TW200530789A - Water-cooled and air-cooled heat dissipating device - Google Patents

Abstract

The present invention relates to a water-cooled and air-cooled heat dissipating device, more particular, to a heat dissipating device using cooling liquid and fan to create a circulation and therefore attain a multiple heat dissipating effect and the reduction of water resistance, wind resistance, and heat resistance with a better heat dissipating function. The heat dissipating device comprises a base, a substrate, heat dissipating blades, and a heat- exchanging device. The base has a containing part on which the substrate is fixed; inside the substrate is a containing space where the heat dissipating blades and heat-exchanging device are installed inside; a fan and a containing tank is disposed in the heat exchange device, and the containing tank has a plurality of apertures for being filled with cooling liquid from the containing tank of the heat-exchanging device; moreover, the apertures can be used to deliver the cooling liquid between the containing space of the substrate and the heat dissipating blades such that the fan blows or draws the containing space directly to conduct heat-exchanging continuously between the cooling liquid and the heat dissipating blades so as to attain a multiple heat dissipating effect and the reduction of water resistance, wind resistance, and heat resistance with a better heat dissipating function.

Description

200530789 V. Description of the invention (1) " [Technical field to which the invention belongs] The present invention provides a liquid, air-cooled heat dissipation device, especially a cooling liquid input in the heat dissipation device and the fan directly blows or sucks the accommodation space so that Constantly exchange heat with the continuously circulating coolant and heat sink to achieve multiple heat dissipation effects, and improve the applicable performance of the heat sink. [Previous technology] Press' With the rapid development of high technology, the volume of electronic components tends to become micro-broader i and the density of transistors per unit area is also getting higher and higher, and its effectiveness has been continuously enhanced. These factors The total heat generation of electronic components is almost gradually increasing. If there is no good heat dissipation method to quickly exclude the heat source generated by electronic components, these excessive temperatures will cause electronic components

MM_ (EleCtr〇nRunawayM thermal stress ^ Herma 1 Stress), etc., cause the overall stability to decrease, and shorten the life of the electronic components themselves, how to eliminate these ^ sensible heat sources to avoid overheating of the electronic components, it is intolerable Ignored issues. And the shorter the life cycle of personal computers has been in the society, the higher the central processing unit 'needs the central processing unit (the CP box is fast, and the relative central processing capacity is also constantly increasing; however, the central processing has changed too much. At present, the central rate has exceeded 100 watts. With this situation, it will continue to rise. If there is no perfect heat dissipation, it will be everywhere. As the computer generation (CPU) elimination rate also follows U), the better the performance and calculation processing. The surface area of the heater (CPU) emitted by the CPU (CPU) has not continued to develop the power consumption of the processor (cp U). The heating temperature will seriously affect the central device

200530789 V. Description of the invention (2) Processor (The heat dissipation performance of CP u is similar to that of the central processor, as shown in the fifth figure), and the airflow is achieved and A is set (as shown in the sixth figure, hot bucket A 2 is liquid-cooled) The heat dissipation ~ like a central processing heat device (air cooling or 'to enhance the heat dissipation equipment) due to the size of the area, so many are, to be engaged in this industry as soon as [invention] Therefore,' inventor related information, And after years of experience, the main function of the invention of the cold-type heat sink device, the radiator, and the heat-accommodating part is the normal operation of the accommodation space), so 'how to improve the importance of the radiator is important The heat sink B is installed on the circuit board B 2 B 2 1 (CPU)

Use the basic heat dissipation device of the fan b 丄 of the radiator B to assist the heat dissipation function; or use the liquid-cooled heat dissipation device) to achieve the purpose of auxiliary heat dissipation by using cooling water in the radiators A 散热器 and ^; And according to different air cooling methods, the heat dissipation efficiency is different: a single type of liquid cooling is selected on the CPU (CPU), and air cooling or liquid cooling cannot be used-the heat dissipation performance of the parallel use is not available; In addition, the central processing unit (limitations of the CPU 'cannot install two types of distractions and troubles at the same time, and it is urgently needed to cover them.' How to improve the shortcomings and shortages of the conventional heat sinks? The goal and direction for improvement: In view of the lack of the above-mentioned heat dissipation device, we have carefully collected evaluations and considerations from various parties, and have developed the liquid and gas invention patent with the help of various modifications. The purpose is to dissipate the heat dissipation device package ^ ^ m ^, which is composed of G with a base and a base replacement device; the base Λ # 古 巧 瓜 马 闻 has a receiving part and a base, and the base has a receiving inside With heat sink Shame exchange; ..., flatter parent apparatus, the heat exchange means

