TW200531753A - Adjustable exhaust flow for thermal uniformity - Google Patents
Adjustable exhaust flow for thermal uniformityInfo
- Publication number
- TW200531753A TW200531753A TW094109465A TW94109465A TW200531753A TW 200531753 A TW200531753 A TW 200531753A TW 094109465 A TW094109465 A TW 094109465A TW 94109465 A TW94109465 A TW 94109465A TW 200531753 A TW200531753 A TW 200531753A
- Authority
- TW
- Taiwan
- Prior art keywords
- exhaust flow
- thermal uniformity
- adjustable exhaust
- exhaust
- input signal
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Especially adapted for treating semiconductor wafers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D19/00—Arrangements of controlling devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Lift Valve (AREA)
- Electrically Driven Valve-Operating Means (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/810,978 US7026580B2 (en) | 2004-03-26 | 2004-03-26 | Adjustable exhaust flow for thermal uniformity |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200531753A true TW200531753A (en) | 2005-10-01 |
TWI252785B TWI252785B (en) | 2006-04-11 |
Family
ID=34988551
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094109465A TWI252785B (en) | 2004-03-26 | 2005-03-25 | Adjustable exhaust flow for thermal uniformity |
Country Status (2)
Country | Link |
---|---|
US (1) | US7026580B2 (zh) |
TW (1) | TWI252785B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI252137B (en) * | 2004-06-04 | 2006-04-01 | Au Optronics Corp | A dust cleaner applied to a process chamber |
US9892982B2 (en) * | 2014-01-03 | 2018-02-13 | Taiwan Semiconductor Manufacturing Co., Ltd | Method for controlling exhaust flow in wafer processing module |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0797241A3 (en) * | 1996-03-08 | 2002-05-15 | Kokusai Electric Co., Ltd. | Substrate processing apparatus |
US6291800B1 (en) * | 1998-02-20 | 2001-09-18 | Tokyo Electron Limited | Heat treatment apparatus and substrate processing system |
US6358673B1 (en) * | 1998-09-09 | 2002-03-19 | Nippon Telegraph And Telephone Corporation | Pattern formation method and apparatus |
JP4365017B2 (ja) * | 2000-08-23 | 2009-11-18 | 東京エレクトロン株式会社 | 熱処理装置の降温レート制御方法および熱処理装置 |
-
2004
- 2004-03-26 US US10/810,978 patent/US7026580B2/en not_active Expired - Fee Related
-
2005
- 2005-03-25 TW TW094109465A patent/TWI252785B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US7026580B2 (en) | 2006-04-11 |
US20050211695A1 (en) | 2005-09-29 |
TWI252785B (en) | 2006-04-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |