TW200535708A - IC tag with anti-replacement function - Google Patents
IC tag with anti-replacement function Download PDFInfo
- Publication number
- TW200535708A TW200535708A TW94113298A TW94113298A TW200535708A TW 200535708 A TW200535708 A TW 200535708A TW 94113298 A TW94113298 A TW 94113298A TW 94113298 A TW94113298 A TW 94113298A TW 200535708 A TW200535708 A TW 200535708A
- Authority
- TW
- Taiwan
- Prior art keywords
- switch
- tag
- function
- patent application
- scope
- Prior art date
Links
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
200535708 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種1C標籤,用以在不碰觸該1C標籤 的情況下鑑別出一選定物件,特別係關於一種附加有可防 止不正當更換1C標籤功能之1C標籤,用以防止該1C標籤 為一假標籤所替換。200535708 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a 1C tag, which is used to identify a selected object without touching the 1C tag, and particularly relates to an addition that can prevent improper replacement. The 1C tag of the 1C tag function is used to prevent the 1C tag from being replaced by a fake tag.
【先前技術】 以非接觸方式進行辨識的1C標籤,其資料係於製造過 程中即寫入ROM中,因無法重新改寫資料而可保證該1C 標籤具有極高的真實性。 更由於這類1C標籤可附著於各式各樣的物品上,因此 可廣泛的利用於紙幣等的有價證券的防偽,確實進行出入 管理的個人認證,製造、流通、販賣等過程中物品的管理 等的領域。 但可簡單的附著於各式各樣物品上之1C標籤亦可簡 單的重新附著於另一物品上。 再者,亦可簡單的撕下表面標籤再重新附上其他標籤。 因此,例如於管理物品等情況下,昂貴商品的IC標籤 有遭到以便宜商品的1C標籤替換,或從實際商品上撕下 I c標籤將其貼附於仿冒商品上等的不正當行為的危險性。 為解決此問題,特開2000 — 1 5 1 459號公報中揭示了如 從物品上取下1C標籤,1C與天線的連接部分即被破壞, 3[Prior technology] The information of a 1C tag that is identified in a non-contact manner is written into ROM during the manufacturing process. Because the data cannot be rewritten, the 1C tag can be guaranteed to have a high degree of authenticity. In addition, this type of 1C label can be attached to a variety of articles, so it can be widely used in the security of valuable securities such as banknotes, and it can be used for personal authentication of entry and exit management, and the management of items during manufacturing, distribution, and sales. And other fields. However, the 1C label that can be simply attached to various items can also be simply reattached to another item. Furthermore, you can simply remove the surface label and reattach other labels. Therefore, for example, in the case of managing articles, the IC label of an expensive product has been replaced with a 1C label of a cheap product, or the IC label has been removed from an actual product and attached to a counterfeit product. Dangerous. To solve this problem, JP 2000-1 15 1 459 discloses that if the 1C tag is removed from an object, the connection part between the 1C and the antenna is destroyed, 3
200535708 以防止更換IC標籤之發明。 但由於此方法將 IC與天線分離,而無法讀取撕下 1C標籤中的資料。 因此,不僅無法判讀習用之IC標籤中記錄的資料, 以1C標籤追溯履歷資料時,將無法追查其履歷資料,而 法得知不正當行為係於何時發生。 另外,僅以目視難以確認更換的情況,如不使用讀 器/寫入器讀取辨識資料亦無法檢知不正當行為。 專利文獻特開2000 — 1 5 1 45 9號公報 【發明内容】 因此,本發明係提供一種具有防止更換機能之1C 籤,以解決習用方法中,因1C與天線分離造成的無法讀 I C標籤,以及難以用目視確認不正當行為等的問題點。 施本發明,即可讀取撕下之IC標籤,更可用目視即容易 確認不正當行為。 為達成上述目的,本發明具有防止更換機能之IC標 包含一開關、一輸入裝置以及一送信裝置。當施加預定 上的外力於IC的資料輸入電路時,開關即被破損,進而 斷電路。輸入裝置用以輸入開關的狀態。送信裝置係將 入之開關的狀態附加於反應信號並且傳送信號。 【實施方式】 的 如 無 取 標 取 實 的 籤 以 切 Ψμ 4 200535708 以下參考圖式詳細的說明本發明。 第1圖與第2圖所示係本發明之一實施例,具有防止 更換機能之1C標籤的平面圖與剖面圖。 圖式中係例舉以使用150kHz以下,或者13·56ΜΗζ的 頻域為主之電磁感應方式的1C標籤。