not limited to the solder mask layer 5 4 0 and the solder ball 5 3 0, that is, the solder mask layer 54 0 and are optional components. ㈣ 'If the manufacturing process of this package substrate 5 0 0, 30 is selected, please refer to Figure 3, first of all, provide a good ^ ^ I Dou Wo ^ I substrate 51, and substrate 510 The system has a line 5 12, and the connection pad 5 2 2 is configured to be electrically connected to the line 512. After that, a metal material f foil or other conductive material is used. Subsequently, for j j = such as copper, aluminum, to form bumps 524 on the connection pads 5 22, and j 2 5 2 0. Then 'put the soldering flux (undressed, such as a ball pad, place the solder ball 5 3 0 on the solder ball pad 52 °), and then re-solder to the solder ball pad 52 5 ′. In the above, the actual = the production of solder balls by the re-soldering process. And 70 is the purpose of the package substrate 500 of the embodiment of the present invention. In addition, the material 5 = the ff circuit layer 512 can also achieve the ball pad 520, which does not necessarily require spots, which The wearer should know that the welding flammability of this embodiment is to be electrically remote from the circuit 512 of the substrate 510, and m is a part of the solder ball 520, which is used as a point because of the structure UGA). Details \ Can also be used for ball foot grid array seal
200536030 五、發明說明（9) 圖4繪示依照本發明第一較佳實施例之球腳格狀陣列 封裝結構。若是圖4的標號與圖3相同者，其係表示在圖4 中所指明的構件係雷同於在圖3所指明的構件，在此不再 贅述。 請參照圖4，球腳格狀陣列封裝結構6 〇 〇例如包括一封 裝基板500、一晶片610、一封膠體620 (molding compound)與多個凸塊630。其中，封裝基板5〇〇之基材 510包括一第一表面510a與平行第一表面5i〇a之一第二表 面5 1 0 b。此外，晶片6 1 0係配置於基材5 1 〇之第一表面5 1 〇 b 上’並電性連接至線路5 1 2。另外，封膠體5 2 〇係覆蓋於基 材5 1 0與晶片6 1 0上。值得注意的是，晶片6 J 〇藉由凸塊6 3 〇 與封裝基板5 0 0之線路5 12電性連接，而這種電性連接方式 就是覆晶接合技術（F 1 i p Ch i p )。再者，本發明之球腳 格狀陣列封裝結構6 0 〇並不限定使用覆晶接合技術，亦可 應用於打線接合技術（W i r e Β ο n d i n g )，其詳述如後。 圖5纟會示依照本發明第二較佳實施例之球腳格狀陣列 封裝結構。若是圖5的標號與圖4相同者，其係表示在圖5 中所指明的構件係雷同於在圖4所指明的構件，在此不再 贅述。 請參照圖5 ’第二較佳實施例與第一較佳實施例相 似，其不同之處在於：第二較佳實施例採用銲線接合技 術，而球腳格狀陣列封裝結構6 0 0更包括多個銲線64〇，而 晶片610藉由銲線64 0與封裝基板5 0 0之線路512電性連接， 以形成使用打線接合技術之球腳格狀陣列封裝结構6 〇 Q。200536030 V. Description of the invention (9) FIG. 4 shows a ball-foot grid array packaging structure according to the first preferred embodiment of the present invention. If the reference numerals in FIG. 4 are the same as those in FIG. 3, it means that the components specified in FIG. 4 are the same as those specified in FIG. 3, and will not be repeated here. Referring to FIG. 4, the ball-foot grid array packaging structure 600 includes, for example, a mounting substrate 500, a wafer 610, a molding compound 620 and a plurality of bumps 630. The substrate 510 of the package substrate 500 includes a first surface 510a and a second surface 5 1 0 b which is one of the parallel first surfaces 5ia. In addition, the wafer 6 10 is disposed on the first surface 5 1 0 b of the substrate 5 10 and is electrically connected to the line 5 1 2. In addition, the sealing compound 5 2 0 is coated on the substrate 5 10 and the wafer 6 10. It is worth noting that the chip 6 J 〇 is electrically connected to the circuit 5 12 of the package substrate 500 through the bump 6 3 〇, and this electrical connection method is a flip-chip bonding technology (F 1 i p Ch i p). In addition, the ball-foot grid array packaging structure 600 of the present invention is not limited to the use of flip-chip bonding technology, and can also be applied to wire bonding technology (W i r e β ο n d i n g), which will be described in detail later. FIG. 5A shows a ball-foot grid array package structure according to a second preferred embodiment of the present invention. If the reference numerals in FIG. 5 are the same as those in FIG. 4, it means that the components specified in FIG. 5 are the same as those specified in FIG. 4, and will not be repeated here. Please refer to FIG. 5 ′ The second preferred embodiment is similar to the first preferred embodiment, except that the second preferred embodiment uses wire bonding technology, and the ball-foot grid array packaging structure 6 0 0 more It includes a plurality of bonding wires 640, and the chip 610 is electrically connected to the wiring 512 of the packaging substrate 500 through the bonding wires 640 to form a ball-foot grid array packaging structure 6Q using wire bonding technology.
