200533974 九、發明說明： 【發明所屬之技術領域] 有關將使用光纖之光通訊系統所使用的光通訊零件之 發光元件’或作爲曝光機之光源所使用的發光元件，在基板 上以高精確度進行構裝的方法。 【先前技術】 譬如在光通訊系統所利用的光-電變換零件之中所使用 的雷射二極體（以下稱爲LD )及光纖或光導波路的組合中， Φ 對於LD之發光點位置有必要以高精確度來連接光纖或光導 波路。對於使先前技術的LD及光導波路之對位方法一邊參 考第5圖一邊加以說明。 第5圖是顯示LD及光纖及光導波路之連接的光-電變換 零件的平面圖。在形成有光導波路53之基板5 1上，具有顯 示光導波路53之位置的基板對準標記52。在LD61上，具 有顯示活性層63之位置的LD對準標記62。一般而言對於 基板之光導波路，對準標記之形成誤差是〇 · 2μιη以下而非 • 常地高精確度，但因爲設有對準標記之發光元件的對準標記 及發光點位置之形成誤差是2〜3μιη而精確度不佳，所以LD 對準標記62及LD61的發光量形成最大的位置，並不一定一 致，僅使LD對準標記62及基板對準標記52對位來組合光-電變換零件，仍不能效率良好地將LD發光傳達到光纖。 因此，將未圖示的計測用光纖之前端一邊掃描LD6 1之 附近一邊進行探測，將LD6 1的發光量成爲最大之位置藉由 在LD6 1之上面的識別手段，作爲純粹的活性層位置來加以 200533974 識別，用來算出純粹的活性層位置。其次，將LD6 1上之LD 對準標記62藉由在LD6 1的上面之識別手段來加以識別，用 來算出純粹的活性層及活性層63之位置的偏差量。將此等 偏差量之算出値爲基礎在基板51作爲來構裝LD61的方法， 已知有藉由來識別LD對準標記62在所算出之活性層63的 位置加上前製程所算出之偏差量，進行使光導波路53及活 性層63的對位之方法。（譬如，日本專利文獻i ) 〔專利文獻1〕 • 日本專利特開2001-183551號第2圖 【發明內容】 〔發明所欲解決之問題〕 對準標記之位置測定，是藉由圖像對合（pattern matching)來進行。圖像對合方法，是預先將成爲基準的對準 標記（基準標記圖像）進行登記放著，藉由識別手段由所識 別之圖像內，與所登記的標記來檢索最一致的圖像，而求出 其位置者，因此對準標記對於基準標記圖像一致性愈高則位 • 置檢測精確度愈高，一致性降低的話則位置檢測精確度下 降。即，對準標記之形成精確度在對準精確度會有賦予影響 的問題。 又，會有不能使用在沒有對準標記的發光元件之問題。 又，當發光元件固定於載物台時，由於對於載物台會產 生發光元件稍微傾斜形成妨礙高精確度的測定。 〔解決問題之手段〕 一種發光元件之構裝方法，其係在設有對準標記之基板 200533974 上用來構裝發光元件者，具有：發光元件的發光點位置、將 發光兀件之圖像資料作爲立體（三度）資料來識別的第1製 程、演算藉由第1製程所獲得之發光元件的圖像資料及發光 71：件之發光點位置的相對位置之第2製程、及調整發光元件 構裝構裝面和基板構裝面的平行度之後，將設於基板上的對 準標記及前述發光元件的發光點位置對位而構裝的第3製 程。 又，前述第2製程中，藉由使用校準工具求出發光元件 • 之圖像資料的座標系統及發光點位置之座標系統的關係公 式來進行相對位置之演算爲佳。 又，前述發光元件之圖像資料使用對準標記爲佳。 〔發明效果〕 從發光點位置之立體資料及發光元件的圖像資料之立 體資料，演算各自的相對位置，所以不會受到發光元件之固 定用載物台的稍微傾斜，或圖像資料位置測定用之識別手段 的組合精確度或經時變化之影響，可高精確度地在基板上構 •裝發光元件。 又，對於發光元件之圖像資料預先來測定發光元件中之 發光點位置放著，因爲在基板上來構裝發光元件時將發光元 件的圖像資料作爲基準，所以不會影響到對準標記之形成精 確度而可高精確度地來構裝。 又，在構裝後來計測發光元件之位置’因爲不必進行偏 移調整所以可提高作業效率° 又，使用校準工具，所以可高精確度地求出發光元件之 -7- 200533974 圖像資料的座標系統及發光位置之關係公式。 又，藉由在圖像資料使用對準標記，有對準標記可容易 進行構裝發光元件。 【實施方式】 〔實施發明之最佳形態〕 以下，爲了實現本發明的發光元件之構裝方法對於裝置 構成一邊參考圖式一邊來加以說明。 第1圖是顯示爲了實現本發明之構裝方法的構裝裝置 # 1，由發光點測定裝置1〇及結合（bonding)裝置20所構成。 發光點位置測定裝置10，具備有：用來吸著保持發光元 件2之發光元件保持載物台11;爲了使發光元件發光被安裝 於未圖示LD驅動單元的探測器1 2 ;用來識別發光元件2之 圖像的圖像識別手段1 3及進行焦點位置調整之圖像識別手 段用載物台35;用來識別發光點位置3的發光點位置識別手 段1 4及進行焦點位置調整之發光點位置識別手段用載物台 37 ;及發光點測定裝置控制器1 5，演算藉由圖像識別手段 • 1 3及發光點位置識別手段1 4所獲得的圖像資料及由焦點位 置調整用載物台焦點位置座標對於發光元件之圖像的發光 點位置3，並將發光點位置及發光元件的圖像資料發送到結 合裝置20。 又，結合裝置20,具備有：用來保持發光元件2之結合 頭（bonding he ad)21、用來保持具有光導波路之基板4的基 板保持載物台22、用來識別設於發光元件2及基板4之對準 標記5的二視野照相機23、進行基板4及發光元件2之平行 200533974 度測定作爲雷射角度感測器的自動 (autocollimator)25 ;作爲反射鏡手段之90度稜鏡 於結合頭2 1的平行度調整機構27、及用來演算由 置測定裝置所發送之資料及藉由二視野照相機2 3 資料之控制器24。 在發光元件之發光點位置測定裝置1 0，作爲凳 藉由安裝於未圖示LD驅動單元的探測器1 2使發 光，來調整發光點位置識別手段用載物台3 7之位 # 一致於發光點，並藉由發光點位置識別手段1 4來 點位置3之後，來調整圖像識別手段用載物台3 5 發光元件之3點以上的部位使焦點一致，並藉由圖 段13來取入發光元件2之圖像。發光元件因爲發 脹，故爲了減低熱膨脹造成測定誤差而使發光元件 光點位置的測定完成爲止。發光點位置之識別及發 圖像之識別是不管順序，亦可先進行圖像的識別， 時進行識別。 ® 其次，作爲第2製程是將發光點位置及發光元 資料的相對位置由第1製程所獲得之資料來進行複 來識別預先求出放著的發光元件的圖像之圖像識 座標系統，及用來識別發光點位置之發光點位置識 座標系統之相對關係，將發光元件的圖像資料中之 置藉由發光點測定裝置控制器1 5來進行演算。 以下來說明使用於第2製程之圖像識別手段 及發光點位置識別手段的座標系統之相對關係。 準直儀 26、安裝 發光點位 所測定的 1製程， 光元件發 置使焦點 識別發光 的位置在 像識別手 光而熱膨 發光到發 光元件的 又亦可同 件之圖像 丨算。由用 別手段的 別手段的 發光點位 座標系統 -9- 200533974 如第2圖所示，至少將安裝3個標記之校準（calibration) 工具3 0，以圖像識別手段1 3及發光點位置識別手段1 4 一起 可識別相同標記的方式，對移動手段以30〜60度之範圍內 保持傾斜並加以固定。3個標記是配置成高精確度，譬如以 50 μιη之間隔將由標記31及標記33而成的直線及由標記32 及標記3 3而成的直線，配置成垂直。 將圖像識別手段1 3以圖像識別手段用載物台3 5在校準 工具30之標記3 1移動到焦點一致的位置，在其位置從以攝 # 像元件所獲得之標記31的圖像來求出標記位置，從圖像識 別手段用載物台座標及由攝像元件所獲得之座標來測定標 記31的立體座標。將立體座標作爲（χ31_41、γ31_41、Ζ31_41 )。 同樣對於標記32、標記33之立體的位置資訊亦來加以測 定。將各立體座標，作烏（Χ32·41、Υ32_41、Ζ32_41 )，（ Χ33·41、 Υ33·4ΐ、Ζ33-^ )。其次，對於發光點位置識別手段14亦同 樣進行測定用來測定標記3 1、標記3 2、標記3 3之立體的位 置資5只。將ΑΑ體座標分別作爲（Χ31_42、γ3142、Ζ3ι_42)， 鲁（Χ32_42、Υ 3 2 - 4 2、Ζ32_42)，（Χ33_42、γ 3 3 4 2、Ζ33·42)。 校準工具30之標㊉31、32、33’是形成預先所決定的 間隔並配置成高精確度，所以如上述從所獲得之座標資訊可 求出對於圖像識別手段1 3的座標系統4 1用來變換發光點位 置識別手段1 4的座標系統4 2之關係公式。