200535708 The invention to prevent the replacement of IC tags. However, because this method separates the IC from the antenna, it is impossible to read the data from the 1C tag. Therefore, it is not only impossible to read the information recorded in the IC tags used in practice, but when you trace the resume data with the 1C tag, you will not be able to trace the resume data, and you will know when the wrongdoing occurred. In addition, it is difficult to confirm the replacement only by visual inspection. If the identification data is not read by a reader / writer, it is impossible to detect improper behavior. Patent Document Laid-Open No. 2000 — 1 5 1 45 9 [Summary of the Invention] Therefore, the present invention provides a 1C tag with a function of preventing replacement, in order to solve the unreadable IC tag caused by the separation of the 1C from the antenna in the conventional method. And it is difficult to visually confirm problems such as wrongdoing. By applying the present invention, it is possible to read the IC tag that has been torn off, and it is easy to visually confirm the improper behavior. In order to achieve the above-mentioned object, the present invention has an IC label for preventing the replacement function, which includes a switch, an input device, and a transmission device. When a predetermined external force is applied to the data input circuit of the IC, the switch is broken and the circuit is broken. The input device is used to input the state of the switch. The transmitting device adds the state of the input switch to the response signal and transmits the signal. [Embodiment] If there is no bidding, a real signature will be cut. Μ 4 200535708 The following describes the present invention in detail with reference to the drawings. 1 and 2 show a plan view and a cross-sectional view of a 1C tag having a function of preventing replacement in accordance with an embodiment of the present invention. In the figure, the 1C tag with an electromagnetic induction method mainly using a frequency domain below 150 kHz or 13.56 MHz is exemplified.
具有防止更換機能之1C標籤係呈貼紙狀,於PET膜 等的基板4上,將天線線圈2及破損開關3與1C晶片1 接合,形成内裏5。 當施加預定以上的外力於破損開關3時,破損開關3 即破損,切斷電路。 内裏5的基板4的周緣與破損開關3上塗佈粘著劑 a ,再於其上被覆表面標籤6,内裏5的下面塗佈粘著劑 a ,再於其下貼附施有矽剝離處理之剝離紙,形成IC標 籤。 將此IC標籤從剝離紙7上撕下,貼附於物品等處。 第3圖與第4圖所示係破損開關的擴大平面圖與剖面 圖。 破損開關3係利用厚膜印刷技術,於基板4上形成膜 3 1,再於其上被覆脆弱材料所成之墊片3 2,形成袋狀的儲 液層3 3,於儲液層3 3中裝入導電性墨水b。 電極3 4係位於儲液層3 3的二端,藉由導線3 5與1C 晶片1連接。 基板4上預先切割例如記號X等的形狀之呈虛線狀易 5 200535708 撕的切縫線C。 依此,撕下1C標籤時,基板4受到拉扯,造成切縫線 c的切縫寬度擴大,使與基板4 一體的破損開關3確實的 破損。 此切縫線c不論從縱橫任何方向拉扯,皆會擴大切缝 的寬度。The 1C tag having the function of preventing replacement is in the form of a sticker. On a substrate 4 such as a PET film, the antenna coil 2 and the damage switch 3 are bonded to the 1C chip 1 to form an inner liner 5. When a predetermined amount of external force is applied to the broken switch 3, the broken switch 3 is broken and the circuit is cut off. Adhesive a is applied to the periphery of the substrate 4 on the inner side 5 and the broken switch 3, and then a surface label 6 is coated thereon. Adhesive a is applied to the lower side of the inner side 5, and a silicon peeling treatment is applied to the lower side. Release the paper to form an IC tag. This IC tag is peeled from the release paper 7 and attached to an article or the like. 3 and 4 are enlarged plan and sectional views of the broken switch. The damage switch 3 uses a thick film printing technology to form a film 31 on the substrate 4 and then cover it with a gasket 3 2 made of a fragile material to form a bag-shaped liquid storage layer 3 3 and a liquid storage layer 3 3 A conductive ink b is loaded. The electrodes 3 4 are located at two ends of the liquid storage layer 3 3, and are connected to the 1C chip 1 through the wires 35. The substrate 4 is cut in advance in a shape such as a mark X and has a broken line shape. Accordingly, when the 1C label is peeled off, the substrate 4 is pulled, causing the slit width of the slit line c to be enlarged, and the damage switch 3 integrated with the substrate 4 is surely damaged. This slit line c will widen the slit regardless of whether it is pulled from any direction.
基板4表面的破損開關3周圍或基板4的表面全體 上,施有網點等的表面加工,使其容易吸收墨水b。 除了表面加工之外,基板4表面上亦可塗佈吸收墨水 b的塗料,或黏貼吸收墨水b的紙、布等的膠帶。 依此,破損時雖然僅漏出微量的墨水 b,但廣大的擴 散附著於周圍的基板4上,即可容易的目視確認破損開關 3已破損。 如第5圖所示,破損開關3亦可於儲液層3 3的二端以 易於切斷的導電性細導線d連接,使其通電。 或者,亦可以鋁等的金屬箔形成膜3 1或墊片3 2,使 其通電。 此時,儲液層3 3中亦可裝入含有可目視的通常染料之 墨水b。 第6圖所示係本發明之1C標籤的方塊圖。 1C標籤中,天線線圈2連接於1C晶片1的天線連接 部,破損開關3連接於1C晶片1的資料輸入部。 IC晶片1包含連接於天線線圈2之整流電路1 1、解調 6 200535708 電路1 2、調變電路1 3及時序電路1 4所成類比電路,以及 C P U 1 5與記憶體1 6所成之數位電路。 IC標籤係上述之構成,以讀取器/寫入器8將辨識資 料的讀取信號調變,施加電壓於天線線圈 9,產生感應電 磁,標籤方面的天線線圈2則產生感應電壓。 感應電壓經由整流電路1 1的整流成為動作電源,時序 電路1 4係利用其周波數產生1C同步用的時序。The surface of the substrate 4 is damaged around the switch 3 or the entire surface of the substrate 4 is subjected to surface processing such as dots to make it easy to absorb the ink b. In addition to surface processing, the surface of the substrate 4 may be coated with a coating material that absorbs ink b, or a tape such as paper or cloth that absorbs ink b. According to this, although only a small amount of ink b leaks out at the time of damage, a large amount of diffusion is adhered to the surrounding substrate 4 and it is easy to visually confirm that the damage switch 3 is broken. As shown in Fig. 5, the damage switch 3 may be connected to both ends of the liquid-storage layer 33 by a conductive thin conductive wire d which is easy to cut off, and energize it. Alternatively, a metal foil such as aluminum may be used to form the film 31 or the spacer 32, and apply electricity thereto. In this case, the liquid storage layer 33 may be filled with an ink b containing a normal dye which can be visually recognized. Figure 6 is a block diagram of the 1C tag of the present invention. In the 1C tag, the antenna coil 2 is connected to the antenna connection portion of the 1C chip 1, and the break switch 3 is connected to the data input portion of the 1C chip 1. The IC chip 1 includes an rectifier circuit 1 connected to the antenna coil 2 and a demodulation circuit. 200535708 Circuit 1 2, a modulation circuit 13 and a sequence circuit 14 are analog circuits, and the CPU 15 and the memory 16 are analog circuits. Digital circuit. The IC tag has the above-mentioned structure. The reader / writer 8 modulates the read signal of the identification data, applies a voltage to the antenna coil 9 to generate induced magnetism, and the antenna coil 2 of the tag generates an induced voltage. The induced voltage is rectified by the rectifier circuit 11 to become an operating power source. The sequence circuit 1 4 generates a sequence for 1C synchronization by using its cycle number.
依此,供給電力與時序至IC電路,則解調電路12將 使其與時序同步,並將接收自讀取器/寫入器8的讀取信號 解調,此讀取信號經由CPU 1 5解析,從記憶體1 6讀取辨 識資料,讀取之辨識資料經由調變電路1 3調變,經由天線 線圈2送信。 此時,CPU 1 5進行破損開關3的輸入處理,將輸入之 開關狀態附加於辨識資料中傳送至讀取器/寫入器 8,亦 即,對於CPU 1 5與破損開關3之間的10埠(未圖示)實 行輸入指令,讀取此時的破損開關3的狀態,將其附加於 辨識資料中,傳送至讀取器/寫入器8。 本發明之1C標籤係上述之構成,將1C標籤更換貼附 於其他物品等情況,撕下内裏5時,薄膜狀的基板4受到 拉扯,造成基板上之切缝線c的切缝擴大。 如第7圖所示,依此,沿著任一切缝線c的拉扯力, 亦即外力的作用下,破損開關3即會破損。 此時,裝入其中的墨水b漏出,廣大的擴散,附著於 7 200535708 破損開關3周圍的基板4表面。 因此,以讀取器/寫入器8讀取辨識資料之前即可用目 視檢知1C標籤被撕下。 而其中的導電性墨水b漏出時,破損開關3即成為斷 路的狀態。 因此,讀取辨識資料時附加之開關的狀態,藉由讀取 器/寫入器8的識別,亦可檢知内裏5被撕下。According to this, when power and timing are supplied to the IC circuit, the demodulation circuit 12 will synchronize it with the timing, and demodulate the read signal received from the reader / writer 8, and this read signal passes through the CPU 1 5 Analyze and read the identification data from the memory 16. The read identification data is modulated by the modulation circuit 13 and sent by the antenna coil 2. At this time, the CPU 15 performs input processing of the broken switch 3, and adds the input switch state to the identification data and transmits it to the reader / writer 8. That is, for the 10 between the CPU 15 and the broken switch 3, A port (not shown) executes an input command, reads the state of the broken switch 3 at this time, attaches it to the identification data, and transmits it to the reader / writer 8. The 1C tag of the present invention has the above-mentioned structure. When the 1C tag is replaced and attached to other articles, etc., when the inner liner 5 is torn off, the film-like substrate 4 is pulled, causing the slit of the slit c on the substrate to expand. As shown in FIG. 7, according to this, the pulling force along any of the sutures c, that is, the external force, breaks the damage switch 3. At this time, the ink b contained therein leaked out and spread widely, and adhered to the surface of the substrate 4 around the damaged switch 3. Therefore, it is possible to visually detect that the 1C tag has been removed before reading the identification data with the reader / writer 8. On the other hand, when the conductive ink b leaks out, the broken switch 3 is in an open state. Therefore, the state of the switch attached when the identification data is read can also be detected by the reader / writer 8 as being torn off.
如第8圖所示,破損開關3由儲液層3 3二端以細導線 d連接所構成時,撕下1C標籤時,破損開關3即破損,裝 入其中的墨水b漏出而附著於破損開關3周圍的基板4表 面。 而破損開關3破損的同時,細導線d被切斷,相同的, 破損開關亦成為斷路。 另外,如將1C標籤的表面標籤6更換為其他的表面標 籤時,因破損開關3的底面係固著於基板4上,而其上面 係粘著於表面標籤6,當撕下表面標籤6時,破損開關3 因受到向上的拉扯而破損。 因此,與撕下内裏5時相同的,破損開關3成為斷路, 而墨水b亦附著於破損開關3周圍的基板4表面。 由上述實施例可知,應用本發明具有下列優點:藉由 附加於IC之施加預定以上的外力即破損成為斷路的開關 檢知更換的狀況,在不損及1C標籤本來的機能亦可檢知更 換的狀況,因此,亦可讀取撕下之1C標籤。 8 200535708 而開關破損時,其中的墨水即漏出,附著於開關的周 圍,因此,以目視即可確認IC標籤的更換。 【圖式簡單說明】 第1圖係本發明之IC標籤的平面圖; 第2圖係第1圖的剖面圖; 第3圖係破損開關的平面圖;As shown in FIG. 8, when the damage switch 3 is composed of the liquid storage layer 3 3 and the two ends are connected by a thin wire d, when the 1C label is removed, the damage switch 3 is broken, and the ink b contained therein leaks out and attaches to the damage. The surface of the substrate 4 around the switch 3. When the damage switch 3 is broken, the thin wire d is cut. Similarly, the damage switch is also disconnected. In addition, if the surface label 6 of the 1C label is replaced with another surface label, the bottom surface of the switch 3 is fixed to the substrate 4 due to damage, and the top surface of the switch 3 is adhered to the surface label 6. When the surface label 6 is removed The broken switch 3 is broken due to being pulled upward. Therefore, in the same manner as when the inner liner 5 is torn off, the damage switch 3 is opened, and the ink b is also adhered to the surface of the substrate 4 around the damage switch 3. As can be seen from the above embodiments, the application of the present invention has the following advantages: By applying an external force of more than a predetermined value to the IC, the switch that is broken and becomes open can detect and replace the condition, and the original function of the 1C label can be detected and replaced Therefore, the 1C label can also be read off. 8 200535708 When the switch is damaged, the ink in the switch leaks and adheres to the periphery of the switch. Therefore, the replacement of the IC label can be confirmed visually. [Schematic description] Figure 1 is a plan view of the IC tag of the present invention; Figure 2 is a sectional view of Figure 1; Figure 3 is a plan view of a broken switch;