Page 6 200530789 V. Description of the invention (3) The fan directly sent to the base is equipped with a wind exchange device, which is directly blown by the fan for heat exchange. The hole of the present invention, but the seat body is liquid, is transmitted through the outside, the present invention is used to achieve the implementation method of the tablet, the fish tank, etc., and the effect is as follows, please refer to the drawings, three-dimensional characteristics and effects of the heat exchange device of the present invention. The empty space is empty, in order to reach the secondary hot plate, and then another space is needed to achieve the seat. The water tank is needed, and it is used in the cold room to achieve multiple purposes. To achieve the purpose, the tank is provided with a cooling ring for the purpose of containing the tank ring for cooling. The storage tank has a plurality of through holes; the heat: liquid, and the through holes of the storage tank spill out onto the political hot plate. Then the wind in the accommodating space is cut off, and the cooling liquid with continuous circulation and the effect of heat dissipation are dissipated. …, The base of the heat dissipation device is to transfer heat to the heat source more quickly and to dissipate it. The base of the political heating device is provided with a liquid inlet with a liquid outlet, and the cold can overflow from the liquid inlet through the input of the liquid. The effect from the liquid hole of the base. The reason is that the heat sink is a device that can be used for CPU heat. Twenty-two: t-effect 'The technical means used in the present invention, and the preferred embodiment details its characteristics. As shown in Figures 2, 3 and 3, 'It is the three-dimensional appearance of the present invention =, Side view cross-section ®' It can be clearly seen from the figure that the thermal device is composed of a base 1, a base 2, and other components, and The heat dissipation of the present invention; the position L can be as follows, where: 1 is a accommodating portion 11 having a concave shape, and the accommodating portion i

Page 7 200530789 There are 2 fixed liquid holes in the interior, and there are top covers 2 14 A plurality of fixed pieces 3 There are a plurality of shaft holders for the replacement device 111 A receiving slot 4 11 4 12 The upper cover 4 can be locked by the lock To form a component, the fan slots 1 1 in the resisting part are provided with a resisting part 2 2, the outer part is 2 1, and the fixed part 2 is provided with a plurality of 4 to be provided. 4 12 The locking seat is directed to the seat body 4 11 3 is set in the container 2, and the locking seat 4 1 is a heat exchange fin 2 2 1 is a heat sink 3 4 1 2 contains a space 2 2, and 2 2 1, and a liquid hole 2 2 2 There are multiple positioning parts 2 2 The top cover 2 1 is provided with a top cover 2 1 The side is provided with a heat sink fin with a base body 4 and a receiving groove 4 114 4 1 An outwardly extending groove 4 1 is provided with a fan and the upper cover 4 pieces 4 2 1 1 4 places, device 4. 3 is placed on the base, and then above, and 1, let's be 3 1. 1 and the upper cover 4 11 and the through hole 4 are respectively provided with a liquid inlet hole 1 and the outer 4 1 2 1 2 The outer edge is 1 through the lock cymbal and the receiving body 4 of the upper cover seat 2 1 on the seat body 4 on the seat body 5 V. Description of the invention (4) 1 The inner edge wall of the base is provided on one side, and the outlet 2 is extended to the outer 2 as a cover 1 and a vent hole 2 1 2 and the heat dissipation body The inner edge of 4 1 is provided with a plurality of through holes 4 1 2, and the shaft seat 1 through the liquid inlet hole 4 1 is covered with the hole 4 2 1, and the seat body 4 1 is inserted into the body 4 1. And resists in the housing space 2 2 1 2 inside the housing space 2 2 space 2 2 will house the space 2 3 outwards, and then there is a content space 2 1 on the base 4 notch-shaped limit 4 2 The accommodating slot 4 1 1 1 1 is penetrated by a guide post 4 1 4 1 1 3; the base body is further provided with a plurality of locking holes 4 2 1 lock 4 2 on the base body 4 Seating space 2 2 Shaft seat 4 built into the base 2 capacity 1 4 accommodation slot 4

Page 8 200530789 V. Description of the invention (5) The cooling holes 4 1 1 1 are filled inside and then cooled by the heat behind the fan 4 and then the fan 4 1 2 is effective. When the cooling liquid is in the hot area, Through the heat dissipation effect, the bottom of the heat sink 3 and the cold 1 2 1 can be blown into the air hole 2 1, the heat sink 3, and the body fluid, so that the cold deflector 4 1 1 2 1 directly drips the liquid directly 1 Blow the heat accommodating space 2 Fan 4 1 2 Place the space 2 2 The liquid comes in contact to dissipate heat, the shape 4 is released and the product 4 1 is blown out and the liquid is blown through the volume 1 2 to cool the cooling fins 3 1 2 1 The blown water is internally cooled and absorbed, and the fourth regenerating air flow follows 4 12 1 The tank 4 overflows the liquid to reach the sheet 3 and reaches the water surface, and the residual heat sink of the liquid heat sink reaches 1 1 more volume Empty the first heavy fin 3, the second heavy surface shape will reach the remaining temperature 3, and then the effect will be cooled by the base of the heat sink edge 2 2 cooling; on the 1st, the cooling and work will be scattered and the third heavy will be scattered. The fan 4 heats up the function of the seat 2 and resists the space between the 2 2 and the distance, and penetrates 3 1 into 2 1 to lock the heat supply. The exchange is set on the bottom card to hold the complete volume and the heat sink 3 can be placed on the resisting member 2 2 1 and then located above the heat sink 3. The top cover 21 is covered by the base fixing portion 213 and locked. It is fixed on the base 2 and has a liquid inlet 41 of the top device 4 and a heat-receiving portion 1 1 on the side of the receiving portion 1 1 of the seat 1. 'The base 2 and the base 1 are the heat exchange and heat dissipation 2 of the base 2, and then cover the positioning part 2 1 side 1 3 and the base 2 slot 1 1 1 contains the device sheet 3 using 2 2 sides In the outer space, inside the space 2 2, 4 is placed in the accommodating space to maintain an appropriate interlocking element 2 1 3, and the top cover limiting portion 2 1 2 ′ 俾 is the base 2 liquid hole 2 2 2 The composition of the present invention can be made in one piece or used

Page 9 200530789 V. Description of the invention (6) Welding method: base, tight fit, etc. and as shown in the fourth figure, the transparent material made of this material can be used for the heat sink 3 3 above, heat dissipation 3, and the bottom of the base 4 1 It can be lower than the shaft seat 4 1 2 and the upper groove 4 1 1 blows the cooling liquid up to m in the heat sink 3 and the film 3 1 gathers up to 2 and absorbs the cooling liquid inside the surface of the 1 blow water, the heat radiation becomes the fourth The heavy heat is generated and the air flow circulates, and 4121 reaches the accommodating space 2 2 The body 4 1 performs heat exchange with the perimeter of the sheet 3. The embodiment of Liming, the semi-permeable accommodating space 1 is located on the surface to ensure the surface. Scattered in the base body 4 The base body 4 fans 4 1 2 of the cooling liquid 1 2 1 The blower is placed in the wrong place and the fan is used to hold the air and the coolant is sent to disperse 2 1 4 the base body 4 1 the wind 4 fans 4 1 The cold wind will self-cool with the cooling liquid. The present invention can adopt the locking connection, the willow seat 2 solid type to disperse the base shown in the base picture, the seat body 3 and the fan water surface to pivot to the first fin to cool. The effect of the second water surface, that is, the remaining residual piece 3, can be achieved through the multiple scattered internal base 1 or can be set on the base 2 for the thermal device base 4 inside the 4 1 for 4 12 and cooling. The fan fluid is recooled outwards. 3 1 is recooled to form one to the third temperature. It is caused by the fan, the base of the heater, and the hot gas. There is a loose seat between the inner edges. And the floating load 1 can float the liquid to do the heat 4 12 overflow, and then, by the function, the heat dissipation surface will re-radiate the heat sink 4 12 will be available, the heat dissipation effect; The seat body 4 body 3 2 which is preferably arranged in the through seat 2 floats in the water exchange and 1 and uses the wind to bring heat Fan 4 is effective when it is cooled down; 3 Blow vent holes at the bottom 1 3. Those who use 'simultaneous inhalation to make the effect visible or not 2 2 is the heat sink 3 heat sink 3 1 of 1 Directly brush the cooling space directly 2 4 12

2 2 is in contact with the heat, which is produced by the shape and the fan 2 1 will be cooled by the seat and C P

Page 10 200530789

V. Description of the invention (7) U, chip, fish The above-mentioned advantages of the present invention are as follows: 1. The heat sink has faster absorption 2. The heat sink ring performance The thermal effect 3. The heat sink does not need to go through and the heat flow can reach the performance. However, the above is therefore limited to the fact that the book and drawings are contained in the knowledge of the present invention. In order to truly achieve an invention that is different, for the application, I hope to examine the thoughts' If a clear person should make an exhaustive effort, etc. The base 'receiving heat source' makes the dispersion better. The base of the circuitous circuit does not need to be reduced by wind. The invention is only for the purpose of the invention. The present invention achieves its function completely in accordance with the requirements of the bureau. It is used for cold-type heat dissipation devices. …. When the device is used, in order to achieve the following effects, there are heat sinks and heat exchange devices, and it has the effect of rapid discharge. Take :::] Liquid and gas cooling at the same time, the device has multiple cooling effects, cooling and cooling: In order to use the fan to blow the cooling liquid directly, the water flow ^ wind flow does not need to pass through the dense heat sink fins or aluminum tubes or The heat conduction resistance, water resistance and heat resistance between the copper tube and the heat dissipation fins, and the better heat dissipation function is only a description of the preferred embodiment of the present invention. The scope of non-patent is that it is easy to use the present invention. Modifications and structural changes should be shared with Chen Ming within the scope of the package and patent. The above-mentioned liquid and air-cooled heat sinks are used for the time limit and purpose of use. Therefore, the present invention has become a practicable application for the invention patent, and the case is proposed according to law to protect the inventor's hard research and development committee from any suspicion. Thank you for your kind instructions.

Page 11 200530789 Simple illustration of the drawing [Simple illustration] The first drawing is a three-dimensional appearance of the present invention. The second figure is an exploded perspective view of the present invention. The third figure is a side sectional view of the present invention. The fourth figure is a three-dimensional appearance view of a preferred embodiment of the present invention. The fifth figure is a perspective view of a conventional CPU heat sink. The sixth figure is a perspective view of a conventional water-cooled heat sink. [Description of component symbols] 1. Base 1 1. Receiving part 2. Base 2 1 2. Top cover 2 1 1. Content room 2 1. 2. Limiting part 2 1 3. Fixing part 2. 1 3. 1. Locking component 3, heat sink 3 1, heat sink fin 1 1 1, fixing groove 2 1 4, ventilation hole 2 2, accommodating space 2 2 1, holding member 2 2 2, liquid outlet hole 2 2 3, positioning portion 3 2 Floating carrier

Page 12 4.Heat exchange device

Page 13 200530789_ Schematic description

Claims (1)

200530789 VI. Scope of patent application 1. A liquid and air-cooled heat dissipation device. The cooling liquid is generated by a fan — θ :, the internal heat input can be input. If the effect is achieved, the heat dissipation device is It consists of a base, a fan that disperses the heat, and other components. Among them, ",, the sheet, the base, and the wind. The interior of the base has an accommodation space; the heat sink is placed in the accommodation space of the base. The seat body is a heat-dissipating accommodating groove placed in the accommodating space of the base, and a wind generator is installed in the accommodating groove, and the cooling liquid in the pedestal of the seat overflows, and is directly sprinkled on the ^ sheet, The cooling liquid gathers in the accommodating space to form a 1 :: fin surface, which is then blown or sucked by a fan to horizontally dissipate the cooling liquid, fins, and multiple heat dissipation effects of the horizontal heat dissipation and cooling device. The 2 is provided with a supporting member as a ring in the liquid and air-cooled 3 space described in the item of the scope of the patent application. When the cymbal is placed in the accommodating space of the base, it can bear against the supporting member. ', , 4 Liquid, gas as described in item 范围 of the scope of patent application The base is "receiving space β, and the heat sink is provided with a floating body, so as to ensure that the heat sink, the base and the fan can float on the water surface. As described in the first patent application, the liquid, Air-cooled heat sink wherein the receiving grooves of the seat body are provided with a plurality of through holes. 6 The liquid and air-cooled heat sink device described in item 4 of the scope of the patent application, wherein the receiving grooves are directed from the plurality of through holes. The extension is provided with a plurality of guide pillars. As the liquid and air-cooled heat dissipation device described in item 1 of the scope of patent application, 7 8 200530789 A fan is arranged in the receiving groove of the base. The inner part has a shaft seat, and the seat is available for pivoting. For example, the base can be transparent. The base can be transparent, and the air-cooled heat dissipation device can be used. The soil is transparent. Or a translucent liquid, air-cooled heat sink. The cooling liquid is produced by the fan. The heat dissipation device can input heavy heat dissipation & the heat dissipation device includes a base speed: a lot of government heat and a heat exchange device; of which: _ earth seat, heat sink. The base is A receiving part is provided; the base is an accommodating part fixed to the base, and there are f rooms inside the base, ^ a liquid outlet hole is extended from the receiving space, and a top cover is provided on the base. The inside of the cover is provided with a content chamber and a vent hole; "", the heat sink is disposed in the accommodation space of the base; the heat exchange device is also disposed in the accommodation space of the base and located above the heat sink. There is a fan and a storage tank. When the cooling liquid is added to the storage ^, even if the cooling liquid overflows from the storage tank, 2 directly sprinkle on the fins of the heat sink, and the cooling liquid collects in the storage space. And form a horizontal heat dissipation surface, and then blow or suck the accommodating space inside the base with a fan, so as to exchange heat with the cooling liquid, the heat sink and the horizontal heat dissipation surface, so as to achieve the multiple heat dissipation effects of the heat dissipation device. As described in item 8 of the scope of patent application An air-cooled heat-dissipating device, wherein the receiving portion of the base is provided with a fixing groove on one side. 10. The liquid-air-cooling-type heat dissipating device described in item 8 of the patent application scope, wherein the capacity of the base is The inner wall of the space is provided with a resisting member 200530789 VI. _Please Patent Scope 2 3 The liquid and air-cooled heat sink as described in item 8 of the Lee Scope. The base of the eight-headed cymbal is provided with a plurality of positioning parts on the outer edge. For example: The liquid and air-cooled heat dissipation device described in item 8 of the patent scope, such as the bottom f and the base, can be made integrally. : Liquid and air-cooled heat dissipation device described in Item 8 of Lishuiwei, and the base and base can be fixed together by welding Η 4 = Liquid and air-cooled heat dissipation device described in Item 8 of the patent scope The base and the base of the eighth middle can be locked and integrated into one. ○ 1 5. For example, the liquid and air-cooled heat dissipation device described in item 8 of the patent scope, and the base and base can be used. The riveting method is riveted into a whole 16 7 8 19 The liquid and air-cooled heat dissipation device described in item 8 of the scope of the patent application, in which the 4 heat-replacement system includes a base and a cover. For example, the liquid and air-cooled heat-dissipating device described in item 16 of the scope of the patent application, wherein the base body has a receiving groove, and a plurality of through holes are arranged at the bottom of the receiving groove, and the through holes are respectively arranged between the through holes. A guide post is extended at the bottom of the seat body; and a plurality of locking seats and shaft seats are provided inside the accommodation groove. The liquid and air-cooled heat-dissipation device described in item 17 of the scope of the patent application, wherein a fan can be installed in the shaft seat of the valley groove. The liquid and air-cooled heat sink according to item 8 of the scope of the patent application, wherein the top cover is provided with a limiting portion on one side. Page 16