將X座標系統作 爲X4 2 ’將Υ座標系統作爲Υ4 2，將乙座標系統Ζ 4 2，可求出 下述關係。 〔式1〕 -10- 200533974 X42 = fX ( X41、Y41、Z41 ) Y42 = fY ( X41、Y41 ' Z41 ) Z4i=fz ( X41、Y4I、Z41) 除此之外，亦可硏究出各種之座標變換的方法，使用任 何方法皆可。 其次來卸下校準工具3〇,並將發光元件2固定於發光元 件保持載物台1 1。使安裝於LD驅動單元之探測器1 2接觸 於發光元件2並使發光元件2點亮。第3圖是顯示在發光元 # 件保持載物台1 1固定有發光元件2的狀態。 首先，藉由圖像識別手段1 3來測定發光元件2之標記 62的立體位置資訊。作爲立體座標是形成（x62a_41、Y62a 41、 Z62a-41)及（X62b-41、Y62b-41、Z62b-41)。其次，藉由發光 元件識別手段1 4來測定發光元件2之發光位置3的立體位 置資訊。作爲立體座標系統是形成（X3-42、Y3-42、Z3_42)。 藉由所獲得之前述關係公式將發光元件2之發光位置3在發 光元件之對準標記62的座標系統上改變的方式，對於對準 # 標記62可求出發光點位置。 發光元件保持載物台1 1之載物台面，是藉由加工精密 度的誤差微妙地保持傾斜。可是，以發光元件2之對準標記 62及發光點位置3所構成的平面中，藉由求出各自的位置關 係，可獲得正確的發光點位置資訊。 還有，使用用來識別發光元件之圖像的識別手段及用來 識別發光位置之識別手段的相對座標之對準工具30的 '測 定，並非於每次測定發光元件的發光點位置時進行’而是識 200533974 別發光元件之圖像的識別手段及識別發光位置之識別手段 的相對關係，因熱或經時的變化而偏離必要之測定精確度以 上的情況下來進行即可。 進而，作爲第3製程，是將以第2製程所獲得之發光元 件的圖像資料及發光點位置資料轉送到結合裝置20,同時以 晶片裝載器（chip loader)16將發光元件2交給結合裝置20 之結合頭2 1。還有，獲得發光元件之圖像資料及發光點位置 資料之後，一旦收容於晶片托盤以晶片托盤朝向結合裝置供 • 給發光元件的情況下，將發光元件之圖像資料及發光點位置 及收容於托盤的位置資料送到結合裝置即可。 基板4，是以未圖示基板裝載機從基板托盤所抽出，並 供給到基板保持載物台22。 其次，如第4圖所示在基板4及發光元件2之間插入90 度棱鏡2 6，從自動準直儀2 5使雷射光照射到發光元件2來 調整90度棱鏡26的反射面之高度。從來自發光元件2的反 射光在自動準直儀25之集光點的位置偏移量，來測定對於 ®發光元件2之基準面的傾斜角。 同樣在進行基板4之角度測定的位置，調整90度稜鏡 26之反射面位置，而測定對於基板4之基準面的傾斜角。 此等，從發光元件2及基板4之角度測定結果，以平行 度調整機構27修正發光元件2之傾斜角度，使兩者間的平 行度成爲零。 接著，以二視野照相機來獲得保持於結合頭21之發光 元件2的圖像資料，從在第2製程所獲得之發光元件的圖像 -12- 200533974 資料及發光點位置資料’以構裝裝置控制器24來演算發光 元件之對準基準座標。 將基板4之對準標記5的座標以二視野照相機2 3來測 定，並將與前述發光元件之對準基準座標的差分以基板保持 載物台22來修正移動，而進行對位。爲了來確認修正結果， 以二視野照相機23再度測定發光元件2及基板4的位置， 若在預先設定之容許範圍內的話，則退回二視野照相機23 退開，並使結合頭2 1下降來構裝發光元件2在基板4上。 # 在容許範圍外的情況下，則重複進行修正動作到形成容許範 圍內爲止。 構裝後之基板是以未圖示之基板卸載機（unloader)來收 容於托盤。 以本實施態樣，圖像識別手段是在Z方向（上下方向） 形成可調整位置，而發光點位置識別手段是在X或Y方向 (水平方向）形成可調整位置，但亦可將發光元件保持載物 台在水平方向及上下方向形成可調整位置。發光點位置測定 ® 裝置之識別手段，是作爲圖像識別手段及發光點位置識別手 段分別設有識別手段，但亦可設有反射鏡等之光路變換手段 用來變換來自發光元件的圖像之光路或來自發光點位置的 光路，而藉由一個識別手段來識別發光元件之圖像及發光點 位置。 又，結合裝置之結合頭，是在Z方向（上下方向）形成 可調整位置，而基板保持載物台，是在X、Y方向（水平方 向）及/或Θ方向（旋轉方向）形成可§周整位置’但根據必 -13- 200533974 要亦可將結合頭可形成平行移動及/或旋轉移動，亦可將基 板保持載物台形成可昇降移動。 又，爲了用來識別設於發光元件及基板之對準標記所使 用之識別手段並不限定於二視野照相機，譬如，發光元件， 基板爲適合於含紅外線的光線穿透者之情況下，使發光元件 及基板接近的狀態下在上部或下部來設置一台紅外線照相 機等，並在相反側設置光源亦可讀取對準標記。 又，構裝之發光元件，是可例舉雷射二極體，光二極體 # 等，而基板並不限定於形成有光導波路的基板，亦可用爲了 決定光纖之構裝位置而形成有V溝的基板。 又，取代對準標記而使用發光元件之圖像資料來進行圖 像對合亦可。 【圖式簡單說明】 第1圖是爲了來實現本發明的發光元件之構裝方法的構 裝裝置平面圖。 第2圖是用來演算圖像識別手段之座標系統及發光點位 •置識別手段的座標系統之相關關係的裝置斜視圖。 第3圖是用來測定發光元件之傾斜的斜視圖。 第4圖是用來測定發光元件及基板之平行度的槪略構成 圖。 第5圖是表示具有對準標記的基板及ld之平面圖，用 以顯不先前技術之組合方法。 【元件符號說明】 1…構裝裝置 -14- 200533974 2.. .發光元件 3.. .發光點位置 4 ...基板 10.. .發光點位置測定裝置 1 1 ...發光元件保持載物台 12.. .探測器 13.. .圖像識別手段 14.. .發光點位置識別手段 φ 1 5 ...發光點測定裝置控制器 16.. .晶片裝載器 2 0…結合裝置 21 ...接合頭 2 2 ...基板保持載物台 23.. .二視野照相機 24.. .構裝裝置控制器 25.. .自動準直儀 _ 26··. 90度棱鏡 27.. .平行度調整機構 30…校準工具 3 1 ...標記 32…標記 3 3...標記 3 5...圖像識別手段用載物台 3 6...校準工具標記安裝面平面圖 -1 5 200533974 3 7...發光點位置識別手段用載物台 4 1...圖像識別手段13之立體（三度）座標系統 4 2...發光點位置識別手段14之立體（三度）座標系統 51…基板 52...基板對準標記 53…光導波路 61 ".LD， 62…LD對準標記 φ 63…活性層。200533974 IX. Description of the invention: [Technical field to which the invention belongs] Regarding the light-emitting element of the optical communication part used in the optical communication system using optical fiber or the light-emitting element used as the light source of the exposure machine, on the substrate with high accuracy Method of construction. [Prior art] For example, in a combination of a laser diode (hereinafter referred to as LD) and an optical fiber or an optical waveguide used in optical-electric conversion parts used in an optical communication system, Φ has a position of a light emitting point of LD. It is necessary to connect optical fibers or optical waveguides with high accuracy. The alignment method of the LD and the optical waveguide of the prior art will be described with reference to FIG. 5. Fig. 5 is a plan view of an optical-electrical conversion part showing the connection between the LD, the optical fiber, and the optical waveguide. The substrate 51 on which the optical waveguide 53 is formed has a substrate alignment mark 52 indicating the position of the optical waveguide 53. On the LD 61, there is an LD alignment mark 62 showing the position of the active layer 63. Generally speaking, for the optical waveguide of the substrate, the formation error of the alignment mark is less than 0.2 μm, which is not always high accuracy, but because of the formation error of the alignment mark and the position of the light emitting point of the light emitting element provided with the alignment mark It is 2 ~ 3μιη and the accuracy is not good. Therefore, the positions where the LD alignment marks 62 and LD61 form the largest light emission are not necessarily the same. Only the LD alignment marks 62 and the substrate alignment marks 52 are aligned to combine light- Electrical conversion parts still cannot efficiently transmit LD light to an optical fiber. Therefore, the front end of the measuring fiber (not shown) is scanned while scanning the vicinity of LD6 1, and the position where the light emission of LD6 1 is maximized is determined as a pure active layer position by the identification means on LD6 1. Add 200533974 to identify the pure active layer position. Next, the LD alignment mark 62 on the LD 61 is identified by the identification means on the LD 61, and the deviation amount of the position of the pure active layer and the active layer 63 is calculated. Based on the calculation of these deviation amounts, a method for constructing LD61 on the substrate 51 is known. It is known to identify the LD alignment mark 62 at the calculated position of the active layer 63 plus the deviation amount calculated in the previous process. A method of aligning the optical waveguide 53 and the active layer 63 is performed. (For example, Japanese Patent Document i) [Patent Document 1] • Japanese Patent Laid-Open No. 2001-183551 Figure 2 [Summary of the Invention] [Problems to be Solved by the Invention] The position of the alignment mark is measured by image alignment Pattern matching. The image registration method is to register and place a reference alignment mark (reference mark image) as a reference in advance, and use the recognition means to retrieve the most consistent image from the identified mark with the registered mark. If you want to find its position, the higher the consistency of the alignment mark for the fiducial mark image, the higher the position detection accuracy. If the consistency decreases, the position detection accuracy will decrease. That is, there is a problem in that the accuracy of the formation of the alignment mark has an influence on the accuracy of the alignment. In addition, there is a problem that it cannot be used for a light emitting element without an alignment mark. In addition, when the light-emitting element is fixed to the stage, the light-emitting element is slightly inclined to the stage, which prevents high-precision measurement. [Means for Solving the Problem] A method for constructing a light-emitting element, which is used to construct a light-emitting element on a substrate 200533974 provided with an alignment mark. The first process for identifying data as three-dimensional (three-dimensional) data, calculating the image data of the light-emitting element obtained by the first process, and the light emission 71: The second process of the relative position of the light emitting point position of the piece, and adjusting the light emission After the parallelism between the component mounting surface and the substrate mounting surface, a third process is performed in which the alignment marks provided on the substrate and the positions of the light emitting points of the light-emitting elements are aligned. In the second process described above, the relative position calculation is preferably performed by using the relational formula of the coordinate system of the image data of the light emitting element • and the coordinate system of the position of the light emitting point using a calibration tool. In addition, it is preferable to use an alignment mark for the image data of the light-emitting element. [Effects of the invention] The relative positions are calculated from the three-dimensional data of the position of the light emitting point and the three-dimensional data of the image data of the light-emitting element, so it will not be slightly tilted by the stage for fixing the light-emitting element or the position of the image data is measured. The combined accuracy of the identification means or the effect of changes over time can be used to construct and mount light-emitting elements on a substrate with high accuracy. In addition, the position of the light emitting point in the light emitting element is measured in advance for the image data of the light emitting element. Since the image data of the light emitting element is used as a reference when the light emitting element is structured on the substrate, it does not affect the alignment mark It is formed with precision and can be assembled with high precision. Also, the position of the light-emitting element can be measured after installation. 'Because no adjustment of offset is necessary, the work efficiency can be improved.' Furthermore, using a calibration tool, the coordinates of the image data of the light-emitting element can be obtained with high accuracy. The relationship between the system and the luminous position. In addition, by using alignment marks in the image data, it is possible to easily construct a light emitting element with the alignment marks. [Embodiment] [Best Mode for Carrying Out the Invention] Hereinafter, in order to realize a method of mounting a light-emitting element of the present invention, a device configuration will be described with reference to drawings. Fig. 1 is a diagram showing a construction device # 1 for realizing the construction method of the present invention, which is composed of a light emitting point measurement device 10 and a bonding device 20. The light emitting point position measuring device 10 includes a light emitting element holding stage 11 for holding and holding the light emitting element 2; a detector 1 2 mounted on an LD drive unit (not shown) for emitting light from the light emitting element; Image recognition means 13 for the image of the light-emitting element 2 and stage 35 for image recognition means for performing focus position adjustment; light-emitting point position recognition means 14 for identifying the light-emitting point position 3 and focus adjustment Stage 37 for luminous point position recognition means; and luminous point measurement device controller 15 for calculating image data obtained by image recognition means • 13 and luminous point position recognition means 14 and adjustment of focus position The light-emitting point position 3 of the image of the light-emitting element is used for the focus position coordinates of the stage, and the light-emitting point position and the image data of the light-emitting element are transmitted to the combining device 20. The bonding device 20 includes a bonding he ad 21 for holding the light emitting element 2, a substrate holding stage 22 for holding the substrate 4 having an optical waveguide, and a recognition device provided on the light emitting element 2. A two-field-of-view camera 23 with an alignment mark 5 on the substrate 4 and a parallel 200533974 degree measurement of the substrate 4 and the light-emitting element 2 as an autocollimator 25 as a laser angle sensor; 90 degrees as a mirror means Combined with the parallelism adjusting mechanism 27 of the head 21 and the controller 24 for calculating data sent from the measurement device and data from the two-field camera 2 3. In the light emitting point position measuring device 10 of the light emitting element, as a stool, a detector 12 mounted on an LD drive unit (not shown) is used to emit light to adjust the position of the light emitting point position identifying means for the stage 3 7 #. Luminous point, and point position 3 by luminous point position recognition means 14. Adjust the image recognition means using stage 3 5 or more points of the light emitting element to make the focus consistent. An image of the light emitting element 2 is taken. Since the light emitting element swells, the measurement of the light spot position of the light emitting element is completed until the measurement error caused by thermal expansion is reduced. The identification of the position of the light emitting point and the identification of the transmitted image are regardless of the order, and the identification of the image can also be performed first, and the identification can be performed at that time. ® Secondly, as the second process, an image recognition coordinate system that recognizes the position of the light emitting point and the relative position of the light emitting metadata from the data obtained in the first process to identify the image of the light emitting element placed in advance, And the relative relationship between the luminous point position recognition coordinate system for identifying the luminous point position, the position in the image data of the luminous element is calculated by the luminous point measurement device controller 15. The following describes the relative relationship between the coordinate system of the image recognition method and the luminous point position recognition method used in the second process. Collimator 26. Install the light emitting point. In the process of 1 measurement, the light element is placed so that the position of the focus recognition light will be the same as the image of the hand and the light will expand to the light emitting element. By other means using other means of light point coordinate system-9- 200533974 As shown in Figure 2, at least three marker calibration tools 30 will be installed, using image recognition means 13 and light point positions The identification means 1 4 can identify the same mark together, and keep the moving means inclined within a range of 30 to 60 degrees and fixed. The three markers are arranged with high accuracy. For example, a straight line formed by the marks 31 and 33 and a straight line formed by the marks 32 and 33 are arranged at intervals of 50 μm. Move the image recognition means 1 3 using the image recognition means with the stage 3 5 on the mark 3 1 of the calibration tool 30 to the position where the focus is the same, and at that position, take the image of the mark 31 obtained from the image pickup element The position of the mark is obtained, and the three-dimensional coordinates of the mark 31 are measured from the image recognition means using the stage coordinates and the coordinates obtained from the image sensor. Let the three-dimensional coordinates be (χ31_41, γ31_41, Z31_41). The three-dimensional position information of the markers 32 and 33 is also measured. Take the three-dimensional coordinates as black (× 32 · 41, Υ32_41, Z32_41), (× 33 · 41, Υ33 · 4ΐ, Z33- ^). Secondly, the luminous point position recognition means 14 was also measured to determine the three-dimensional positions of the markers 3 1, 3, 2 and 3. Let AA body coordinates be (× 31_42, γ3142, Z3ι_42), Lu (× 32_42, Υ3 2-4 2, Z32_42), (× 33_42, γ 3 3 4 2, Z33 · 42). The calibration marks 31, 32, and 33 'of the calibration tool 30 are formed at predetermined intervals and are arranged with high accuracy. Therefore, the coordinate system for the image recognition means 13 can be obtained from the obtained coordinate information as described above. The relationship formula of the coordinate system 4 2 of the luminous point position recognition means 14 is transformed. Using the X coordinate system as X4 2 ′, using the Υ coordinate system as Υ 4 2 and the B coordinate system Z 4 2, the following relationship can be obtained. [Formula 1] -10- 200533974 X42 = fX (X41, Y41, Z41) Y42 = fY (X41, Y41 'Z41) Z4i = fz (X41, Y4I, Z41) Any method can be used for the coordinate transformation method. Next, the calibration tool 30 is removed, and the light-emitting element 2 is fixed to the light-emitting element holding stage 11. The detectors 12 mounted on the LD driving unit are brought into contact with the light-emitting element 2 and the light-emitting element 2 is turned on. FIG. 3 shows a state where the light-emitting element 2 is fixed to the light-emitting element holding stage 11. First, the three-dimensional position information of the mark 62 of the light-emitting element 2 is measured by the image recognition means 13. The three-dimensional coordinates are formed (x62a_41, Y62a 41, Z62a-41) and (X62b-41, Y62b-41, Z62b-41). Next, the three-dimensional position information of the light-emitting position 3 of the light-emitting element 2 is measured by the light-emitting element identification means 14. It is formed as a three-dimensional coordinate system (X3-42, Y3-42, Z3_42). By changing the light-emitting position 3 of the light-emitting element 2 on the coordinate system of the alignment mark 62 of the light-emitting element by the aforementioned relationship formula obtained, the position of the light-emitting point can be obtained for the alignment # mark 62. The light-emitting element holds the stage surface of the stage 11 and maintains the tilt delicately by a tolerance in processing accuracy. However, in a plane formed by the alignment mark 62 of the light-emitting element 2 and the light-emitting point position 3, accurate position information of the light-emitting point can be obtained by determining the respective positional relationships. In addition, the 'measurement of the alignment tool 30 using the identification means for identifying the image of the light emitting element and the relative coordinates of the identification means for the light emitting position is not performed every time the position of the light emitting point of the light emitting element is measured' It is to identify the relative relationship between the identification method of the image of the light-emitting element 200533974 and the identification method of the light-emitting position, and it may be performed when the measurement accuracy deviates more than the necessary accuracy due to changes in heat or time. Furthermore, as the third process, the image data and light emitting point position data of the light-emitting element obtained in the second process are transferred to the bonding device 20, and the light-emitting element 2 is handed over to the bonding by a chip loader 16器 20 的 组合 头 21 1. The head 20 of the device 20. In addition, after obtaining the image data and light-emitting point position data of the light-emitting element, once the light-emitting element is stored in the wafer tray and the wafer tray is oriented toward the bonding device to supply the light-emitting element, the image data of the light-emitting element and the light-emitting point position are stored. The position data of the tray can be sent to the combining device. The substrate 4 is extracted from a substrate tray by a substrate loader (not shown) and supplied to a substrate holding stage 22. Next, as shown in FIG. 4, a 90-degree prism 26 is inserted between the substrate 4 and the light-emitting element 2, and the laser light is irradiated to the light-emitting element 2 from the auto collimator 25 to adjust the height of the reflecting surface of the 90-degree prism 26. . The inclination angle with respect to the reference plane of the ® light-emitting element 2 is measured from the positional deviation of the reflected light from the light-emitting element 2 at the light collecting point of the autocollimator 25. Similarly, at the position where the angle measurement of the substrate 4 is performed, the position of the reflecting surface of 90 degrees 稜鏡 26 is adjusted, and the inclination angle with respect to the reference surface of the substrate 4 is measured. In these cases, from the angle measurement results of the light emitting element 2 and the substrate 4, the inclination angle of the light emitting element 2 is corrected by the parallelism adjusting mechanism 27 so that the parallelism between the two becomes zero. Next, a two-view camera is used to obtain the image data of the light-emitting element 2 held on the bonding head 21, and the device is constructed from the image of the light-emitting element obtained in the second process-12-200533974 data and light-emitting point position data. The controller 24 calculates the alignment reference coordinates of the light emitting element. The coordinates of the alignment mark 5 of the substrate 4 are measured with a two-field camera 23, and the difference from the alignment reference coordinates of the light-emitting element is corrected by the substrate holding stage 22 to perform alignment. In order to confirm the correction result, the positions of the light-emitting element 2 and the substrate 4 are measured again by the two-view camera 23. If the preset range is within the allowable range, the two-view camera 23 is retracted and the joint head 21 is lowered to construct The light emitting element 2 is mounted on the substrate 4. # If it is outside the allowable range, repeat the correction operation until it is within the allowable range. The assembled substrate is accommodated in a tray by a substrate unloader (not shown). In this embodiment, the image recognition means forms an adjustable position in the Z direction (up and down direction), and the light emitting point position recognition means forms an adjustable position in the X or Y direction (horizontal direction), but the light emitting element can also be Hold the stage in an adjustable position in the horizontal and vertical directions. The identification method of the light emitting point position measurement device is provided as an image recognition means and a light emitting point position recognition means, respectively. However, a light path conversion means such as a mirror can also be provided to convert the image from the light emitting element. The light path or light path from the position of the light emitting point, and the image of the light emitting element and the position of the light emitting point are identified by an identification means. In addition, the coupling head of the coupling device is formed in an adjustable position in the Z direction (up and down direction), and the substrate holding stage is formed in the X, Y direction (horizontal direction) and / or Θ direction (rotation direction). Circumference position ', but according to -13-200533974, the bonding head can also be moved in parallel and / or rotationally, and the substrate holding stage can be moved up and down. In addition, the identification means used to identify the alignment marks provided on the light-emitting element and the substrate is not limited to a two-field camera. For example, in the case where the light-emitting element and the substrate are suitable for a light penetrator containing infrared rays, When the light-emitting element and the substrate are close to each other, an infrared camera or the like can be installed on the upper or lower portion, and an alignment mark can be read by installing a light source on the opposite side. In addition, the structured light emitting element may be a laser diode, a light diode #, etc., and the substrate is not limited to a substrate on which an optical waveguide is formed, and V may be used to determine the structure position of the optical fiber. Groove substrate. It is also possible to perform image registration using image data of the light-emitting element instead of the alignment mark. [Brief description of the drawings] FIG. 1 is a plan view of a mounting device for realizing a method of mounting a light-emitting element according to the present invention. Fig. 2 is a perspective view of a device for calculating the relationship between the coordinate system of the image recognition means and the position of the light emitting point. Fig. 3 is a perspective view for measuring the tilt of a light emitting element. Fig. 4 is a schematic configuration diagram for measuring the parallelism of a light emitting element and a substrate. Fig. 5 is a plan view showing a substrate having an alignment mark and ld to show the combination method of the prior art. [Description of component symbols] 1 ... Construction device-14- 200533974 2. .Light emitting element 3..Light emitting point position 4 ... Substrate 10..Light emitting point position measuring device 1 1 ... Light emitting element holding load Object stage 12. Detector 13. Image recognition means 14. Luminous point position recognition means φ 1 5 ... Luminous point measuring device controller 16. Wafer loader 2 0 ... Combined device 21 ... joining head 2 2 ... substrate holding stage 23 .. two-view camera 24..constructor controller 25..automatic collimator _ 26 ... 90 degree prism 27 .. Parallelism adjustment mechanism 30 ... calibration tool 3 1 ... mark 32 ... mark 3 3 ... mark 3 5 ... stage for image recognition means 3 6 ... calibration tool mark mounting surface plan view-1 5 200533974 3 7 ... Stage stage for means for identifying light point positions 4 1 ... Stereo (three degree) coordinate system for image recognition means 13 ) Coordinate system 51 ... substrate 52 ... substrate alignment mark 53 ... optical waveguide 61 " LD, 62 ... LD alignment mark φ63 ... active layer.
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