第4圖係第3圖的剖面圖; 第5圖係本發明之另一實施例,破損開關的平面圖; 第6圖係本發明之1C標籤的方塊圖; 第7圖係破損開關的破損狀態示意圖; 第8圖係本發明之另一實施例,破損開關的破損狀態 示意圖。 【主要元件符號說明】 1 : 1C晶片 1 1 ··整流電路 1 2 :解調電路 1 3 ··調變電路 1 4 :時序電路 15 : CPU 1 6 :記憶體 2 :天線線圈 3 :破損開關 3 1 :膜 3 2 :墊片 3 3 :儲液層 3 4 :電極 200535708 3 5 :導線 4 :基板 5 :内裏 6 :表面標籤 7 :剝離紙 8 :讀取器/寫入器 9 :天線線圈 a :粘著劑 b :墨水 c :切縫線 d :細導線4 is a sectional view of FIG. 3; FIG. 5 is a plan view of a damaged switch according to another embodiment of the present invention; FIG. 6 is a block diagram of a 1C label of the present invention; and FIG. 7 is a broken state of the broken switch Schematic diagram; FIG. 8 is a schematic diagram of a damaged state of a broken switch according to another embodiment of the present invention. [Description of main component symbols] 1: 1C chip 1 1 ·· Rectifier circuit 1 2: Demodulation circuit 1 3 ·· Modulation circuit 1 4: Sequential circuit 15: CPU 1 6: Memory 2: Antenna coil 3: Broken Switch 3 1: membrane 3 2: gasket 3 3: reservoir 3 4: electrode 200535708 3 5: lead 4: substrate 5: inner 6: surface label 7: release paper 8: reader / writer 9: Antenna coil a: adhesive b: ink c: slit line d: thin wire
1010
Claims (1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004132420A JP2005316628A (en) | 2004-04-28 | 2004-04-28 | Ic tag with replacement prevention function |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200535708A true TW200535708A (en) | 2005-11-01 |
Family
ID=35444004
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94113298A TW200535708A (en) | 2004-04-28 | 2005-04-26 | IC tag with anti-replacement function |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2005316628A (en) |
TW (1) | TW200535708A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007193597A (en) * | 2006-01-19 | 2007-08-02 | Toshiba Corp | Ic card |
-
2004
- 2004-04-28 JP JP2004132420A patent/JP2005316628A/en not_active Withdrawn
-
2005
- 2005-04-26 TW TW94113298A patent/TW200535708A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2005316628A (en) | 2005-11-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0586678B1 (en) | Non-visible, electronic markers for security bags, method of tagging and method of detection | |
US6888509B2 (en) | Tamper indicating radio frequency identification label | |
TW511036B (en) | Information recording security tag | |
CN101727605B (en) | RFID electronic tag preventing peeling off after being adhered on surface of object | |
JP2008301912A (en) | Sealing sticker for illegal conduct prevention of game machine | |
CA2387612C (en) | A tamper indicating radio frequency identification label | |
CN202067300U (en) | Second-use-prevented RFID anti-counterfeiting label | |
JP2005216054A (en) | Ic label prevented from being replaced | |
JP3211168B2 (en) | Method of mounting transponder in identification device, and sealing seal with transponder using this method | |
JP5169385B2 (en) | Label type information medium | |
JPH10293827A (en) | Non-contact ic card enclosure body and non-contact ic card | |
TW200535708A (en) | IC tag with anti-replacement function | |
JP2002072883A (en) | Data memory element holding label | |
JP6334036B1 (en) | Inlet antenna, inlet antenna apparatus, and manufacturing method thereof | |
JP2014154084A (en) | Packaging body having ic tag | |
EP1520265B1 (en) | Improvements in paper | |
CN210983469U (en) | High-frequency local fragile electronic tag | |
JP2002225462A (en) | Non-contact ic slip and method for using the same | |
CN210983468U (en) | Ultrahigh frequency local fragile electronic tag | |
CN214751949U (en) | Flexible anti-fake anti-metal ultrahigh frequency RFID (radio frequency identification) label | |
CN215769781U (en) | RFID seals label | |
JP7185455B2 (en) | Confidential label | |
CN210271498U (en) | Uncovering type electronic anti-counterfeiting label | |
CN210836169U (en) | Bottleneck thermal shrinkage sealing structure with electronic tag | |
JP2009150915A (en) | Sealing sticker |