12643twf.ptd 第 16 頁 200536030 五、發明說明（ίο) '" -- 由圖4與圖5可知’本發明之球腳格狀陣列封裝結構6 〇 〇採 用具有凸出部5 2 4之銲球墊5 2 〇，所以本發明之球腳格狀陣 列f裝結構6 0 0能夠提供較佳的結合強度，進而提高接合 可Ϊ度。ί外’本發明之球腳格狀陣列封裝結構6 0 〇並不 限^使用單一覆晶結合技術或打線接合技術，亦可同時使 用這兩種技術，。而且本發明之球腳格狀陣列封裝結構6 〇 〇 亦不限定使用單一晶片6 1 0，亦可採用多個晶片的方式。 綜上所述’本發明之球腳格狀陣列封裝結構、銲球墊 結構與其封裝基板具有下列優點： 一、本發明之銲球墊結構具有突出部，所以銲球盘銲 球墊之接合面積較習知技術之結合面積大，故本發明^ 球墊結構能夠提供較高的接合強度。此外，由於銲球與 球墊的接合強度較高，故相對於習知的技術，本發明^ 球墊結構與銲球具有較佳的可靠度。 、干 一在本發明之封裝基板中，由於銲球墊結構能夠接 可靠产。 、土板八有良好的機械性質與 三、=較於習知技術，本發明之球腳格狀陣 構扭用具有凸出部之銲球墊，故^ ^ ί裝、、 裳結構能夠提供較高的接合可靠度。 '4狀陣列封 雖然本發明已以較佳實施例$ 限定本發明，任何熟習此技藝者，二 並非用以 和範圍内，當可作些許之更動與發明之精神 範圍當視後附之申請專利範圍心^者為準本發明之保護12643twf.ptd Page 16 200536030 V. Description of the invention ("-From Figs. 4 and 5 it can be seen that the ball-foot grid array packaging structure 6 of the present invention 6 〇 〇 uses a solder with a protruding portion 5 2 4 The ball pad 5 2 0, so the ball foot grid array f mounting structure 6 0 0 of the present invention can provide better bonding strength, thereby improving the jointability. In addition, the ball-foot grid array packaging structure 600 of the present invention is not limited to using a single flip-chip bonding technology or wire bonding technology, and these two technologies can be used simultaneously. In addition, the ball-foot grid array packaging structure 600 of the present invention is not limited to the use of a single chip 610, and a plurality of chips may also be used. In summary, the ball-foot grid array packaging structure, solder ball pad structure, and its packaging substrate of the present invention have the following advantages: 1. The solder ball pad structure of the present invention has protrusions, so the bonding area of the solder ball pad solder ball pad Compared with the conventional technology, the bonding area is larger, so the ball pad structure of the present invention can provide higher joint strength. In addition, since the bonding strength between the solder ball and the ball pad is high, compared with the conventional technology, the ball pad structure and the solder ball of the present invention have better reliability. In the package substrate of the present invention, the solder ball pad structure can be reliably connected. The soil plate eight has good mechanical properties and three. = Compared with the conventional technology, the ball foot grid array of the present invention uses a solder ball pad with a protruding portion, so ^ ^ can be provided High joint reliability. '4-shaped array seal Although the present invention has been limited to the present invention by a preferred embodiment, anyone skilled in this art is not intended to use it within the scope, and can make some changes and the scope of the spirit of the invention as an attached application The scope of patent is subject to the protection of the present invention
200536030 圖式簡單說明 第1圖繪示習知的封裝基板之單一銲球的剖面圖。 第2圖繪示依照本發明較佳實施例之銲球墊結構的剖 面示意圖。 第3圖繪示依照本發明較佳實施例之封裝基板的剖面 示意圖。 圖4繪示依照本發明第一較佳實施例之球腳格狀陣列 封裝結構。 圖5繪示依照本發明第二較佳實施例之球腳格狀陣列 封裝結構。 【圖式標示說明】 1 0 0 :習知的封裝基板 1 1 0、2 0 0、5 1 0 :基材 1 1 2、2 1 0、5 1 2 :線路 1 2 0、5 2 0 :銲球墊 3 0 0 :銲球墊結構 3 1 0、5 2 2 :連接墊 320、524 :凸起部 130、4 0 0 > 5 3 0 ··銲球 5 0 0 :封裝基板 510a :第一表面 510b :第二表面 5 4 0 :鲜罩層 6 0 0 :球腳格狀陣列封裝結構 610 :晶片200536030 Brief Description of Drawings Figure 1 shows a cross-sectional view of a single solder ball of a conventional package substrate. FIG. 2 is a schematic cross-sectional view of a solder ball pad structure according to a preferred embodiment of the present invention. FIG. 3 is a schematic cross-sectional view of a package substrate according to a preferred embodiment of the present invention. FIG. 4 illustrates a ball-foot grid array package structure according to a first preferred embodiment of the present invention. FIG. 5 illustrates a ball-foot grid array package structure according to a second preferred embodiment of the present invention. [Illustration of Graphical Symbols] 1 0 0: conventional package substrate 1 1 0, 2 0 0, 5 1 0: base material 1 1 2, 2 1 0, 5 1 2: circuit 1 2 0, 5 2 0: Solder ball pad 3 0 0: Solder ball pad structure 3 1 0, 5 2 2: Connection pad 320, 524: Raised portion 130, 4 0 0 > 5 3 0 · Solder ball 5 0 0: Package substrate 510a: First surface 510b: Second surface 5 4 0: Fresh cover layer 6 0 0: Ball-foot grid array packaging structure 610: Wafer
12643twf.ptd 第18頁 200536030 圖式簡單說明 6 2 0 :封膠體 6 3 0 ··凸塊 640 :銲線12643twf.ptd Page 18 200536030 Simple illustration of the drawing 6 2 0: Sealing body 6 3 0 ·· Bump 640: Welding wire
Hi· 12643twf.ptd 第19頁Hi12643twf.ptd Page 19
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93111709A TWI240340B (en) | 2004-04-27 | 2004-04-27 | Ball grid array package structure, package substrate and solder-ball pad structure thereon |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93111709A TWI240340B (en) | 2004-04-27 | 2004-04-27 | Ball grid array package structure, package substrate and solder-ball pad structure thereon |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI240340B TWI240340B (en) | 2005-09-21 |
| TW200536030A true TW200536030A (en) | 2005-11-01 |
Family
ID=37007726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW93111709A TWI240340B (en) | 2004-04-27 | 2004-04-27 | Ball grid array package structure, package substrate and solder-ball pad structure thereon |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI240340B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI567891B (en) * | 2015-01-30 | 2017-01-21 | 矽品精密工業股份有限公司 | Whole layout structure of package substrate |
| US9984987B2 (en) | 2016-08-05 | 2018-05-29 | Nanya Technology Corporation | Semiconductor structure and manufacturing method thereof |
-
2004
- 2004-04-27 TW TW93111709A patent/TWI240340B/en not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI567891B (en) * | 2015-01-30 | 2017-01-21 | 矽品精密工業股份有限公司 | Whole layout structure of package substrate |
| US9984987B2 (en) | 2016-08-05 | 2018-05-29 | Nanya Technology Corporation | Semiconductor structure and manufacturing method thereof |
| US10141275B2 (en) | 2016-08-05 | 2018-11-27 | Nanya Technology Corporation | Method for manufacturing a semiconductor structure |
| TWI644405B (en) * | 2016-08-05 | 2018-12-11 | Nanya Technology Corporation | Semiconductor structure and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI240340B (en) | 2005-09-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7442878B2 (en) | Low stress conductive polymer bump | |
| US7619305B2 (en) | Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking | |
| US7915718B2 (en) | Apparatus for flip-chip packaging providing testing capability | |
| TW479333B (en) | Semiconductor package | |
| US7662672B2 (en) | Manufacturing process of leadframe-based BGA packages | |
| TWI253697B (en) | Method for fabricating a flip chip package | |
| TWI272705B (en) | Heat spreader and package structure utilizing the same | |
| TWI329354B (en) | Multi-die semiconductor package | |
| TWI311352B (en) | Fabricating process of leadframe-based bga packages and leadless leadframe utilized in the process | |
| JP2015523743A (en) | BVA interposer | |
| JP2008166439A (en) | Semiconductor device and manufacturing method thereof | |
| TW201342557A (en) | Packages, methods of packaging a device and package on package devices | |
| TWI446508B (en) | Coreless package substrate and method of making same | |
| US20200343163A1 (en) | Semiconductor device with through-mold via | |
| US6781221B2 (en) | Packaging substrate for electronic elements and electronic device having packaged structure | |
| JP2003037135A (en) | Wiring substrate and method of manufacturing the same | |
| JP2003203941A (en) | Mounting body for semiconductor device and wiring base board | |
| TWI311806B (en) | Cob type ic package for improving bonding of bumps embedded in substrate and method for fabricating the same | |
| TWI278079B (en) | Pillar grid array package | |
| TWI251911B (en) | Test vehicle ball grid array package | |
| TW200536030A (en) | Ball grid array package structure, package substrate and solder-ball pad structure thereon | |
| US8698288B1 (en) | Flexible substrate with crimping interconnection | |
| US20090108447A1 (en) | Semiconductor device having a fine pitch bondpad | |
| US20090085207A1 (en) | Ball grid array substrate package and solder pad | |
| JP2003224228A (en) | Package for semiconductor device, semiconductor device and its producing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |